• Transactions on Electrical and Electronic Materials
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• 제4권2호
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• pp.1-4
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• 2003

The purpose of this study was to investigate the characteristics of slurry including phosphoric acid for chemical-mechanical planarization of copper and tantalum nitride. In general, the slurry for copper CMP consists of alumina or colloidal silica as an abrasive, organic acid as a complexing agent, an oxidizing agent, a film forming agent, a pH control agent and additives. Hydrogen peroxide (H$_2$O$_2$) is the material that is used as an oxidizing agent in copper CMP. But, the hydrogen peroxide needs some stabilizers to prevent decomposition. We evaluated phosphoric acid (H$_3$PO$_4$) as a stabilizer of the hydrogen peroxide as well as an accelerator of the tantalum nitride CMP process. We also estimated dispersion stability and zeta potential of the abrasive with the contents of phosphoric acid. An acceleration of the tantalum nitride CMP was verified through the electrochemical test. This approach may be useful for the development of the 2$\^$nd/ step copper CMP slurry and hydrogen peroxide stability.

• 대한기계학회논문집A
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• 제25권10호
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• pp.1535-1540
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• 2001

This study presents the possibility of scratch reduction on wafer in CMP by applying the ultrasonic and megasonic energy into the slurry which might contain large abrasive particles. Experiments were conducted to verify the dispersion ability of agglomerated particles by applying ultrasonic, megasonic waves and analyze the particle distribution of used slurry in case, of sonic energy assisted or none. And the dispersion stability of megasonic waves was investigated through the experiment of stability of the dispersed slurry, Finally, to confirm that the distribution of particles in slurry by ultrasonic waves was actually related to scratches on wafer when CMP was done, tungsten blanket wafer was processed, by CMP to compare and investigate scratches on wafer.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2011년도 정기총회 및 추계학술대회 논문집
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• pp.1199-1213
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• 2011

이수가압식 쉴드공법은 사질토에서 적용성이 우수하지만, 이수압이 낮으면 이수 유출 및 지반변형이 발생하기도 한다. 따라서 이수가압식 쉴드에서는 초기 막장압보다 큰 초과 이수압을 가하여 막장 안정을 유지한다. 그러나 이수압이 너무 높으면 전방 지반의 수동 파괴를 유발하므로 수동 파괴 위험성을 줄이고 이수압을 증가시키는 방법으로 막장 전방에 수평 차수층을 설치하는 방안이 있으나 위치와 규모, 효과가 잘 알려져 있지 않다. 따라서 본 연구에서는 포화 사질토에서 막장전방에 차수 그라우팅 적용시 발생하는 효과를 규명하기 위하여 모형실험을 수행하였다. 실험 결과, 차수층이 있는 경우가 없는 경우보다 이수압을 크게 가할 수 있어서 전방 차수층이 막장 안정성을 증대시킬 수 있다는 것을 확인하였다. 막장 안정성 증대에 가장 큰 영향을 주는 적정 차수층은 길이 1.0~1.5D, 설치높이 1.0D로 나타났다. 초기 막장압 대비 최대 이수압의 비로 막장의 자립 안전율(F)을 제안할 수 있으며, 전방 차수층을 적정 위치에 설치할 경우 초기 막장압보다 3.5~4.0배 크게 이수압을 가할 수 있는 것으로 나타났다.

• 한국세라믹학회지
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• 제40권2호
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• pp.167-171
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• 2003

기계적 방법으로 합성된 CeO$_2$분말을 연마입자로 하여 STI용 CMP 슬러리를 제조하였다. 연마입자는 정전기적 방법과 입체적 방법으로 수계에서 안정화시킬 수 있었으며, 장기 안정성을 위해서는 입체적 방법에 의한 안정화가 유효하였다. 50$0^{\circ}C$와 $700^{\circ}C$에서 합성된 CeO$_2$를 이용하여 CMP 슬러리를 제조하고, SiO$_2$와 Si$_3$N$_4$가 블랭킷 형태로 증착된 웨이퍼를 연마한 결과 연마능률과 선택비는 연마입자의 합성조건과 분산 안정성, 슬러리의 pH 등에 의해 영향을 받았다.

• 한국전기전자재료학회논문지
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• 제17권3호
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• pp.272-277
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• 2004

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5％ acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• 한국지반공학회논문집
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• 제18권4호
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• pp.249-256
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• 2002

Slurry trench의 안정성은 안정액의 유압이 filter cake 막을 통하여 trench 벽에 전달됨으로서 확보될 수가 있다. 지반조건의 영향에 따른 slurry trench 공법에서 주변 공극수압의 변화를 수치해석(FEM)으로 추적하였다. 이러한 주변 공극수압의 변화 요인으로는 안정액의 밀도, filter cake의 상태, 토질조건, 시간, trench 심도, 주변지하수위로 조사되었으며, 가장 큰 영향력을 보인 요인으로는 토질조건과 filter cake 상태로 나타났다.

• Geomechanics and Engineering
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• 제28권3호
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• pp.265-281
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• 2022

A set of slurry shield test system capable of cutter cutting and slurry automatic circulation is used to investigate the deformation characteristics, the evolution characteristics of support resistance and the distribution and evolution process of earth pressure during excavating and collapsing of slurry shield tunneling in circular-gravel layer. The influence of cover-span ratio on surface subsidence, support resistance and failure mode of excavation face is also discussed. Three-dimensional numerical calculations are performed to verify the reliability of the test results. The results show that, with the decrease of the supporting force of the excavation face, the surface subsidence goes through four stages: insensitivity, slow growth, rapid growth and stability. The influence of shield excavation on the axial earth pressure of the front soil is greater than that of the vertical earth pressure. When the support resistance of the excavation face decreases to the critical value, the soil in front of the excavation face collapses. The shape of the collapse is similar to that of a bucket. The ultimate support resistance increase with the increase of the cover-span ratio, however, the angle between the bottom of the collapsed body and the direction of the tunnel excavation axis when the excavation face is damaged increase first and then becomes stable. The surface settlement value and the range of settlement trough decrease with the increase of cover-span ratio. The numerical results are basically consistent with the model test results.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2008년도 제31회 추계학술대회논문집
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• pp.459-462
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• 2008

슬러리 연료 제조 시 카본의 분산안정성에 미치는 공정변수의 영향을 조사하였다. 슬러리연료 저장용기의 세군데(위, 중간, 아래) 위치별로 채취된 시료에서 평균입도와 탄소함량을 분석하여 Jet A-1에서 카본의 분산안정성을 측정하였다. 여러 종류의 첨가제를 적용한 결과, NB463S84 사용 시 분산성과 증가된 중력 가속도하에서 안정성이 가장 우수하였다. 동일 조건에서 카본층 높이 변화와 카본의 평균입도 측정을 통하여 혼합장비의 성능을 비교하였고, 실험실 규모에서 얻은 제조조건을 bench 규모 제조에 적용하여 본 연구의 실용 가능성을 확인하였다.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2002년도 추계총회 및 연구발표회 초록집
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• pp.65.1-65
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• 2002

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.308-311
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• 2003

The mesoporous TiO2 film for the dye-sensitized solar cell was prepared by the spin coating using nano particle $TiO_2$ slurry. In order to obtain the good dispersion of nano size $TiO_2$ particles in slurry, the pH of solvent, the sort and quantity of solvent additive and the quantity of surfactant were adjusted. The experimental range of pH was $2\;{\sim}\;4$. The basic solvent for slurry was dilute $HNO_3$ and the solvent additives were ethylene glycol, propylene glycol and butylene glycol. The degree of particle dispersion was indirectly estimated by the viscosity of slurry and the microstructure after sintering. As results, the lower the pH of solvent was the lower the viscosity of the slurry became. The addition of ethylene glycol and propylene glycol to dilute $HNO_3$ brought about the lowering of viscosity and the enhancement of stability in slurry. The addition of surfactant lowered the viscosity of slurry. It was possible to obtain the homogeneous and uniformly dispersed mesoporous TiO2 film using the dilute HNO3 solvent of pH 2 with the addition of ethylene glycol, propylene glycol and neutral surfactant.