• ETRI Journal
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• 제34권5호
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• 한국전기전자재료학회논문지
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• 제13권8호
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• pp.718-723
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• 2000

The critical characteristics of Bi-2223 HTS tapes made by PIT method are influenced by the heat treatment and the mechanical processing. In this study firstly we investigated the influence o rolling reduction rate in mechanical process for improving Jc of HTS tapes. As a result the optimized rolling reduction rate that we obtained was 10%-50% and 30%-30% (1st-2nd). And then we fabricated the stacking type HTS tapes that made of the multi-filamentary tapes with various length(3, 5, 10cm) and with various number of stacking (1, 5, 10 layer). Measuring the critical current and observing the structure of grain we concluded that the stacking type tapes will be able to operate more stably by adding the number of stacking tapes. And we could expect that by minimizing the gap between Ag-sheath of tapes mechanical strength of stacking HTS tapes is enhanced and current in tapes will flow more stably.

• 한국전자거래학회지
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• 제25권3호
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• pp.1-13
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• 2020

기계학습(machine learning)이란 주어진 데이터에 대한 일반화 과정으로부터 특정 문제를 해결할 수 있는 모델(model) 생성 기술을 의미한다. 우수한 성능의 모델을 생성하기 위해서는 양질의 학습데이터와 일반화 과정을 위한 학습 알고리즘이 준비되어야 한다. 성능 개선을 위한 한 가지 방법으로서 앙상블(Ensemble) 기법은 단일 모델(single model)을 생성하기보다 다중 모델을 생성하며, 이는 배깅(Bagging), 부스팅(Boosting), 스태킹(Stacking) 학습 기법을 포함한다. 본 논문은 기존 스태킹 기법을 개선한 다중 스태킹 앙상블(Multiple Stacking Ensemble) 학습 기법을 제안한다. 다중 스태킹 앙상블 기법의 학습 구조는 딥러닝 구조와 유사하고 각 레이어가 스태킹 모델의 조합으로 구성되며 계층의 수를 증가시켜 각 계층의 오분류율을 최소화하여 성능을 개선한다. 4가지 유형의 데이터셋을 이용한 실험을 통해 제안 기법이 기존 기법에 비해 분류 성능이 우수함을 보인다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2014년도 추계학술대회 논문집
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• pp.739-742
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• 2014

In the process of MLCC manufacturing, MLCC stacking process is the key process of making high quality MLCC. Since MLCC is small components, the entire process of MLCC stacking process is minute and sensitive to micro errors. To prevent micro error, we suggest condition-based monitoring which quantifies error based on feature extraction and quantifying error method. As results, it has been shown that the suggested algorithm has effectiveness of condition based monitoring of MLCC stacker.

• Computers and Concrete
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• 제32권5호
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• pp.513-525
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• 2023

Recently, research on predicting the behavior of reinforced concrete (RC) columns using machine learning methods has been actively conducted. However, most studies have focused on predicting the ultimate strength of RC columns using a regression algorithm. Therefore, this study develops a successive machine learning process for predicting multiple nonlinear behaviors of rectangular RC columns. This process consists of three stages: single machine learning, bagging ensemble, and stacking ensemble. In the case of strength prediction, sufficient prediction accuracy is confirmed even in the first stage. In the case of displacement, although sufficient accuracy is not achieved in the first and second stages, the stacking ensemble model in the third stage performs better than the machine learning models in the first and second stages. In addition, the performance of the final prediction models is verified by comparing the backbone curves and hysteresis loops obtained from predicted outputs with actual experimental data.

• Communications for Statistical Applications and Methods
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• 제28권3호
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• pp.217-232
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• 2021

The Korea film industry has matured and the number of movie-watching per capita has reached the highest level in the world. Since then, movie industry growth rate is decreasing and even the total sales of movies per year slightly decreased in 2018. The number of moviegoers is the first factor of sales in movie industry and also an important factor influencing additional sales. Thus it is important to predict the number of movie audiences. In this study, we predict the cumulative number of audiences of films using stacking, an ensemble method. Stacking is a kind of ensemble method that combines all the algorithms used in the prediction. We use box office data from Korea Film Council and web comment data from Daum Movie (www.movie.daum.net). This paper describes the process of collecting and preprocessing of explanatory variables and explains regression models used in stacking. Final stacking model outperforms in the prediction of test set in terms of RMSE.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.467-468
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• 2012

• Journal of Welding and Joining
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• 제24권2호
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• 한국기계가공학회지
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• 제10권1호
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• pp.38-46
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• 2011

A study was performed to investigate the dynamic behaviors of fiber-reinforced composite materials subjected to transversely low-velocity impact. For this purpose, the simulation of modified beam finite element based on higher order beam theory for two(isotropic and anisotropic) materials is carried out according to the changes of material property, stacking sequence, geometric dimension and impact velocity of steel ball, etc. Main composite materials for simulation are composed of $[0^{\circ}/90^{\circ}/0^{\circ}/-90^{\circ}/0^{\circ}]_{2s}$, $[0^{\circ}/90^{\circ}/0^{\circ}/-90^{\circ}/0^{\circ}]_s$ and $[0^{\circ}/45^{\circ}/0^{\circ}/-45^{\circ}/0^{\circ}]_{2s}$, $[0^{\circ}/45^{\circ}/0^{\circ}/-45^{\circ}/0^{\circ}]_s$ stacking sequences. The effectiveness of this simulation for qualitative and quantitative evaluations in composite materials subjected to foreign object impact was established.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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• pp.618-623
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• 2000

In order to increase the porductivity of electrical parts, manufacturing processes using progressive dies have been widely used in the industry. Motor cores have been fabricated using progressive stacking die with the lamination procedure for better electro-magnetic property. for the proper design of a process, a prediction of the process is required to obtain many design parameters. In this work, rigid-plastic finite element analysis is carried out in order to simulate the lamination this work, rigid-plastic finite element analysis is carried out in order to simulate the lamination process of the motor core. The effects of the embossing depth and the amount of deviation are investigated and compared with experiments. The forming process can then be predicted successfully from the results of analyses, which enables to design appropriately the die and the process.