• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.188-188
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Meta Oxide Semiconductor) based electronic devices, the electronic devices, become much faster and smaller size that are promising property of semiconductor market. However, very narrow interconnect line width has some disadvantages. Deposition of conformal and thin barrier is not easy. And metallization process needs deposition of diffusion barrier and glue layer for EP/ELP deposition. Thus, there is not enough space for copper filling process. In order to get over these negative effects, simple process of copper metallization is important. In this study, Cu-V alloy layer was deposited using of DC/RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane SiO2/Si bi-layer substrate with smooth surface. Cu-V film's thickness was about 50 nm. Cu-V alloy film deposited at $150^{\circ}C$. XRD, AFM, Hall measurement system, and AES were used to analyze this work. For the barrier formation, annealing temperature was 300, 400, $500^{\circ}C$ (1 hour). Barrier thermal stability was tested by I-V(leakage current) and XRD analysis after 300, 500, $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However vanadium-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Therefore thermal stability of vanadium-based diffusion barrier is desirable for copper interconnection.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.552-552
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• 2013

In our study we consider Al2O3 ceramic substrates for Plasma Surface Treatments in order to improve deposited diamond surface and increase diamond deposition rate by applying DBD (Dielectric Barrier Dischrge) system. Because Plasma Surface Treatments was used as a modification method of material surface properties like surface free energy, wettability, and adhesion. By applying Plasma Surface Treatments diamond films are deposited on the Al2O3 ceramic substrates. DC Arc Plasmatron with mathane and hydrogen gases is used. Deposited diamond films are investigated by SEM (Scanning Electron Microscopy), AFM (Atomic Force Microscopy) and XRD (X-ray Diffractometer). Then the C-H stretching of synthetic diamond films by FTIR (Fourier Transform Infrared Spectroscopy) is studied. As a result, nanocrystalline diamond films were identified by using SEM and diamond properties in XRD peaks at (111, $43.8{\Box}$, (220, $75.3{\Box}$ and (311, $90.4{\Box}$ were shown. Absorption peaks in FTIR spectrum, caused by CHx sp3 bond stretching of CVD diamond films, were identified as well. Finally, we improved such parameters as depostion rate ($2.3{\mu}m$/h), diamond surface uniformity, and impurities level by applying Plasma Surface Treatments. These experimental results show the importance of Plasma Surface Treatments for diamond deposition by a plasma source.

• Journal of the Korean institute of surface engineering
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• v.47 no.4
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• pp.162-167
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• 2014

The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle's salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studied in crystal structural point of view.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.11a
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• pp.31-31
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• 1998

• Composites Research
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• v.33 no.3
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• pp.147-152
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• 2020

In this study, void behavior of composite laminate by local internal pressure gradient due to structural geometry and surface film application condition was experimentally evaluated through fabrication of spar/skin integrated structure specimens. Viscosity comparison and thermal analysis for both carbon fiber prepreg and surface film were conducted and cure characteristic and rate difference were analyzed. 2 types of spar/skin integrated structural specimens were prepared based on different application condition of surface film. Subsequently, those specimens were evaluated through visual surface inspection, non-destructive and destructive inspection. In a specimen #1 with full application of surface film, low pressurized area of composite laminate created by pressure gradient of structural geometry had voids. It exhibited that voids could not be evacuated and were locked in cured laminate by the influence of pre-cured surface film with relatively faster cure rate. In a specimen #2 without surface film, it revealed that all internal voids disappeared in the cured laminate. Therefore, it is verified that surface film acts as barrier film preventing void movement and evacuation during autoclave cure.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.823-827
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• 2005

Barrier ribs in the plasma display panel (PDP) function to maintain the discharge space between the glass plates as well as to prevent optical crosstalk. Patterning of barrier ribs is one of unique processes for making PDP. Barrier ribs could be formed by screen-printing, sand blasting, etching, and photolithographic process. In this work photosensitive barrier rib pastes were prepared by incorporating binder polymer, solvent, functional monomers photoinitiator, and barrier rib powder of which surface was treated with fumed silica particles. Studies on the function of materials for the barrier rib paste were undertaken. After optimization of paste formulation and photolithographic process, it was applied to the photosensitive barrier rib green sheet and was found that photolithographic patterning of barrier ribs could be formed with good resolution up to $110{\mu}m$ height and $60{\mu}m$ width after sintering.

• Proceedings of the Korean Vacuum Society Conference
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• 2001.07a
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• pp.97-98
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• 2001

• 전기의세계
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• v.19 no.2
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• pp.1-5
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• 1970

According to the previous studies which was done by the author, the flashover voltage was found to be increased considerably if some metallic barriere are inserted into the flashover discharge path. This paper shows that the flashover voltage in suspension insulators and bushings is raised up by the application of metallic barrier effect on surface discharge. Using moderate metallic barrier configulation the flash over voltage can be raised up by the amount of about 15% compared to that of the convensional type of suspension insulatiors and bushings.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.1-2
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• 2007

플렉서블 능동구동형 유기전계발광(Flexible AMOLED) 디스플레이 개발에 있어 핵심기술이라 할 수 있는 high barrier 특성을 갖는 고분자 기판, 능동구동 소자 및 flexible OLED 제작 기술에 대한 연구를 수행하였다. Polyacryl/SiON 복합층을 사용하여 OLED에 적합한 barrier 특성(투습율 : $10^{-5}\;{\sim}\;10^{-6}\;g/m^2-day$)을 가진 고분자 기판을 개발하였으며 이와 더불어 ULTPS TFT, OTFT 및 flexible OLED 소자를 구현하였다.

• Journal of electromagnetic engineering and science
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• v.18 no.1
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• pp.52-57
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• 2018

Surface dielectric barrier discharge (SDBD), which is widely used to control turbulence in aerodynamics, has a significant effect on the radar cross-section (RCS). A four-way linearly synthesized SDBD air plasma actuator is designed to bolster the plasma effects on electromagnetic waves. The diffraction angle is calculated to predict the RCS because of the periodic structure of staggered electrodes. The simplified plasma modeling is utilized to calculate the inhomogeneous surface plasma distribution. Monostatic RCS shows the diffraction in the plane perpendicular to the electrode array and the notable distortion by plasma. In comparison, the overall pattern is maintained in the parallel plane with minor plasma effects. The trends also appear in the bistatic RCS, which has a significant difference in the observation plane perpendicular to the electrodes. The peaks by Bragg's diffraction are shown, and the RCS is reduced by 10 dB in a certain range by the plasma effect. The diffraction caused by the actuator and the inhomogeneous air plasma should be considered in designing an SDBD actuator for a wide range of application.