• Journal of Biomedical Engineering Research
• /
• v.43 no.4
• /
• pp.219-229
• /
• 2022

In this study, we propose a miniaturized micro-ceramic heater device. After screen-printing a silver paste between pre-sintered two aluminum oxide plates to integrate a heating circuit, the device was fabricated through a low-temperature sintering process. In order to configure the optimal heating circuit integration condition, the output current evaluation and heating test were performed according to the number of screen prints of the silver paste at various voltages. A silver paste-based heating circuit printed with a line width of 200 ㎛ and a thickness of 60 ㎛ was successfully integrated on a pre-sintered alumina substrate through a low-temperature sintering process. In the case of the 5 times printed device, the thermal response showed a response rate of 18.19 ℃/sec. To demonstrate feasibility of the proposed device in the medical field, such as bio-tissue suturing and hemostasis, a voltage was applied to pig tissue in the device to test tissue change due to heat generated from the device. These results show the possibility that the proposed small ceramic heater could be used in the medical field based on its excellent temperature response.

• Composites Research
• /
• v.17 no.5
• /
• pp.61-67
• /
• 2004

This paper reports the electrical conductivity and the stress-strain behavior of silver particle-filled silicone composite pastes for electromagnetic interference (EMI) shielding gasket materials. The percolation threshold (critical concentration) of the composite paste obtained by incorporating irregular sphere-shaped silver particles and room temperature vulcanizing (RTV) silicone resin was determined from the electrical conductivity result. At about 28 vol% Beading of untreated silver particles, the percolation phenomenon occurred and at this critical concentration, the volumetric resistivity, the tensile strength, and the elongation of the pastes were investigated. This work also suggests that the stress-strain characteristics of a composite paste filled with metal particles above the percolation threshold may be effectively improved by properly selecting a coupling agent.

• Korean Journal of Materials Research
• /
• v.29 no.1
• /
• pp.37-42
• /
• 2019

This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1998.06a
• /
• pp.121-124
• /
• 1998

Generally the structure of powder electroluminescent devices (PELDs) on ITO-film was makeup of the ZnS:Cu phosphor layer and BaTiO$_3$ insulating layer. The active layer, which consists of a suitably doped ZnS powder mixed in a dielectric, is sandwiched between two electrodes; one of which are ITO film and the other is aluminum. In this paper, three kinds of powder eleotroluminescent devices (PELDs) : WK-A(ITO/BaTiO$_3$/ZnS:Cu/Silver paste). WK-B(ITO/BaTiO$_3$+ZnS:Cu/Silver paste) and WK-C(ITO/BaTiO$_3$/ZnS:Cu/BaTiO$_3$/Silver paste), fabricated by spin coating method, were investigated. To evaluate the luminescence properties of three kinds of PELDs, EL emission spectroscopy, transferred charge density and time response of EL emission intensity under square wave voltage driving were measured.

• Bulletin of the Korean Chemical Society
• /
• v.33 no.12
• /
• pp.3987-3992
• /
• 2012

Silver nanopowders were prepared from silver 2-ethylhexylcarbamate (Ag-EHCB) complexes by simple thermal reduction at $85^{\circ}C$ without any reducing agent in organic solvent. 2-Ethylhexylammonium 2-ethylhexylcarbamate (EHAEHC) was investigated in terms of their abilities to stabilize the silver nanoparticles (Ag-NPs) and its subsequent effects on the preventing aggregation between Ag-NPs. Conditions (concentration of stabilizer and reaction time) used to reduce Ag-EHCB complex were systematically varied to determine their effects on the sizes of Ag-NPs. The formation of the stabilized Ag-NPs were easily monitored by UV-vis spectroscopy and characterized by TGA, TEM, SEM and XRD. When EHAEHC was used as a stabilizer, Ag-NPs of 10-30 nm in diameter were easily obtained in high yield. Silver patterns were obtained from a silver nano-paste by heat treatment at $200^{\circ}C$ in air and were found to have resistivity values of $2.9{\times}10^{-8}\;{\Omega}{\cdot}m$.

• Journal of the Korean Ceramic Society
• /
• v.41 no.4
• /
• pp.313-322
• /
• 2004

Thick film photolithography is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process including screen-printing. In this research, low-temperature cofireable silver paste, which enabled the formation of thick film fine-line using photolithographic technology, was developed. The optimum composition for fine-line forming was studied by adjusting the amounts of silver powder, polymer and monomer, and the additional amount of photoinitiator, and then the effect of processing parameter such as exposing dose on the formation of fine-line was also tested. As the result, it was found that the ratio of polymer to monomer, silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of fine-line. The developed photosensitive silver paste was printed on low-temperature cofireable green sheet, then dried, exposed, developed in aqueous process, laminated, and fired. Results showed that the thick film fine-line under 20$\mu\textrm{m}$ width could be obtained after cofiring.

• Applied Chemistry for Engineering
• /
• v.29 no.6
• /
• pp.782-788
• /
• 2018

Submicron copper-silver core-shell (Cu@Ag) particles were synthesized using the sonochemical combined transmetallation reaction and the application to printed electronics as a low cost conductive paste was evaluated. $Cu_2O$ of the $Cu_2O/Cu$ composite used as a core in the reaction for the synthesis of core-shell was sonochemically reduced to Cu, and Cu atoms functioned as a reducer for silver ions in transmetallation to achieve the copper-silver core-shell structure. The characterization of submicron particles by TEM-EDS and TG-DSC confirmed the core-shell structure. Conductive pastes in which 70 wt% Cu@Ag was dispersed in solvents were prepared using a binder and wetting agents, and coated on the polyamide film using a screen-printing method. Printed paste films containing synthesized Cu@Ag particles with 8 at% and 16 at% Ag exhibited low resistivity of 96.2 and $38.4{\mu}{\Omega}cm$ after sintering at $180^{\circ}C$ in air, respectively.

• Journal of the Korean Graphic Arts Communication Society
• /
• v.29 no.2
• /
• pp.45-58
• /
• 2011

Gravure off-set printing recently is used in electronics display market. This method has advantages of mass production and high printing speed. It is also fine pattern can be implemented. We have manufactured low-curable conductive Ag pastes for gravure off-set printing. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape and size, epoxy resin, solvent and homogenized on a standard three-roll mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had a good characteristics. With the manufactured paste in this study, touch panel had is manufactured and it had $4{\times}10-5{\Omega}.cm$.

• Transactions on Electrical and Electronic Materials
• /
• v.18 no.4
• /
• pp.181-184
• /
• 2017

Multilayer ceramics in which piezoelectric layers of $0.90Pb(Zr_{0.48}Ti_{0.52})O_3-0.05Pb(Mn_{1/3}Sb_{2/3})O_3-0.05Pb(Zn_{1/3}Nb_{2/3})O_3$ (0.90PZT-0.05PMS-0.05PZN) stack alternately with silver electrode layers were prepared by an advanced low-temperature co-fired ceramic (LTCC) method. The electrical properties and bonding strength of the multilayers were associated with the interface morphologies between the piezoelectric and silver-electrode layers. Usually, the inner silver electrodes are fabricated by sintering silver paste in multi-layer stacks. To improve the interface bonding strength, piezoelectric powders of 0.90PZT-0.05PMS-0.05PZN with an average particle size of $23{\mu}m$ were added to silver paste to form a gradient interface. SEM observation indicated clear interfaces in multilayer ceramics without powder addition. With the increase of piezoelectric powder addition in the silver paste, gradient interfaces were successfully obtained. The multilayer ceramics with gradient interfaces present greater bonding strength as well as excellent piezoelectric properties for 30~40 wt% of added powder. On the other hand, over addition greatly increased the resistance of the inner silver electrodes, leading to a piezoelectric behavior like that of bulk ceramics in multilayers.

• Journal of the Korean Chemical Society
• /
• v.20 no.4
• /
• pp.280-289
• /
• 1976

The silver selenide electrode has been prepared and its properties as an indicating electrode for silver ion have been investigated. Epoxy resin was used as a filler of silver selenide electrode. Silver metal plate was directly connected with the membrane of the electrode and the silver paste was used as its binder. The sintered electrode was more sensitive and stable than the pressed electrode, and the silver selenide electrode more sensitive than the silver sulfide electrode to silver ion. The linear relationship between the electrode potential and logarithmic concentration of silver ion has been observed down to 10-6 M for the electrode. Several heavy metal ions except mercuric ion did not interfere this linearity, but halide, cyanide, and thiocyanate ions did intensively interfere owing to the formation of silver compounds and complexes. This electrode has been applied to the potentiometric titration for determining halide ion. It is concluded that interferences from ,$CN^-, SCN^-, S^-, I^-, Br^-, Cl^- and Hg^{2+}$ ions are detrimental to the practical use of the electrodes for measuring pAg.