• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.358-358
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• 2010

Ion beam bombardment at low energy forms nanosize patterns such as ripples, dots or wrinkles on the surface of polymers in ambient temperature and pressure. It has been known that the ion beam can alter the polymer surface that induces skins stiffer or the density higher by higher compressive stress or strain energies associated with chain scissions and crosslinks of the polymer. Atomic scale structure evolution in polymers is essential to understand a stress generation mechanism during the ion beam bombardment, which governs the nanoscale surface structure evolution. In this work, Molecular Dynamics (MD) simulations are employed to characterize the phenomenon occurred in bombardment between the ion beam and polymers that forms nanosize patterns. We investigate the structure evolution of Low Density Polyethylene (LDPE) at 300 K as the polymer is bombarded with Argon ions having various kinetic energies ranging from 100 eV to 1 KeV with 50 eV intervals having the fluence of $1.45\;{\times}\;1014 #/cm2$. These simulations use the Reactive Force Field (ReaxFF), which can mimic chemical covalent bonds and includes van der Waals potentials for describing the intermolecular interactions. The results show the details of the structural evolution of LDPE by the low energy Ar ion bombardment. Analyses through kinetic and potential energy, number of crosslinks and chain scissions, level of local densification and motions of atoms support that the residual strain energies on the surface is strongly associated with the number of crosslinks or scissored chains. Also, we could find an optimal Ar ion beam energy to make crosslinks well.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.130-135
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• 2023

Plasma-resistant ceramic (PRC) is a material used to prevent internal damage in plasma processing equipment for semiconductors and displays. The challenge is to suppress particles falling off from damaged surfaces and increase retention time in order to improve productivity and introduce the latest miniaturization process. Here, we confirmed the effect of suppressing plasma deterioration and reducing the etch rate through surface treatment of existing PRC with an initial illumination level of 200 nm. In particular, quartz glass showed a decrease in etch rate of up to 10%. Furthermore, it is believed that micro-scale secondary particles formed on the microstructure of each material grow as crystals during the fluoridation process. This is a factor that can act as a killer defect when dropped, and is an essential consideration when analyzing plasma resistance. The plasma etching suppression effect of the initial illumination is thought to be due to partial over etching at the dihedral angle of the material due to the sputtering of re-emission of Ar+-based cations. This means that plasma damage due to densification can also be interpreted in existing PRC studies. The research results are significant in that they present surface treatment conditions that can be directly applied to existing PRC for mass production and a new perspective to analyze plasma resistance in addition to simple etching rates.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.6
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• pp.554-559
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• 2005

Ni/Cr thin film is very interesting material as thin film resistors, filaments, and humidity sensors because their relatively large resistivity, more resistant to oxidation and a low temperature coefficient of resistance (TCR). These interesting properties of Ni/Cr thin films are dependent upon the preparation conditions including the deposition environment and subsequent annealing treatments. Ni/Cr thin films of 250 nm were deposited by DC magnetron sputtering on $Al_2O_3/Si$ substrate with 2-inch Ni/Cr (80/20) alloy target at room temperature for 45 minutes. Annealing treatments were performed at $400^{\circ}C,\;500^{\circ}C,\;and\;600^{\circ}C$ for 6 hours in air or $H_2$ ambient, respectively. The clear crystal boundaries without crystal growth and the densification were accomplished when the pores were disappeared in air ambient. Most of surface was oxidic including NiO, $Ni_2O_3$ and $Cr_xO_y$(x=1,2, y=2,3) after annealing in air ambient. The crystal growth in $H_2$ ambient was formed and stabilized by combination with each other due to the suppression of oxidized substance on film surface. Most oxidic Ni was restored when the oxidic Cr was present due to its stability in high-temperature $H_2$ ambient.

• Journal of the Korean Geosynthetics Society
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• v.16 no.2
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• pp.67-77
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• 2017

This study analyzes behavior of bearing capacity of open-ended pipe pile from laboratory experiment results. Unlike the conventional pipe piles, cone penetration is implemented into the inside of the pipe pile. During the cone penetration, cone driving energy helps densification of plugged soils and soils below the pile end. Sand pluviator was used to obtain homogeneous soil layers. Two kinds of piles with different pile outer surface roughness were prepared, and two different drop heights of pile driving were applied. Eight experimental cases varying pile outer surface roughness, pile driving energy for conventional and cone penetration implemented piles were conducted. From the experiments, ultimate load of the pile increased approximately by 70% for increased pile driving height, and it increased by 21% for rougher surface pile. When cone penetration is implemented, the ultimate load increased by 40% in average.

• Journal of Korea Foundry Society
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• v.25 no.4
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• pp.168-172
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• 2005

In this study, the effects of chill layers occurred in shot sleeve on the molten metal filling were analyzed through computer simulation and the behavior of chill layers with temperature variation of shot sleeve set from 200 to $280^{\circ}C$ was also investigated. The simulation results showed the chill layers set in the in-gates during the injection process change the main filling direction and cause turbulent flow pattern, resulting in porosities inside the castings. The amount of chill layers with the increasing temperature of shot sleeve was considerably reduced. And particularly, at the setting temperature of $280^{\circ}C$ by heat control unit, the big reduction in chill layers, excellent trimmed surface and the highest densification were achieved, suggesting that as the optimal sleeve condition in diecasting, especially for the highly complex parts like valve body.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 2000.06a
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• pp.1-33
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• 2000

Silicon carbide ceramics with sintering additives from the system AlN-Y$_2$O$_3$ can be gas-pressure sintered to theoretical density. While commonly a combination of sesquioxides is used such as Al$_2$O$_3$-Y$_2$O$_3$, the oxynitrid additives offer the advantage that only a nitrogen atmosphere is require instead of a powder. By starting form a mixture of ${\beta}$-SiC and ${\alpha}$-SiC, and by performing dedicated heat treatments after densification, anisotropic grain growth is obtained which leads to a platelet microstructure showing enhance fracture toughness. In the present work, recent improvement of the mechanical behaviour of these materials at ambient and high temperatures is reported. By means of a surface oxidation treatment in air it is possible to obtain four-point bending strengths in excess of 1 GPa, and the strength retention at high temperatures is significantly improved.

• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.337-341
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• 2012

Mechanochemical processing (MCP) involves several high-energy collisions of powder particles with the milling media and results in the increased reactivity/sinterability of powder. The present paper shows results of mechanochemical processing (MCP) of silicon nitride powder mixture with the relevant sintering additives. The effects of MCP were studied by structural changes of powder particles themselves as well as by the resulting sintering/densification ability. It has been found that MCP significantly enhances reactivity and sinterability of the resultant material: silicon nitride ceramics could be pressureless sintered at $1500^{\circ}C$. Nevertheless, a degree of a silicon nitride crystal lattice and powder particle destruction (amorphization) as detected by XRD studies, is limited by the specific threshold. If that value is crossed then particle's surface damage effects are prevailing thus severe evaporation overdominates mass transport at elevated temperature. It is discussed that the cross-solid interaction between particles of various chemical composition, triggered by many different factors during mechanochemical processing, including a short-range diffusion in silicon nitride particles after collisions with other types of particles plays more important role in enhanced reactivity of tested compositions than amorphization of the crystal lattice itself. Controlled deagglomeration of $Si_3N_4$ particles during the course of high-energy milling was also considered.

• Journal of the Korean Ceramic Society
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• v.51 no.5
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• pp.453-458
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• 2014

SiC and its composites have been considered for use as nuclear fuel cladding materials of pressurized light water reactors. In this study, a $SiC_f$/SiC composite as a constituent layer of SiC triplex fuel cladding was fabricated using a chemical vapor infiltration (CVI) process in which tubular SiC fiber preforms were prepared using a filament winding method. To enhance the matrix density of the composite layer, winding patterns, deposition temperature, and gas input ratio were controlled. Fiber arrangement and porosity were the main parameters influencing densification behaviors. Final density of the composites decreased as the SiC fiber volume fraction increased. The CVI process was optimized to densify the tubular preforms with high fiber volume fraction at a high $H_2$/MTS ratio of 20 at $1000^{\circ}C$; in this process, surface canning of the composites was effectively retarded.

• Journal of the Korean Ceramic Society
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• v.53 no.3
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• pp.362-366
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• 2016

In this study, humidity control ceramics with good adsorption/desorption capabilities and high strength were fabricated from drinking-water treatment sludge (DWTS) and Onggi soil. The DWTS powder heat-treated at $800^{\circ}C$ and Onggi soil were mixed at weight ratios of 40:60, 50:50, 60:40, and 70:30 and fired at $800-1000^{\circ}C$. With increasing DWTS content, density and flexural strength increased. For the sample with a DWTS:Onggi soil weight ratio of 70:30, porosity and specific surface area decreased with increasing firing temperature, attributed to densification and grain growth at high firing temperatures. From the results obtained, a firing temperature of $800^{\circ}C$ is the optimum condition for fabricating humidity control ceramics with good adsorption/desorption capabilities and strength. The maximum adsorbed amount for the sample fired at $800^{\circ}C$ was $439g/m^2$.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.540-543
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• 2004

The stress of MgO thin film, which is used as a dielectric protective layer in AC-PDP, was measured by a laser scanning method. MgO films were deposited bye-beam evaporation on glass substrates with dielectrics layer on them in various deposition temperatures ranging from room temperature to 300 $^{\circ}C$. The compressive stress of MgO films was increased with increasing substrate temperature due to intrinsic stress accumulation, causing the densification of the films. Both firing voltage ($V_f$) and sustaining voltage ($V_s$) were reduced for the higher compressively stressed and densified films. In the other hand, another film properties such as preferred crystallographic orientation and surface roughness seemed not to influence the discharge characteristics of $V_f$ and $V_s$ significantly.