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Stress-Strain Behavior and Electrical Resistive of Conductive Silver Particle/Silicone Composite Pastes with Surface Modification  

이건웅 (한국과학기술연구원 고분자하이브리드연구센터)
방대석 (금오공과대학교 고분자공학과)
박민 (한국과학기술연구원 고분자하이브리드연구센터)
조동환 (금오공과대학교 고분자공학과)
Publication Information
Composites Research / v.17, no.5, 2004 , pp. 61-67 More about this Journal
Abstract
This paper reports the electrical conductivity and the stress-strain behavior of silver particle-filled silicone composite pastes for electromagnetic interference (EMI) shielding gasket materials. The percolation threshold (critical concentration) of the composite paste obtained by incorporating irregular sphere-shaped silver particles and room temperature vulcanizing (RTV) silicone resin was determined from the electrical conductivity result. At about 28 vol% Beading of untreated silver particles, the percolation phenomenon occurred and at this critical concentration, the volumetric resistivity, the tensile strength, and the elongation of the pastes were investigated. This work also suggests that the stress-strain characteristics of a composite paste filled with metal particles above the percolation threshold may be effectively improved by properly selecting a coupling agent.
Keywords
electrically conductive paste; volumetric resistivity; stress-strain; silver powder; silicone resin;
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