1 |
S. J. Kim and G. S. Bae, 1999, "A Study on the Microstructure and Adhesion Properties of Sn-3.5Ag/Alloy42 Lead-Frame Solder Joint", Korean journal of materials research Vol. 9, No. 9, pp. 926-931.
|
2 |
S. C. Kim, S. C. Choi, and W. J. Kim, 2002, "The Study of Standardization for Pb-free Solder Ball", The Korean Microelectronics and Packaging Society, Proceedings of the International Microelectronics And Packaging Society Conference, pp. 219-223.
|
3 |
Y. K. An, and D. H. Yoon, 2001, "Design and Fabrication of the Digital Iron Using the Micro-processor", Journal of the Institute of Electronics Engineers of Korea. SC, Vol. 38, No. 281, pp. 33-41.
|
4 |
H. Hamane, K. Hirano, K. Kase and K. Miyazaki, 2008, "Industrial Temperature PID Controller for Pb-Free Soldering Iron", Proceedings of the 17th World Congress, IFAC Seoul, Korea, pp. 10838-10843.
|
5 |
W. J. Shin, 2005, "Fuzzy Scheduling for the PID Gain Tuning", Journal of fuzzy logic and intelligent systems, Vol. 15, No. 1, pp. 120-125.
DOI
ScienceOn
|
6 |
K. K. Jung and D. S. Son, 2003, "PID Control Method using Fuzzy Logic System", Journal of the Institute of Electronics Engineers of Korea. TE, Vol. 40, No. 3, pp. 16-23.
|
7 |
W. Xiaofang, W. Min, O. Liyu and T. Qingsong, 2010, "The application of GA-PID control algorithm to DC-DC converter", Control Conference (CCC), 2010 29th Chinese, pp. 3492-3496.
|
8 |
K. S. Oh and G. T. Kang, 2014, "Temperature control of the Rework-system using fuzzy PID controller", Journal of the Korea Academia-Industrial cooperation Society, Vol. 15, No. 10, pp. 6289-6295.
DOI
ScienceOn
|