• 대한치과기공학회지
• /
• 제30권1호
• /
• pp.49-55
• /
• 2008

In this study, to provide the fundamental data on stable connection method for successful implants prosthesis, We fabricated the solder joint of gold alloy bar specimens by gas flame soldering method and laser welding and soldering method. It compared and studied the tensile strength of two soldering method by universal testing machine. The results using universal testing machine were as follow : The mean of tensile strength of solder joint bar in gas flame soldering method specimens was 363.89 $\pm$17.62 MPa, and the mean strength of laser welding and soldering method was 125.91 $\pm$ 19.66 MPa, so gas flame soldering method was better than laser welding and soldering method and the finding better way to improve tensile strength is needed in laser welding method. On weak loading condition and the part which is needed an accuracy, laser welding method is more effective and on long-span prosthesis and frequent chewing loading part, laser welding technique is recommended first and applying additional gas flame soldering technique would be better for making much more successful prosthesis.

• International Journal of Clinical Preventive Dentistry
• /
• 제14권4호
• /
• pp.247-255
• /
• 2018

Objective: Osseointegration is essential process for successful implants and effects to implant in long term, therefore, passive fitness of good prosthesis is necessary. To make a good prosthesis, at first it should be done a sectioned casting and then joined method of sectioned casting body is recommended. Methods: In this study, to provide the fundamental data on stable connection method for successful implants, the author tested fitness of casting body, and compared difference between gas soldering technique and laser welding technique. Results: In fitness test of 2 abutment (test A, C), gas soldering group's fitness in the opposite part of connection was worse than laser welding group. In fitness test of 3 abutment (test B, D), gap distance was increased both in gas soldering technique and laser welding technique. Gap distance at the connecting part and the opposite part of the abutment in gas soldering technique was worse than laser welding technique and the more additional abutment, the worse gap distance in gas soldering technique. In fitness test of 3 abutment (test B, D), there's little variation in No. 2 abutment when connecting soldering process was done and there's little influence on already soldered connection part when the additional soldering connection was done. Conclusion: On weak loading condition and the part which is needed an accuracy, laser welding technique is more effective and on long-span prosthesis and frequent chewing loading part, laser welding technique is recommended first and applying additional gas soldering technique would be better for making much more successful prosthesis.

• 동력기계공학회지
• /
• 제19권3호
• /
• pp.48-54
• /
• 2015

This paper introduced a design method of soldering station that can control two types of soldering iron heater. At design time, to distinguish two types of soldering iron heater the voltage divider rule has been applied, and the distinguished resistor is inserted to handler of soldering iron to prevent misuse by users. And an algorithm to design a PID controllers is proposed. The proposed controllers parameter which can be easily realized, and are designed by using the input output data from systems, and have outstanding ability making the output response of nonlinear systems similar to the desired one. Temperature control experiments were performed to verify the ability of the suggested controller. As a result, suggested PID controller followed the desired ones, and one soldering station can control the various type of soldering irons in real time.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2010년도 하계학술대회 논문집
• /
• pp.72-72
• /
• 2010

The PV module company use variable process step and type. Especially soldering process is important, because crystalline cell can be bow by beating temperature. Most PV module company use hot air soldering type in the tabbing & string process. Although hot air type is used widely but this type is bound to influence on cell damage. So recently new way is introducing like a high current way. In this paper, we compare with characteristics of each soldering type and then conform a method to minimize solar cell deformation. Actually solar cell deformation show many difference by fix position and cooling time after soldering step.

• Journal of Welding and Joining
• /
• 제21권5호
• /
• pp.534-539
• /
• 2003

An efficient soldering process using the longitudinal ultrasonic vibration is introduced in this work for electronic packaging. The effects of the process parameters such as the ultrasonic frequency, amplitude, dimension of the metal bump and solder are analyzed through a viscoelastic lumped model. The viscoelastic properties of the eutectic solder were measured for calculation and evaluation of heat generation capability of the solder. Experiments were conducted to verify the possibility of the proposed ultrasonic soldering method by inserting the Cu and Au bumps into the solder block. Localized heating due to ultrasonic vibration melts the solder near the metal bump, which demonstrates the applicability of the ultrasonic soldering method to the high-density electronic packaging.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 1988년도 한국자동제어학술회의논문집(국내학술편); 한국전력공사연수원, 서울; 21-22 Oct. 1988
• /
• pp.295-298
• /
• 1988

For the automation of the manual soldering process through robot technology, two main tasks have to be achieved: Control of various soldering parameters and realization of flexible tool movements like human hands. In this paper a method for attaining these tasks is presented and analyzed.

• Journal of Welding and Joining
• /
• 제22권1호
• /
• pp.65-70
• /
• 2004

A soldering process with longitudinal ultrasonic is conducted in this work using the Au bump and substrate. Localized heating of the solder is achieved and the stirring action due to the ultrasonic is found to influence the bond strength and microstructure of the eutectic solder The acceptable bonding condition is determined from the tensile strength. Since the multiple bonds can be formed simultaneously with localized heating, the proposed ultrasonic soldering method appears to be applicable to the high-density electronic package.

• The Journal of Advanced Prosthodontics
• /
• 제2권4호
• /
• pp.117-121
• /
• 2010

PURPOSE. The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. MATERIALS AND METHODS. Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method and the gap distance. For the soldering methods, gas torch (G group) and infrared ray (IR group) were compared and each group was subdivided by corresponding gap distance (0.3 mm: G3 and IR3, 0.5 mm: G5, IR5). Specimens of the experimental groups were sectioned in the middle with a diamond disk and embedded in solder blocks according to the predetermined distance. As a control group, 7 specimens were prepared without sectioning or soldering. After the soldering procedure, a tensile strength test was performed using universal testing machine at a crosshead speed 1 mm/min. The proportions of porosity on the fractured surface were calculated on the images acquired through the scanning electronic microscope. RESULTS. Every specimen of G3, G5, IR3 and IR5 was fractured on the solder joint area. However, there was no significant difference between the test groups (P > .05). There was a negative correlation between porosity formation and tensile strength in all the specimens in the test groups (P < .05). CONCLUSION. There was no significant difference in ultimate tensile strength of joints and porosity formations between the gas-oxygen torch soldering and infrared ray soldering technique or between the gap distance of 0.3 mm and 0.5 mm.

• 한국공작기계학회논문집
• /
• 제11권5호
• /
• pp.23-29
• /
• 2002

The soldering is widely used installing the electronic element on circuit board in the common electronic device. Since the flux which improves the liquidity of solder make the electronic and chemical performance worse, the circuit board need to wash clearly. At present however no-washing is required for the cost reduction, the chemical stability, and the protection of environment. In this research, the solder liquidity depending on the power density and the pulse width is comparatively analyzed by the diffusion area method for achieving the no-flux soldering.

• 대한치과보철학회지
• /
• 제37권3호
• /
• pp.358-374
• /
• 1999

This study measured the relative displacements of the five-unit fixed partial dentures as cast with the same fixed partial dentures sectioned and assembled by investment-soldering, solder-ing stand-soldering, and cast-joining techniques A total of fifteen specimens using a type IV gold alloy were one-piece cast as control and then sectioned and assembled five test specimens for each method were prepared. A computerized three dimensional coordinate measuring machine and specially designed cylinder for this study were used. Displacement was defined by six displacement variables for the each of cylinders incorporated in each casting: three component displacements(${\Delta}Lx,\;{\Delta}Ly,\;and\;{\Delta}Lz$) and rotational displacements(${\Delta}{\theta}x,\;{\Delta}{\theta}y,\;{\Delta}{\theta}z$). The global displacement was computed using the mathematical formula ${\Delta}R$ = Global displacement =$\sqrt{{(x'-x)}^2+{(y'-y)}^2+{(z'-z)}^2}$ Under the conditions of this study, the following conclusions were drawn: 1. The investment-soldering group showed the largest mean value of final global displacements, followed by stand-soldering group, cast-joining group and one-piece cast group. However, between the mean values of final global displacement for the cast-joining group and one-piece cast group, there was no significant difference. 2. For investment-soldering and stand-soldering groups, the greater global displacements were recorded in soldering phase than in indexing or investing phase. 3. For one-piece cast group, the displacements occured mostly in the casting phase. And for cast-joining group, there was no significant difference in global displacements among the fabricating procedures. 4. Intercentroidal distance decreased in framework-patterning, solder-indexing, solder-standing, and soldering phases, but increased in investment block-investing and casting phases. 5 Specially designed cylinder for touch-trigger type coordinate measuring machine was validated.