• Journal of Microbiology and Biotechnology
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• v.4 no.3
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• pp.222-229
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• 1994

In order to develop a method of economical production and to reduce energy-consumption in fuel alcohol production, we investigated the fermentation characters of two newly selected thermotolerant yeasts. The RA-74-2 showed stable and superior fermentability between 30 and $40^{\circ}C$ in 20% glucose media in comparison to the industrial strains. The optimum concentration of glucose for economical fermentation at $40^{\circ}C$ was 15-18%, and organic nitrogen was necessary for a satisfactory fermentation. The optimum pH was 4.0 and aeration was adversed for high temperature fermentation. Agitation was an important factor at $40^{\circ}C$ and the addition of magnesium ion 0.2% was required in this experiment. When the inoculum was increased, ethanol productivity as well as the speed of fermentation increased. On the other hand RA-912, which can grow at $48^{\circ}C$, showed similar fermentability between 30-$45^{\circ}C$ in 20% glucose media As the concentration of substrate decreased, fermentation ratio increased at $45^{\circ}C$ (45%, 65%, 95% fermentation ratio in 20%, 15%, 10% glucose media, respectively). Also, requirement of organic nitrogen and magnesium ion in RA-912 was similar in RA-74-2. The optimum pH for fermentation was 5.0, and the effects of agitation were enhanced at $37^{\circ}C$ than at $45^{\circ}C$. As the inoculum was increased, fermentation speed became more enhanced but the ethanol productivity was less affected. RA-912 showed fermentability with various substrates. Among the substrates used, inulin was the most promising substrate for the high-temperature fermentation. When 14.5% inulin was used as the substrate, 93% and 55% fermentation ratios were shown at $37^{\circ}C$ and $45^{\circ}C$, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.478-480
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• 2001

Fe-base amorphous films exhibit large saturation magnetostriction and soft magnetic Properties, which make them suitable for strain sensor applications. Most important material properties for the performance of these elements are the superior soft magnetic properties, such as high permeability and small coercive force, as well as magnetoelastic properties. It is well known that the strain generated in film deposition and/or post-heat treatment processes is one of important material properties, which effects on the soft magnetic properties of the film via magnetoelastic coupling. In this study, the effect of an isotropic strain in plane of magnetic films have been performed experimently. Amorphous films with the composition of (F $e_{90}$ $Co_{10}$)$_{78}$S $i_{l2}$ $B_{10}$ were employed in this study. The film with 5${\mu}{\textrm}{m}$ thick was deposed onto the polyimide substrate with 50${\mu}{\textrm}{m}$ thick by virtue of RF sputtering. The film was subject to post annealing with a static magnetic field with 500Oe magnetic field intensity at 35$0^{\circ}C$ for 1 hour. The polyimide substrate with the film was bonded with an adhesive on PZT piezoelectric substrate with 600${\mu}{\textrm}{m}$ thick in applying voltage of 500V. The change in MH loops of films due to the isotropic strain was measured by using VSM. The coercive force was evaluated from MH loops. It has shown in the results that M-H loops of films are subject to change considerably with a dc voltage, resulting of the magnetization rotation from normal to plane direction as the applied voltage is changed from 500V to 250V.50V.V.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.4
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• pp.327-329
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• 2005

Pb(Zr/sub 0.52/Ti/sub 0.48/)O₃(PZT) thin films were deposited by using a pulsed laser deposition method on a Pt/Ti/SiO₂/Si substrate with (Pb/sub 0.72/La/sub 0.28/)Ti/sub 0.93/O₃ (PLT) buffer and on a Pt/Ti/SiO₂/Si substrate without buffer. These films were annealed in H₂-contained ambient for 30 minutes at the substrate temperature of 400。C to evaluate the forming gas annealing effects. The comparative studies on the ferroelectric properties of these two films were carried out, which are shown that ferroelectric properties, such as remanent polarization didn't change in the case of PLT buffered PZT film while remanent polarization value of PZT film degraded from 20.8 C/㎠ to 7.3 C/㎠. The leakage current became higher in both cases, but that of the more-oriented PZT film had the moderate value of the 10/sup -6/ order of A/㎠. This is mainly because the hydrogen atoms which make the degradation of PZT films cannot infiltrate into the more -oriented PZT film as well as the less-oriented PZT film.

• Transactions of Materials Processing
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• v.29 no.2
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• pp.103-112
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• 2020

This study explores the effects of different pre-machining conditions on the deposition characteristics and mechanical properties of austenitic stainless steel samples repaired using direct energy deposition (DED). In the DED repair process, defects such as pores and cracks can occur at the interface between the substrate and deposited material. In this study, we varied the shape of the pre-machined zone for repair in order to prevent cracks from occurring at the slope surface. After repairs by the DED process, macro-scale cracks were observed in samples that had been pre-machined with elliptic and trapezoidal grooves. In addition, it was not possible to completely prevent micro-crack generation on the sloped interfaces, even in the capsule-type grooved sample. From observation of the fracture surfaces, it was found that the cracks around the inclined interface were due to a lack of fusion between the substrate and the powder material, which led to low tensile properties. The specimen with the capsule-type groove provided the highest tensile strength and elongation (respective of 46% and 571% compared to the trapezoidal grooved specimen). However, the tensile properties were degraded compared to the non-repaired specimen (as-hot rolled material). The fracture characteristics of the repaired specimens were determined by the cracks at the sloped interfaces. These cracks grew and coalesced with each other to form macro-cracks, they then coalesced with other cracks and propagated to the substrate, causing final fracture.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.43-48
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• 2011

Electroless nickel platings on carbon substrate were investigated for porous MCFC electrode applications. Acidic bath and alkaline bath were used in electroless nickel plating on carbon substrates. The rate of electroless plating in alkaline bath was faster than that in acidic bath. As pH was increased, the deposition rate was increased in both baths and the content of phosphorus in nickel deposit was decreased. The residual stresses of nickel deposit from acidic bath showed the compressive stress and on the other hand those from alkaline bath showed the high tensile stress. High tensile internal stress in nickel deposit caused the cracks over pH 11. Thiourea was added to both acidic and alkaline bath. The deposition rate of nickel was increased upto 0.5 ppm of thiourea and decreased. The maximum concentration of thiourea for the electroless nickel plating on carbon substrate was 1.5 ppm in both acidic and alkaline bath. Succinic acid was added to acidic bath. Addition of succinic acid up to 5 g/L increased the deposition rate of nickel and beyond which the deposition rate was decreased and maintained.

• Journal of the Korean Ceramic Society
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• v.40 no.2
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• pp.198-205
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• 2003

$Ba_{0.66}Sr_{0.34}TiO_3$ thin films and seed-layers were deposited on $Pt/Ti/SiO_2/Si$substrate by R.F. magnetron sputtering method. Effects of various substrate temperature conditions on electrical properties (such as capacitance and leakage current) of BST thin films were studied. The effect of seed-layer was also studied. When seed-layer was inserted between BST and Pt, the crystallization of the BST thin films was considerably improved and the processing temperature was lowered. Compared to the pure BST thin films, dielectric constant, dielectric loss, and leakage current of BST thin films deposited on the seed-layer were considerably improved. It could be revealed that electrical properties are influenced by the substrate temperatures of BST thin films and are enhanced by the seed-layer.

• Journal of Electrochemical Science and Technology
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• v.8 no.3
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• pp.206-214
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• 2017

SnS films have been prepared by electrodeposition technique onto Cu and ITO substrates using acidic solutions containing tin chloride and sodium thiosulfate with sodium citrate as an additive. The effects of sodium citrate on the electrochemical behavior of electrolyte bath containing tin chloride and sodium thiosulfate were investigated by cyclic voltammetry and chronoamperometry techniques. Deposited films were characterized by XRD, FTIR, SEM, optical, photoelectrochemical, and electrical measurements. XRD data showed that deposited SnS with sodium citrate on both substrates were polycrystalline with orthorhombic structures and preferential orientations along (111) directions. However, SnS films with sodium citrate on Cu substrate exhibited a good crystalline structure if compared with that deposited on ITO substrates. FTIR results confirmed the presence of SnS films at peaks 1384 and $560cm^{-1}$. SEM images revealed that SnS with sodium citrate on Cu substrate are well covered with a smooth and uniform surface morphology than deposited on ITO substrate. The direct band gap of the films is about 1.3 eV. p-type semiconductor conduction of SnS was confirmed by photoelectrochemical and Hall Effect measurements. Electrical properties of SnS films showed a low electrical resistivity of $30{\Omega}cm$, carrier concentration of $2.6{\times}10^{15}cm^{-3}$ and mobility of $80cm^2V^{-1}s^{-1}$.

• Journal of Bio-Environment Control
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• v.15 no.4
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• pp.317-321
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• 2006

The experiment has investigated the effects of growth, yield, and fruit quality of strawberries by three different kinds of substrates. Commonly used media cocopeat, cocopeat mixed with rice hulls and compound nursery media were used to select a proper medium by comparing growth status, yield and fruit quality. Number of leaves was most in cocopeat substrate, and leaf length and leaf width were highest in compound nursery media. Fruit weight was heaviest in compound nursery media, but there were no significant statistical differences in fruit length, fruit width and soluble solids of fruit. Number of fruits per plant was much in compound nursery media and cocopeat than cocopeat mixed with rice hulls. The most yield per plant was in compound nursery media and the least it was in cocopeat mixed with rice hulls. The results of this experiment will be utilized in the new substrate application for strawberry hydroponics.

• The Plant Pathology Journal
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• v.33 no.3
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• pp.264-275
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• 2017

The spent mushroom substrate (SMS) of Lentinula edodes that was derived from sawdust bag cultivation was used as materials for controlling Phytophthora blight disease of pepper. Water extract from SMS (WESMS) of L. edodes inhibited mycelial growth of Phytophthora capsici, suppressed Phytophthora blight disease of pepper seedlings by 65% and promoted growth of the plant over 30%. In high performance liquid chromatography (HPLC) analysis, oxalic acid was detected as the main organic acid compound in WESMS and inhibited the fungal mycelium at a minimum concentration of 200 mg/l. In quantitative real-time PCR, the transcriptional expression of CaBPR1 (PR protein 1), CaBGLU (${\beta}$-1,3-glucanase), CaPR-4 (PR protein 4), and CaPR-10 (PR protein 10) were significantly enhanced on WESMS and DL-${\beta}$-aminobutyric acid (BABA) treated pepper leaves. In addition, the salicylic acid content was also increased 4 to 6 folds in the WESMS and BABA treated pepper leaves compared to water treated leaf sample. These findings suggest that WESMS of L. edodes suppress Phytophthora blight disease of pepper through multiple effects including antifungal activity, plant growth promotion, and defense gene induction.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.1-10
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion (i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) were healed by the UV laser beam transmitted through the glass substrate. The lather energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, and formed a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.