• Journal of Sensor Science and Technology
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• v.22 no.2
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• pp.130-135
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• 2013

This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.

• Korean Journal of Materials Research
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• v.28 no.2
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• pp.89-94
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• 2018

The properties of 18 K red gold solder alloys were investigated by changing the content of In up to 10.0 wt% in order to replace the hazardous Cd element. Cupellation and energy dispersive X-ray spectroscopy (EDS) were used to check the composition of each alloy, and FE-SEM and UV-VIS-NIR-Colormeter were employed for microstructure and color characterization. The melting temperature, hardness, and wetting angle of the samples were determined by TGA-DTA, the Vickers hardness tester, and the Wetting angle tester. The cupellation result confirmed that all the samples had 18K above 75.0wt%-Au. EDS results showed that Cu and In elements were alloyed with the intended composition without segregation. The microstructure results showed that the amount of In increased, and the grain size became smaller. The color analysis revealed that the proposed solders up to 10.0 wt% In showed a color similar to the reference 18 K substrate like the 10.0 wt% Cd solder with a color difference of less than 7.50. TGA-DTA results confirmed that when more than 5.0 wt% of In was added, the melting temperature decreased enough for the soldering process. The Vickers hardness result revealed that more than 5.0 wt% In solder alloys had greater hardness than 10.0 wt% Cd solder, which suggested that it was more favorable in making a wire type solder. Moreover, all the In solders showed a lower wetting angle than the 10.0 wt% Cd solder. Our results suggested that the In alloyed 18 K red gold solders might replace the conventional 10.0 wt% Cd solder with appropriate properties for red gold jewelry soldering.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.464-466
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• 2009

This study tried to examine the suitability of strip casting process such as PFC (Planar Flow Casting) method for soldering Au-Sn strip. The effect of heat treatment on the tensile behavior and mechanical properties of an Au-Sn strip was investigated through tensile test, micro hardness test, X-ray diffraction (XRD), SEM, and TEM observations. It was apparent that 20-mm width Au-Sn strip could be well produced by using planar flow casting process. Tensile results showed that tensile strength increased from 338.3MPa to 310MPa and plastic strain improved from 0% to 1.5% with heat treatment ($170^{\circ}C$/70 hrs.). The microstructure of Au-Sn strip mainly consisted of two phases; $Au_5Sn(\zeta)$ and AuSn($\sigma$). It was also found that inhomogeneous amorphous local structure continuously changed to the homogeneous two phases microstructure with heat treatment. The fractographical observation after tensile test indicated the cleavage fracture mode of as-casted Au-Sn strip. On the other hand, the heat treated Au-Sn strip showed that fracture propagated along interface between brittle AuSn and ductile $Au_5Sn$ phases. The deformation behavior of strip casted Au-Sn alloy with microstructural evolution and the improve method for ductility of this alloy was also suggested.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.35-39
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• 2020

Nonwet (Head in Pillow) defect is one of the defects in SMT (surface mount technology) process, the defect is caused by several factors, such as solder paste misalignment, reflow condition, package warpage and package ball size. This paper focused on ① reflow condition ② package ball & solder paste misalignment ③ package ball size for nonwet experiment. The first, on the case of reflow condition, there would be high risk of nonwet defect when the soldering time was increased, but N₂ was adopted to reflow process, there could be no or low risk of nonwet defect because of oxidation barrier control. And when the contact depth between Solder ball and solder paste was below 20 ㎛, there could be high risk of nonwet defect. Also smaller package ball would have low risk of nonwet defect.

• Journal of the Korean Solar Energy Society
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• v.38 no.1
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• pp.45-55
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• 2018

Environmentally benign lead-free solder coated ribbon (e. g. SnCu, SnZn, SnBi${\cdots}$) has been intensively studied to interconnect cells without lead mixed ribbon (e. g. SnPb) in the crystalline silicon(c-Si) photovoltaic modules. However, high melting point (> $200^{\circ}C$) of non-lead based solder provokes increased thermo-mechanical stress during its soldering process, which causes early degradation of PV module with it. Hence, we proposed low-temperature conductive paste (CP) based tabbing method for lead-free ribbon. Modules, interconnected by the lead-free solder (SnCu) employing CP approach, exhibits similar output without increased resistivity losses at initial condition, in comparison with traditional high temperature soldering method. Moreover, 400 cycles (2,000 hour) of thermal cycle test reveals that the module integrated by CP approach withstands thermo-mechanical stress. Furthermore, this approach guarantees strong mechanical adhesion (peel strength of ~ 2 N) between cell and lead-free ribbons. Therefore, the CP based tabbing process for lead free ribbons enables to interconnect cells in c-Si PV module, without deteriorating its performance.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.63-68
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• 2000

This paper introduces the partial melting process for solder application and characterization of its possibility using off-eutectic Pb-Sn alloy. In order to show that the liquid phase in the semi-liquid state maintains the wettability as the single-phase liquid, the wetting balance test are conducted with varying temperatures and compositions. The results are then compared with the surface tension of liquid, both measured and calculated, to examine the correlation. The results from this investigation indicate that the partial melting can yield satisfactory solder joints as long as the liquid phase acquires sufficient chemical activity. At a condition where the partial melting is effective, a direct correlation between the wettability and the surface tension is found to exist. All alloys are found to show a reasonable wettability in semi-liquid state.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1531_1532
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• 2009

This paper presents a method of self-arranging solderballs by using surface energy difference. After evaporating Au which has high surface energy on Si substrates, Teflon passivation layer which has low surface energy was patterned by lift-off process. Droplets formed only on the hydrophilic Au solderball lands by the surface energy difference, not the hydrophobic Teflon surface. Scattered solderballs sticked by themselves to the wetted solderball lands on the tilted substrate. After setting preheating of $200^{\circ}C$ and soldering of $245^{\circ}C$ hot plates, the solderballs were soldered on the solderball lands and two substrates were soldered together completely. After measuring the mechanical shear strength of the soldered substrates with solderballs of $3{\times}3$, $4{\times}4$ and $5{\times}5$ arrays. the calculated shear strength per one solderball was 1.1~2.4kgf as high as the previous report.

• Proceedings of the Korean Reliability Society Conference
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• 2004.07a
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• pp.147-151
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• 2004

In this study, an optical fiber assembly directly coupled with a laser diode or a photo diode is designed to confirm high reliable optical coupling efficiency of optical transmitter(Tx) and receiver(Rx). The optical fiber assembly is fabricated by soldering an optical fiber and a Kovar ferrule using a glass solder after inserting an optical fiber through a Kovar ferrule. The Kovar which has good welding characteristics is applied to introduce laser welding technique. The glass solder has excellent thermal characteristics such as thermal shift delamination compared with PbSn, AuSn solder previously used usually. Furthermore, the glass solder doesn't need fiber metalization and this enables low cost fabrication. However, the glass soldering is high temperature process over 35$0^{\circ}C$ and the convex shape after solidification due to surface tension causes the stress concentration on optical fiber. The stress concentration on the optical fiber increases the optical insertion loss and possibility of crack formation. The shape of glass solder was designed referring to 2-D Axi-symmetric FEM simulation. To test the mechanical reliability, mechanical vibration test and shock test were done according to Telcorida GR-468-Core protocol. After each test, the optical loss of the stress distributed fiber assembly didn't exceed 0.5 dB, which passes the test.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.12
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• pp.47-54
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• 2015

Normally, multiple socket-outlet is manufactured with soldered, welded permanent connection (termination). Because this procedure is very non-environmental and requires many labor forces, many companies skip this process. To solve this these problems, this research had to design permanent joint type multiple socket-outlet, develop safer multiple socket-outlet than is sold in markets. Progressing this research, we took 3 steps. First, we had to design device for fixing a frame suitable for multiple socket-outlet. Second, this multiple socket-outlet must pass fundamental standards through international standard (IEC 60884-1) and Korean standard (K 60884-1) tests. Third, it had to pass both several mechanical and electrical tests which is more strict than fundamental standards and vibration and impact tests following KS standards for enhancing its safety. After finishing 3 steps, we could obtain objective and fair data, develop environmental permanent joint type multiple socket-outlet without soldering crimped connection.

• Journal of the Korean institute of surface engineering
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• v.35 no.2
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• pp.129-137
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• 2002

The purpose of solderability assessment is to predict the effectiveness of soldering process. It is important for companies pursuing zero defects manufacturing because poor solderability is the major cause of two third of soldering failures. The most versatile solderability method is wetting balance method. However, there exist so many indices for wettability in the wetting balance test e.g. time to reach 2/3 values of maximum wetting force, tine to reach zero wetting force, maximum withdrawal force. In this study, three solderability assessment methods, which were the maximum withdrawal force, the wetting balance and the dynamic contact angle (DCA), were evaluated by comparing each other. The wetting balance technique measures the solderability by recording the forces exerted from the specimen after being dipped into the molten solder. Then the force at equilibrium state can be used to calculate a contact angle, which is known as static contact angles. The DCA measures contact angles occurred during advancing and withdrawing of the specimen and the contact angles are known as dynamic contact angles. The maximum withdrawal force uses the maximum force during withdrawal movement and then a contact angle can be calculated. In this study, the maximum withdrawal force method was found to be an objective index for measuring the solderability and the experiment results indicated good agreement between the maximum withdrawal force and the wetting balance method.