• Bulletin of the Korean Chemical Society
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• 제9권4호
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• pp.213-217
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• 1988

A new paradigm for the viscosity of fluid is presented by considering the fact that the viscosity is equal to the shear stress divided by the shear rate. The shear stress is obtained from the sum of kinetic and internal pressures of fluid, and the shear rate is found from the phonon velocity divided by the mean free path of the phonon. The calculated viscosities for various simple substances are in excellent agreements with those of the observed data through the wide temperature range covered both of liquid and gas phase.

• 대한기계학회논문집
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• 제15권1호
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• pp.201-208
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• 1991

본 연구에서는 균일 열유동이 접합면에 수직으로 흐르고 접합 경계면 균열의 열경계조건이 단열되어 있는 경우에 균질 및 접합재료 모두에 적용될 수 있는 열응세 기계수를 복소해석방법을 이용하여 구하고자 한다.

• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

• 한국작물학회:학술대회논문집
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• 한국작물학회 2017년도 9th Asian Crop Science Association conference
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• pp.202-202
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• 2017

Global climate change resulted in unwarranted change in global temperature and caused heat and cold stress, which are consider major threat to agriculture productivity around the world. The use of plant growth-promoting microbes is an eco-friendly strategy to counteract such stresses and confer tolerance to the plants. In current study, previously isolated endophytic fungi Preussia sp. BSL-10 has been found to produce phytohormones such as IAA and GA and as such, endophyte Preussia sp. BSL-10 found to induced tolerance against heat and cold stress. The results showed that under both heat and cold stress the plant growth parameter such as shoot, root length, shoot fresh weight and root fresh weight is higher in Preussia sp. BSL-10 treated plants as compare to free Preussia sp. BSL-10 control plants. In addition, the stress-sensitive endogenous ABA levels were significantly increased in Preussia sp. BSL-10 host plant. The current result suggest that the phytohormone-producing endophyte Preussia sp. BSL-10 can increase plant resistance toheat and cold stress, in turn improving agricultural productivity.

• 열처리공학회지
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• 제24권3호
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• pp.133-139
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• 2011

This study has been investigated for tensile properties with lead-free brass containing 1 wt.% of Bi. And also characteristic of corrosion resistance was analyzed by polarization test. An increase of tempering temperature was found to tend to decrease tensile strength, and percentage of elongation was shown to be the lowest value at $300^{\circ}C$. On the other hand, the elongation was increased with an increase of tempering temperature after $300^{\circ}C$. The change of mechanical properties was closely related with the content and shape of acicular Witmanst$\ddot{a}$tten ${\alpha}$ formed at the interface of ${\beta}$ phase as well as in ${\beta}$ phase. Tensile strength had a tendency to be decreased with an increase of test temperature. The elongation was shown to be the lowest value at around $300^{\circ}C$, while it began to increase as test temperature rose after $300^{\circ}C$. It might be speculated that the reason that elongation was decreased was found to form bismuth film at the interface of ${\alpha}/{\beta}$ phase leading to be easily brittle when loaded by tensile stress. The lead-free brass containing 1 wt.% of Bi had similar characteristic of corrosion resistance with a free-cutting brass with 3.4 wt. % of Pb in spite of higher fraction of ${\beta}$ phase.

• 한국전기전자재료학회논문지
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• 제19권2호
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• pp.130-138
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• 2006

We have investigated pattern scaling down of silicon stamps through the oxidation technique, During oxidizing the silicon stamps, silicon dioxide that has 300 nm and 500 nm thickness was grown, and critical deformations were not observed in the patterns. There was positive effect to reduce size of patterns because vertical and horizontal patterns have different orientation. We achieved pattern reduction rate of $26\%$. In addition, the formation of polymer patterns had been investigated with varied temperature and pressure conditions to improve the filling characteristics of polymers during nanoimprint lithography when pattern sizes were few micrometers. In these varied conditions, polymers had been affected by free space compensation and elastic stress relaxation for filling the cavities. Based on the results, defect control which is an important issue in the nanoimprint lithography were facilitated.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 춘계학술대회논문집
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• pp.53-56
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• 2003

The disappearance of continuous yielding and the formation of an extended region in engineering stress-strain curves at tempering temperatures of 673-873K is closely related to the reduction of mobile dislocations during tempering and dynamic recovery during tensile deformation. In addition, the occurrence of discontinuous yielding at tempering temperature above 923K would be attributed to the formation of new strain-free polygonal ferrite grain.

• 한국분말재료학회지
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• 제4권2호
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• pp.83-89
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• 1997

A finite element analysis to solve the coupled thermomechanical problem in the plane strain upsetting of the porous metals was performed. The analysis was formulated using the yield function advanced by Lee and kim and developed using the thermo-elasto-plastic time integration procedure. The density and temperature dependent thermal and mechanical properties of porous metals were considered. The internal heat generation by the plastic deformation and the changing thermal boundary conditions corresponding to the geometry were incorporated in the program. The distributions of the stress, strain, pressure, density and temperature were predicted during the free resting period, deformation period and dwelling period of the forging process.

• Corrosion Science and Technology
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• 제14권4호
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• pp.161-165
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• 2015

This paper presents an analysis of thermal stress induced along the interface between a polymeric coating layer and a steel substrate as a result of uniform temperature change. The epoxy layer is assumed to be a linear viscoelastic material and to be theromorheologically simple. The viscoelastic boundary element method is employed to investigate the behavior of interface stresses. The numerical results exhibit relaxation of interface stresses and large stress gradients, which are observed in the vicinity of the free surface. Since the exceedingly large stresses cannot be borne by the polymeric coating layer, local cracking or delamination can occur at the interface corner.

• 비파괴검사학회지
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• 제21권3호
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• pp.261-268
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• 2001

열-음향방출(thermo-AE) 기법을 이용하여 두께 3mm, $[+45_6/-45_6]_s$ 복합재료 적층판의 열응력 유기 손상에 대한 비파괴평가의 유효성을 연구하였다. 반복적인 열부하 사이클에 의해서 thermo-AE 사상수가 감소하는 경향이 뚜렷하게 나타나서 열부하에 따른 카이저효과가 관찰되었다. 열부하사이클중의 thermo-AE거동을 분석하여 복합재료의 응력자유온도를 결정할 수 있었다. 초음파 C스캔, 광학현미경, 주사형 전자현미경을 통해 섬유파단과 모재파손이 관찰되었으며, 이들 파손 인자는 thermo-AE 신호의 단시간 퓨리에 변환처리에 의해 생성된 3종류의 서로 다른 시간-주파수 특성과 대응하였나 이 특성을 이용하여 복합재료의 냉각열처리 및 반복 열부하사이클시의 손상발생과정 및 내부 마찰거동 내역을 추적할 수 있었다.