• Journal of the Korean Institute of Intelligent Systems
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• v.11 no.4
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• pp.293-301
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• 2001

This paper reviews three methods to compute a pointwise confidence interval of neuro-fuzzy models and compares their estimation perfonnanee through simulations. The eOITl.putation methods under consideration include stacked generalization using cross-validation, predictive error bar in regressive models, and local reliability measure for the networks employing a local representation scheme. These methods implemented on the neuro-fuzzy models are applied to the problems of simple function approximation and chaotic time series prediction. The results of reliability estimation are compared both quantitatively and qualitatively.

• Journal of Korea Multimedia Society
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• v.21 no.8
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• pp.952-959
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• 2018

Clustering is one of the most fundamental algorithms in machine learning. The performance of clustering is affected by the distribution of data, and when there are more data or more dimensions, the performance is degraded. For this reason, we use a stacked auto encoder, one of the deep learning algorithms, to reduce the dimension of data which generate a feature vector that best represents the input data. We use k-means, which is a famous algorithm, as a clustering. Sine the feature vector which reduced dimensions are also multi dimensional, we use the Euclidean distance as well as the cosine similarity to increase the performance which calculating the similarity between the center of the cluster and the data as a vector. A deep clustering networks combining a stacked auto encoder and k-means re-trains the networks when the k-means result changes. When re-training the networks, the loss function of the stacked auto encoder and the loss function of the k-means are combined to improve the performance and the stability of the network. Experiments of benchmark image ad document dataset empirically validated the power of the proposed algorithm.

• Progress in Superconductivity and Cryogenics
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• v.14 no.2
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• pp.16-19
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• 2012

The influence of current distribution on the transport current loss in vertically stacked high-$T_c$ superconductor (HTS) tapes was evaluated. AC loss was analyzed as a function of current distribution by introducing a current distribution parameter through a numerical method (finite element analysis). AC loss under non-uniform current distribution is always higher than that for a uniformly distributed transport current in a conductor. Although the effect of non-uniformity is relatively insignificant in low transport current, AC loss increases substantially in high transport current regions as non-uniformity is enlarged. The results verify that non-uniform current distribution causes extra loss by examining the cross-sectional view of current densities in stacked conductor.

• Progress in Superconductivity
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• v.1 no.1
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• pp.68-72
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• 1999

Since the discovery of high Tc superconductors, great efforts have been focused to develop high performance HTS magnets for the ultimate applications to power system devices. Magnet designers, however, have had difficulties in the estimation of the maximum operating current of the designed magnet from the tested short sample data, due to the degradation of the critical current density in the magnet. Similar story applies to the HTS electrical bus bar. It has been found that the critical current of Bi-2223 stacked tapes is much less than the total summation of critical currents of each tape, which is mainly attributed to the self magnetic fields. Furthermore, since the critical current degradation of Bi-2223 tape is greater in the normal magnetic field (to the tape surface) than in the parallel one, detailed magnetic field configurations are required to reduce the self field effects. In this paper, we calculate the self field effects of a stacked conductor, defining self field factors of normal and parallel magnetic fields to the tape surface. Finally, the critical current degradations in the HTS magnet are explained by the introduced self field factors of the stacked conductor.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.599-602
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• 2002

A novel rapid prototyping (RP) process, an automated transfer type variable lamination manufacturing process (Automated VLM-ST) has been developed. In Automated VLM-ST, a vacuum chuck and linear moving system transfer the plate type material with two pilot holes to the rotation stage. A four-axis synchronized hotwire cutter cuts the material twice to generate Automated Unit Shape Layer (AUSL) with the desired width, side slopes, length, and two reference shapes in accordance with CAD data. Each AUSL is stacked on the stacking plate with two pilot pins using the pilot holes in AUSL and the pilot pins. Subsequently, adhesive is supplied to the top surface of the stacked AUSL by a bonding roller and pressure is simultaneously applied to the bottom surface of the stacked AUSL. Finally, three-dimensional shapes are rapidly fabricated. This paper describes the procedure for generating the cutting path data (AUSL data) f3r automated VLM-ST. The method for the generation of the Automated Unit Shape Layer (AUSL) in Automated VLM-ST was practically applied and fabricated for a various shapes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.1
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• pp.77-82
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• 2003

The ac loss is an important issue in the design of high-Tc superconducting power devices such as transformers and cables. In these devices many Bi-2223 tapes are closely stacked together and exposed to alternating magnetic fields that can have different orientations with respect to a tape. In such arrangement the magnetization loss is influenced by the screening current induced in adjacent tapes and thus different from that in a single tape. This stacking effect was experimentally investigated by measuring the magnetization loss in a stack, which consists of a number of tapes. First the magnetization loss in the single tape was measured in order to confirm the reliability of the loss data measured in the stack. The results for the single tape coincide well will the loss characteristics described in other previous works. For the stack In parallel and longitudinal magnetic fields the measured loss is Independent of both the number of tapes and stacking type. The longitudinal magnetization loss Is well explained rather by the slab model for decoupled filaments. For the tall stack in perpendicular field the measured loss at low fields is greatly decreased, compared to the loss of the single tape. However the loss at high fields is unaffected. These loss behaviors in the tall stack are well described by the slab model for full coupling.

• Macromolecular Research
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• v.14 no.1
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• pp.38-44
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• 2006

Vacuum deposited copper phthalocyanine (CuPc) was placed as a thin interlayer between indium tin oxide (ITO) electrode and a hole transporting layer (HTL) in a multi-layered, organic, light-emitting diode (OLEOs). The well-stacked CuPc layer increased the stability and efficiency of the devices. Thermal annealing after CuPc deposition and magnetic field treatment during CuPc deposition were performed to obtain a stacked-CuPc layer; the former increased the stacking density of the CuPc molecules and the alignment of the CuPc film. Thermal annealing at about 100$^{circ}C$ increased the current flow through the CuPc layer by over 25$\%$. Surface roughness decreased from 4.12 to 3.65 nm and spikes were lowered at the film surface as well. However, magnetic field treatment during deposition was less effective than thermal treatment. Eventually, a higher luminescence at a given voltage was obtained when a thermally-annealed CuPc layer was placed in the present, multi-layered, ITO/CuPc/NPD/Alq3/LiF/AI devices. Thermal annealing at about 100$^{circ}C$ for 3 h produced the most efficient, multi-layered EL devices in the present study.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.7-13
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• 2013

3D stacked IC is one of the promising candidates which can keep Moore's law valid for next decades. IC can be stacked through various bonding technologies and they were reviewed in this report, for example, wafer direct bonding and atomic diffusion bonding, etc. As an effort to reduce the high temperature and pressure which were required for high bonding strength in conventional Cu-Cu thermo-compression bonding, surface activated bonding, solid liquid inter-diffusion and direct bonding interface technologies are actively being developed.

• Journal of electromagnetic engineering and science
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• v.14 no.2
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• pp.68-73
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• 2014

A linear stacked field-effect transistor (FET) power amplifier (PA) is implemented using a $0.18-{\mu}m$ silicon-on-insulator CMOS process for W-CDMA handset applications. Phase distortion by the nonlinear gate-source capacitance ($C_{gs}$) of the common-source transistor, which is one of the major nonlinear sources for intermodulation distortion, is compensated by employing a PMOS linearizer with improved AM-PM. The linearizer is used at the gate of the driver-stage instead of main-stage transistor, thereby avoiding excessive capacitance loading while compensating the AM-PM distortions of both stages. The fabricated 836.5 MHz linear PA module shows an adjacent channel leakage ratio better than -40 dBc up to the rated linear output power of 27.1 dBm, and power-added efficiency of 45.6% at 27.1 dBm without digital pre-distortion.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.11
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• pp.821-825
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• 2013

Effect of multi-stacked layer (MSL), 0.1 mol (M) and 0.3 mol (M) hafnium oxide ($HfO_2$) alignment layers were fabricated via a solution-process for LCs orientation. The solutions were spin-coated and annealed in a furnace. MSL consists of three sub-layers using 0.1 M solution, mono-layer (ML) is composed of 0.3 M $HfO_2$ solution. Then ion-beam irradiation was treated with 1.8 keV for 2 min. $HfO_2$-based LC cells were investigated through photographs, pre-tilt angle using crystal rotation method, X-ray photoelectron spectroscopy (XPS) measurement, and surface roughness using atomic force microscopy(AFM) for their characteristic research. Good LC orientation characteristics were observed on MSL $HfO_2$ surface. The LC alignment mechanism on MSL $HfO_2$ and ML $HfO_2$ surfaces was attributed to van der Waals (VDW) interaction between the LC molecular and substrate surface.