• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.613-617
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• 2000

This paper descries the effect of the stylus tip size on the measuring error in surface topography measurement. To analyze the distortional effect of an actual surface geometry originating from the finite stylus size, the surface is modeled as a sinusoid and the stylus tip as a circle. the measuring error is defined as the ratio of the standard deviation of a tracing profile and an original profile. It is shown that this measuring error depends on the amplitude and wavelength of an original profile. In this paper, the spectrum analysis is applied to investigate the distortional effect due to the mechanical filtering of the stylus in the frequency domain. and, the cumulative power spectrum is applied to determinate the minimum wavelength limits to be measured with the various stylus tip radius from these results, a new method to select proper stylus tip radius is proposed.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.12
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• pp.174-181
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• 1999

This paper describes the effect of the stylus tip size on the shape error in surface topography measurement. To analyze the distortional effect of an actual surface geometry origination from the finite stylus size, the surface is modeled as a sinusoid and the stylus tip as a circle. The magnitude of this distortion is defined as the ration of standard deviation, and this is expressed as an analytic function of the stylus tip radius and the geometrical parameter of a sinusoid. In this paper, the spectrum analysis of the profile is applied to investigate the distortional effect due to the mechanical filtering of the stylus in the frequency domain. and, the cumulative power spectrum is proposed to assess the shape error of measured data according to the various stylus tip sizes. From these results, a new method to select proper stylus tip radius is proposed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.1
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• pp.126-134
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• 1999

In this paper, a new error compensating technique for form-error compensation of rough-surface profile obtained by contact stylus profilometer is proposed. By the method, the real contact points of rough-surface and diamond stylus can be estimated and the measured profile data corrected. To verify the compensation effect, the properties(Ra, RMS, Kurtosis, Skewness) of measured profile data and compensated data were compared. And, the cumulative RMS slope was proposed to assess the compensated effect of upper area of profile. The results show that the measuring error could be compensated very well in amplitude parameters and in proposed cumulative RMS slope by the developed form-error compensating technique.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.5 no.4
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• pp.108-120
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• 1996

A new technique and theory are proposed which correct orientation of a cylinder to perform a reliable measurement of the surface profile. We analyze characteristics of machined surfaces, e.g., ground, lapped and turned surfaces. Based upon the results. the optimum correction technique is derived by the statistical method. To verify the techinques, measurements are carried out by using the contact stylus profilometer on a controllable table. The measurement shows that surface information of cylinders can be acquired with high accuracy.

• Journal of the Optical Society of Korea
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• v.5 no.2
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• pp.60-66
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• 2001

The authors discuss a prototype stylus profilometer designed to measure large optics. It consists of a low contact force type probe system, laser reference system, interferometric distance measurement system, and horizontal driving system. The probe contacts the surface ; the height and the horizontal distances of the measurement points are measured by the interferometer. The freely propagated laser beam provides the reference line during the measurement. The developed stylus profilometry shows only $\pm$60 nm of P-V error for the 157 mm diameter spherical mirror.

• Proceedings of the Korean Vacuum Society Conference
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• 2006.08a
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• pp.99-99
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• 2006

• Proceedings of the Optical Society of Korea Conference
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• 2007.07a
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• pp.201-202
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• 2007

• Proceedings of the Optical Society of Korea Conference
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• 2001.02a
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• pp.94-95
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• 2001

본 논문에서는 큰 광학면을 Profilometry로 측정하는데 있어서 꼭 필요한 기준계로 공기 중을 전파해가는 레이저 광선을 이용하는 방법을 논의하였다 Profilometer는 stylus tip이 직접 표면에 접촉하여 높이를 읽어가는 방식으로 이때 기준계는 정확한 높이를 구하는데 아주 중요한 역할을 한다 즉, 높이의 측정은 기준계를 기준 하여 이루어지기 때문에 기준계에서의 오차는 곧바로 높이의 오차로 이어지게 된다. (중략)

• Journal of the Korean Society for Precision Engineering
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• v.17 no.2
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• pp.211-219
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• 2000

This paper simulated surface grinding process with statistically simulated grinding wheel topography, considering ridge formation phenomenon when grain scratch workpiece. Wheel grain is modeled as hybrid sphere and cone. Grinding wheel characteristic was evaluated with stylus by expanding the scanning region of the profilometer from a straight line to a plane. Each grain's diameter and semi-angle are assumed as normal distribution, each grain's protrusion height from wheel plane is assumed gamma distribution. So grinding wheel is simulated with grain's position randomly distributed without overlapping. Ground surface is 3-dimensionally simulated considering ridge formation of workpiece by each grain's cutting, and then surface profile and surface roughness parameters are compared with real ground workpiece.

• Journal of the Korean Vacuum Society
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• v.7 no.4
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• pp.403-409
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• 1998

In this study, the effects of multi-dipole type of magnets on the characteristics of the inductively coupled plasmas and $SiO_2$ etch properties were investigated. As the magnets, 4 pairs of permanent magnets were used and, to etch $SiO_2, C_2F_6, CHF_3, C_4F_8, H_2$, and their combinations were used. The characteristics of the magnetized inductively coupled plasmas were investigated using a Langmuir probe and an optical emission spectrometer, and $SiO_2$ etch rates and the etch selectivity over photoresist were measured using a stylus profilometer. The use of multi-dipole magnets increased the uniformity of the ion density over the substrate location even though no significant increase of ion density was observed with the magnets. The use of the magnets also increased the electron temperature and radical densities while reducing the plasma potential. When $SiO_2$ was etched using the fluorocarbon gases, the significant increase of $SiO_2$ etch rates and also the increase of etch uniformity over the substrate were obtained using the magnets. In case of gas combinations with hydrogen, $C_4F_8/H_2$ showed the highest etch rates and etch selectivities over photoresist among the gas combinations with hydrogen used in the experiment. By optimizing process parameters at 1000 Watts of inductive power with the magnets, the highest $SiO_2$ etch rate of 8000 $\AA$/min could be obtained for 50% $C_4F_8/50% H_2$.