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http://dx.doi.org/10.6117/kmeps.2020.27.3.035

A Study on the Nonwet Defective Factors of the SMT Process  

Yun, Chanhyung (TSP Quality team, DS, Samsung Electronics Co.)
Publication Information
Journal of the Microelectronics and Packaging Society / v.27, no.3, 2020 , pp. 35-39 More about this Journal
Abstract
Nonwet (Head in Pillow) defect is one of the defects in SMT (surface mount technology) process, the defect is caused by several factors, such as solder paste misalignment, reflow condition, package warpage and package ball size. This paper focused on ① reflow condition ② package ball & solder paste misalignment ③ package ball size for nonwet experiment. The first, on the case of reflow condition, there would be high risk of nonwet defect when the soldering time was increased, but N2 was adopted to reflow process, there could be no or low risk of nonwet defect because of oxidation barrier control. And when the contact depth between Solder ball and solder paste was below 20 ㎛, there could be high risk of nonwet defect. Also smaller package ball would have low risk of nonwet defect.
Keywords
Nonwet; Head in Pillow; Small ball; Reflow; Soak time; keeping time; ball misalignment;
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  • Reference
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