• Journal of the Korean Magnetics Society
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• v.10 no.5
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• pp.250-255
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• 2000

Double rectangular spiral thin-film inductors were fabricated using $Fe_{86.7}Zr_{3.3}B_{4}Ag_{6}$ thin film with high permeability and resistance, in which easy axis of magnetization of the thin-film was perpendicular or parallel to the current direction. The perpendicular geometry inductor revealed higher inductance than the parallel geometry one, because spin aligns of magnetic film were more easily along the field direction due to higher field intensity in the perpendicular geometry. The increase of the inductance, however, resulted in the decrease of resonance frequency. The permeability was monitored by annealing the thin-films at different temperatures. With increasing the permeability, the inductance increased, but total resistance also increased due to the increase in magnetic core loss. As the resonance frequency was higher in air-core inductor than in magnetic thin-film core inductor, it is suggested to increase the resonance frequency that the characteristic of air-core inductor rather than the magnetic properties of the thin-film should be enhanced..

• Journal of the Korean Magnetics Society
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• v.11 no.5
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• pp.222-225
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• 2001

The planar type inductors have a good potential for the application of miniaturized low power DC-DC converters. For those high quality application, the reduction of coil loss and also magnetic films which have good high frequency properties are required. Fabricated inductor was consisted of FeTaN/Ti magnetic film and electroplated Cu coil thickness of 100$\mu\textrm{m}$ and $SiO_2$ as a insulating layer. The inductor was designed double rectangular spiral shape for magnetic field highly confining within the device. The measured value of inductance and resistance were 980 nH and 1.7 $\Omega$ at 1 MHz as operating frequency of device. The Q factor is 3.55 at 1 MHz.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.2
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• pp.162-172
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• 2011

In this paper, a design and fabrication of 4 W power amplifier for the WiMAX frequency band(2.3~2.7 GHz) are presented. The adopted active device is a commercially available GaN HEMT chip of Triquint Company, which is recently released. The optimum input and output impedances are extracted for power amplifier design using a specially self-designed tuning jig. Using the adopted impedances value, class-F power amplifier was designed based on EM simulation. For integration and matching in the small package module, spiral inductors and interdigital capacitors are used. The fabricated power amplifier with $4.4{\times}4.4\;mm^2$ shows the efficiency above 50 % and harmonic suppression above 40 dBc for second(2nd) and third(3rd) harmonic at the output power of 36 dBm.

• Journal of Advanced Navigation Technology
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• v.24 no.6
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• pp.573-580
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• 2020

In this paper, the characteristics of the inductor and capacitor, which are the basic components of the circuit, are constructed in a form that can be used in the LTCC multilayer. The inductors and capacitors used for the analysis were designed with rectangular spiral structures and MIM structures inside dielectrics with a dielectric constant of 7, respectively. The measured results were extracted from each element of the equivalent circuit proposed by the curve fitting method and verified the validity of the proposed equivalent circuit based on the extracted results. The analyzed inductor and capacitor were implemented in the form of library and proved its usefulness by applying to Elliptical type 5th LPF design. The LPF was measured through practical production, and as a result, the insertion loss in the passband DC ~ 3.7 GHz was up to 1.0 dB, the return loss was 19.2 dB, and the attenuation in the rejection band was 23.9 dB, which was close to the design goal.

• ETRI Journal
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• v.25 no.2
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• pp.65-72
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• 2003

To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.387-390
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• 1998

In this paper, HBT's with lower phase noise and passive elements, such as resistors, capacitors and inductors, for resonance and impedance matching networks are designed, fabricated, tested, and carefully analysed, respectively, and then, they are integrated for the design and fabrication of functional X-band oscillators with lower phase noise. Epi-wafers for HBT's with the structure of graded $Al_{x}$G $a_{1-x}$ As emitter and C-doped base layer of 700.angs. thick were used to specially emphasize the improvement of $f_{T}$ and $f_{max}$, and the lowering of phase noise, in design aspects. At the test frequencies of 12GHz, capacitances of MIM capacitors, spiral inductor, and resistances are 0.5~10pF, 0.4~11.06nH, and 20~1,380.ohm., respectively. The emitter size of HBY's for the X-band MMIC oscillators is 3*10u $m^{2}$, and find chip size is 0.9*0.9m $m^{2}$..EX>.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.294-298
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• 2003

In this paper, the modeling and design of high-Q multilayer passives have been investigated, and multilayer diplexer for GSM/DCS applications has been designed and fabricated using the passives. To minimize the system, the configuration of a multilayer inductor has involved a square spiral structure. Modeling of a multilayer inductor was performed by the subsystems of distributed components, and using the modeling the optimal structures of the high-Q multilayer inductor could be designed by analyzing parasitics and couplings which affect their frequency characteristics. Multilayer diplexer for GSM/DCS application has been designed and fabricated using LTCC technology. LPF for GSM band had the passband insertion loss of less than 0.55 dB, the return loss of more than 12 dB, and the isolation level of more than 26 dB by locating attenuation pole at 1800 MHz. HPF for DCS band had the passband insertion loss of less than 0.82 dB, the return loss of more than 11 dB, and the isolation level of more than 38 dB by locating attenuation pole at 930 MHz.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1345-1346
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• 2006

본 논문에서는 솔레노이드 형태의 칩 인덕터와 나선형태의 박막 인덕터에 대하여 주파수 특성을 비교 분석하여 장 단점을 정의하고자 한다. 솔레노이드형 RF 칩 인덕터는 $1.0mm{\times}0.5mm{\times}0.5mm$의 크기에 11nH의 인덕턴스를 가질 수 있도록 6회 권선하였다. 나선형 박막 인덕터는 $213{\mu}m{\times}250{\mu}m{\times}304{\mu}m$의 크기에 11nH의 인덕턴스를 가질 수 있도록 7회 권선하였다. 시뮬레이션을 위하여 AnSoft사의 HFSS를 이용하였으며, 이 결과 솔레노이드형 RF 칩 인덕터는 2GHz에서 77 정도의 품질계수와 5.6GHz의 SRF를 가진다. 반면 나선형 박막 인덕터는 2GHz에서 14 정도의 품질계수와 4.5GHz의 SRF를 가진다. 성능면에서는 솔레노이드형 RF 칩 인덕터가 우수한 특성을 나타내었으나 크기를 감소시키는데 제한을 받으므로, 향후 소형 경량화를 위하여 박막 인덕터의 개발은 필수적이며, 성능을 더욱 향상시키기 위하여 나선형태와 재료의 개발이 필수적이라 하겠다.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.12
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• pp.1069-1077
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• 2011

In this paper, a design and fabrication of a miniaturized 2.5 GHz 8 W power amplifier using selectively anodized aluminum oxide(SAAO) substrate are presented. The process of SAAO substrate is recently proposed and patented by Wavenics Inc. which uses aluminum as wafer. The selected active device is a commercially available GaN HEMT chip of TriQuint company, which is recently released. The optimum impedances for power amplifier design were extracted using the custom tuning jig composed of tunable passive components. The class-F power amplifier are designed based on EM co-simulation of impedance matching circuit. The matching circuit is realized in SAAO substrate. For integration and matching in the small package module, spiral inductors and single layer capacitors are used. The fabricated power amplifier with $4.4{\times}4.4\;mm^2$ shows the efficiency above 40 % and harmonic suppression above 30 dBc for the second(2nd) and the third(3rd) harmonic at the output power of 8 W.

• Journal of the Korean Magnetics Society
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• v.11 no.6
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• pp.239-244
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• 2001

Recently, RF inductor having researched by many workers, we fabricated and investigated properties of RF inductors. In order to improve the Q-factor (Quality), we try to apply the patterned Fe$_{78.81}$Ta$_{8.47}$N$_{12.71}$ soft magnetic thin film of 5000 which shows magnetic anisotropy of 30 Oe. Thus, patterned magnetic film was artificially increased magnetic anisotropy lead to increasing of ferro-magnetic resonance frequency up to GHz band. Coil as part of inductor was fabricated by lift off process. The dimension of RF inductor was designed 47un, rectangular shape, and measured properties. In the case of Ti/Ag air core type inductor shows Q of 9, inductance of 8.4 nH at 2 GHz. Magnetic film employed inductor shows inductance of 9 nH and FMR resonance frequency was 700 MHz.