• Transactions on Electrical and Electronic Materials
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• v.4 no.2
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• pp.1-4
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• 2003

The purpose of this study was to investigate the characteristics of slurry including phosphoric acid for chemical-mechanical planarization of copper and tantalum nitride. In general, the slurry for copper CMP consists of alumina or colloidal silica as an abrasive, organic acid as a complexing agent, an oxidizing agent, a film forming agent, a pH control agent and additives. Hydrogen peroxide (H$_2$O$_2$) is the material that is used as an oxidizing agent in copper CMP. But, the hydrogen peroxide needs some stabilizers to prevent decomposition. We evaluated phosphoric acid (H$_3$PO$_4$) as a stabilizer of the hydrogen peroxide as well as an accelerator of the tantalum nitride CMP process. We also estimated dispersion stability and zeta potential of the abrasive with the contents of phosphoric acid. An acceleration of the tantalum nitride CMP was verified through the electrochemical test. This approach may be useful for the development of the 2$\^$nd/ step copper CMP slurry and hydrogen peroxide stability.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.10
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• pp.1535-1540
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• 2001

This study presents the possibility of scratch reduction on wafer in CMP by applying the ultrasonic and megasonic energy into the slurry which might contain large abrasive particles. Experiments were conducted to verify the dispersion ability of agglomerated particles by applying ultrasonic, megasonic waves and analyze the particle distribution of used slurry in case, of sonic energy assisted or none. And the dispersion stability of megasonic waves was investigated through the experiment of stability of the dispersed slurry, Finally, to confirm that the distribution of particles in slurry by ultrasonic waves was actually related to scratches on wafer when CMP was done, tungsten blanket wafer was processed, by CMP to compare and investigate scratches on wafer.

• Proceedings of the KSR Conference
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• 2011.10a
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• pp.1199-1213
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• 2011

Slurry type shield would be very effective for the tunnelling in a sandy ground, but low slurry pressure could cause a tunnel face failure or a ground settlement in front of the tunnel face. Thus, the stability of tunnel face could be maintained by applying an excess slurry pressure that is larger than the active earth pressure. However, the slurry pressure should increase properly because an excessively high slurry pressure could cause the slurry flow out or the passive failure of the frontal ground. It is possible to apply the high slurry pressure without passive failure if a horizontal impermeable layer is located in the ground in front of the tunnel face, but its location, size, and effects are not clearly known yet. In this research, two-dimensional model tests were carried out in order to find out the effect of a horizontal impermeable layer for the slurry shield tunnelling in a saturated sandy ground. As results, larger slurry pressure could be applied to increase the stability of the tunnel face when the impermeable layer was located in the ground above the crown in front of the tunnel face. The most effective length of the impermeable grouting layer was 1.0~1.5D, and the location was 1.0D above the crown level. The safety factor could be suggested as the ratio of the maximum slurry pressure to the active earth pressure at the tunnel face. It could also be suggested that the slurry pressure in the magnitude of 3.5~4.0 times larger than the active earth pressure at the initial tunnel face could be applied if the impermeable layer was constructed at the optimal location.

• Journal of the Korean Ceramic Society
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• v.40 no.2
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• pp.167-171
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• 2003

CMP(Chemical Mechanical Planarization) slurry for STI process is made by mechanically synthesized$CeO_2$as abrasive. The abrasive can be stabilized by electrostatic or steric stabilization in aqueous slurry and steric stabilization is more effective for long-term stability. Blanket-type$SiO_2$and $Si_3N_4$ wafers are polished with CMP slurry containing$CeO_2$synthesized in 50$0^{\circ}C$ or $700^{\circ}C$. Removal rate and surface uniformity of$SiO_2$and$Si_3N_4$wafer and selectivity are influenced by synthetic condition of abrasive, suspension stability and pH of slurries.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.272-277
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• 2004

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5％ acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• Journal of the Korean Geotechnical Society
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• v.18 no.4
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• pp.249-256
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• 2002

The stability of slurry trench system is closely associated with the characteristics of the filter cake (assumed impervious membrane) transferring the hydrostatic force of slurry to the trench walls. The effectiveness of this assumption in a wide range of trench systems has been examined with the aid of a Finite Element program. Build up of excess porewater pressure in the soil mass behind the filter cake is a function of the slurry density, the properties of filter cake, the ground conditions, time, the geometry of trench and the original ground water level. These factors were all investigated by the Finite Element Method. The most significant factors were found to be the ground conditions and the properties of filter cake.

• Geomechanics and Engineering
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• v.28 no.3
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• pp.265-281
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• 2022

A set of slurry shield test system capable of cutter cutting and slurry automatic circulation is used to investigate the deformation characteristics, the evolution characteristics of support resistance and the distribution and evolution process of earth pressure during excavating and collapsing of slurry shield tunneling in circular-gravel layer. The influence of cover-span ratio on surface subsidence, support resistance and failure mode of excavation face is also discussed. Three-dimensional numerical calculations are performed to verify the reliability of the test results. The results show that, with the decrease of the supporting force of the excavation face, the surface subsidence goes through four stages: insensitivity, slow growth, rapid growth and stability. The influence of shield excavation on the axial earth pressure of the front soil is greater than that of the vertical earth pressure. When the support resistance of the excavation face decreases to the critical value, the soil in front of the excavation face collapses. The shape of the collapse is similar to that of a bucket. The ultimate support resistance increase with the increase of the cover-span ratio, however, the angle between the bottom of the collapsed body and the direction of the tunnel excavation axis when the excavation face is damaged increase first and then becomes stable. The surface settlement value and the range of settlement trough decrease with the increase of cover-span ratio. The numerical results are basically consistent with the model test results.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.11a
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• pp.459-462
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• 2008

In manufacture of slurry fuel, the effects of process parameters on the carbon dispersion stability have been investigated. The particle size and contents of the carbon slurry taken from 3 (top, medium, bottom) positions in fuel reservoir were analyzed to estimate the dispersion of the carbon in Jet A-1. Through the application of various additives, it was found that NB463S84 additive showed the best dispersion and stability of carbon at accelerated gravity condition. The mixer performance was compared by the observation of height change of carbon-containing layer and measurement of particle sizes at the same conditions. Application of the mixing conditions obtained from the lab-scale to bench scale manufacture confirmed the practical feasibility of our research.

• Proceedings of the Korean Ceranic Society Conference
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• 2002.10a
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• pp.65.1-65
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• 2002

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.308-311
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• 2003

The mesoporous TiO2 film for the dye-sensitized solar cell was prepared by the spin coating using nano particle $TiO_2$ slurry. In order to obtain the good dispersion of nano size $TiO_2$ particles in slurry, the pH of solvent, the sort and quantity of solvent additive and the quantity of surfactant were adjusted. The experimental range of pH was $2\;{\sim}\;4$. The basic solvent for slurry was dilute $HNO_3$ and the solvent additives were ethylene glycol, propylene glycol and butylene glycol. The degree of particle dispersion was indirectly estimated by the viscosity of slurry and the microstructure after sintering. As results, the lower the pH of solvent was the lower the viscosity of the slurry became. The addition of ethylene glycol and propylene glycol to dilute $HNO_3$ brought about the lowering of viscosity and the enhancement of stability in slurry. The addition of surfactant lowered the viscosity of slurry. It was possible to obtain the homogeneous and uniformly dispersed mesoporous TiO2 film using the dilute HNO3 solvent of pH 2 with the addition of ethylene glycol, propylene glycol and neutral surfactant.