• KIEE International Transactions on Electrophysics and Applications
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• 제5C권1호
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• pp.23-27
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• 2005

We observed that optical properties of silicon changed under high dose electron irradiation at 250 keV. Our experimental results revealed that the optical transmission through a silicon wafer is significantly increased by electron irradiation. Transmission increase by the change in the absorption coefficient is explained through an analogy with amorphous silicon. Moreover, solar cell open-circuit voltages indicated that defects were generated by electron irradiation, and that the defects responded to annealing. Our results demonstrated that the optical properties of silicon can be controlled by a combination of electron irradiation and hydrogen annealing.

• 한국결정성장학회지
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• 제11권3호
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• pp.89-95
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• 2001

규소 결정의 용융 온도 근처인 $1350^{\circ}C$에서 Ar과 $O_{2}$gas를 이용하여 규소 wafer의 열처리시 vacancy ty[e 결함의 거동에 대해 알아보았다. 이 열처리에서는 wafer의 표면보다 wafer내부에서 결함의 용해속도가 매우 높음을 확인하였다. 이는 $1350^{\circ}C$에서는 규소내의 평형산소농도가 대부분의 CZ silicon에서의 산소농도보다 높아 산소의 understaturation현상과 silicon interstitial농도의 영향에 기인된 것으로 예상된다. 열처리 분위기의 영향을 알아보기 위하여 Ar과 $O_{2}$ 분위기에서 열처리한 결과 vacancy type 결함의 용해속도는 wafer의 내부에서는 차이가 없었고, wafer의 표면에서는 Ar이 $O_{2}$의 경우보다 결함의 용해속도가 높았다. $O_{2}$의 경우에는 표면산화막 성장시 유입된 silicon interstitial의 농도가 높아 결함의 용해속도가 떨어지는 것으로 판단된다. 이는 기존 연구에서 예상된 silicon interstitial이 vacancy cluster로 알려진 결정결함의 제거에 기여한다는 예상과는 상반된다. 본 연구의 결과 silicon interstitial의 존재는 void외부 산화막의 용해속도를 늦추어 결함 용해속도를 떨어뜨리는 것으로 예상된다.

• 한국표면공학회지
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• 제31권5호
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• pp.237-244
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• 1998

In this stydy, submicron shallow trenches applied to STI(shallow tench isolation) were etched using inductively coupled $CI_2$/HBr and $CI_2/N_2$plasmas and the physical and electrical defects remaining on the etched silicon trench surfaces and the effects of various annealing and oxidation on the removal of the defects were studied. Using high resolution electron microscopy(HRTEM), Physical defects were investigated on the silicon trench surfaces etched in both 90%$CI_2$/ 10%$N_2$ and 50%$CI_2$/50%HBr. Among the areas in the tench such as trench bottom, bottom edge, and sidewall, the most dense defects were found near the trench bottom edge, and the least dense defects were found near the trench bottom edge, and least dense defects compared to that etched with ment as well as hydrogen permeation. Thermal oxidation of 200$\AA$ atthe temperature up to $1100^{\circ}C$apprars not to remove the defects formed on the etched silicon trenches for both of the etch conditions. To remove the physicall defects, an annealing treatment at the temperature high than $1000^{\circ}C$ in N for30minutes was required. Electrical defects measured using a capacitance-voltage technique showed the reduction of the defects with increasing annealing temperature, and the trends were similar to the results on the physical defects obtained using transmission electron microscopy.

• 한국결정성장학회지
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• 제15권2호
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• pp.45-50
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• 2005

규소 표면의 기계적 손상은 산화 공정 중에 규소 표면에 여러 가지 형태의 결함들을 발생 시킨다. 규소 표면에 손상을 주는 마모 입자가 커짐에 따라 OISF보다는 etch pit의 형상이 동굴형인 선 결함(line defects)들이 많이 발생된다. 이들 결함들은 실리콘 결정을 성장시키는 단계에서 형성되는 결함들과는 상호 관련이 없다. 방향성 응고법으로 성장된 규소 결정속에 존재하는 결함들은 주로 twin과 stacking fault들이며 응고과정에서 발생이 예상되는 응력에 의한 전위는 거의 발견되지 않았다. 따라서 Czochralski 법으로 성장된 단 결정 규소뿐 아니라 방향성 응고법으로 성장된 다 결정 규소 기판도 표면의 결함들을 이용하여 extrinsic gettering을 통한 규소 결정 내부의 불순물 제거의 가능성이 높다.

• Applied Science and Convergence Technology
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• 제23권3호
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• pp.113-127
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• 2014

For more than five decades, silicon has dominated the semiconductor industry that supports memory devices, ICs, photovoltaic devices, etc. Photoluminescence (PL) is an attractive silicon characterization technique because it is contactless and provides information on bulk impurities, defects, surface states, optical properties, and doping concentration. It can provide high resolution spectra, generally with the sample at low temperature and room-temperature spectra. The photoluminescence properties of silicon at low temperature are reviewed and discussed in this study. In this paper, silicon bulk PL spectra are shown in multiple peak positions at low temperature. They correspond with various impurities such as In, Al, and Be, phonon interactions, for example, acoustical phonons and optical phonons, different exciton binding energies for boron and phosphorus, dislocation related PL emission peak lines, and oxygen related thermal donor PL emissions.

• 대한치과의사협회지
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• 제47권9호
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• pp.596-606
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• 2009

Aim : The ultimate goal of periodontal treatment is regeneration of periodontium that have been lost due to inflammatory periodontal disease. Recently, Silicon contained Coralline Hydroxyapatite and Beta Tricalcium Phosphate bone substitute have been introduced to achieve periodontal regeneration. The purpose of this study is to evaluate the effect of the Silicon contained Coralline Hydroxyapatite and Beta Tricalcium Phosphate(BoneMedik-$DM^{(R)}$, Meta Biomed Co., Ltd. Oksan, Korea) on periodontal intrabony defects. Methods and materials : Clinical effects of Silicon contained Coralline Hydroxyapatite and Beta Tricalcium Phosphate implantation in intrabony defects were evaluated 6 months after surgery in Sixty-one intrabony defects from Fourty-six patients with chronic periodontitis. Twenty-nine experimental defects in twenty-five patients received the Silicon contained Coralline Hydroxyapatite and Beta Tricalcium Phosphate(test group), while Thirty-Three defects in twenty-one patients were treated with flap procedure only( control group). Comparative observation were done for preoperative and postoperative differences between control and experimental clinical parameters,-clinical attachment 10ss(CAL), probing depth(PD), bone probing depth(BPD), gingi val recession. Results : Postoperative improvements in CAL, PD, BPD were observed in both test and control groups(P<0.0l). However, the improvements in CAL, PD, BPD of the test group were significantly greater than control group. Conclusion : Healing of the both groups were uneventful during experimental periods. Use of Silicon contained Coralline Hydroxyapatite and Beta Tricalcium Phosphate in a flap operation resulted in significantly greater improvements in CAL, PD, and BPD over flap operation alone. Silicon contained Coralline Hydroxyapatite and Beta Tricalcium Phosphate will be good bone substitute materials for treatment of intrabony defects.

• 한국정밀공학회지
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• 제28권5호
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• pp.606-613
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• 2011

In this paper, patterns of laser scattering and detection of micro defects have been investigated based on Rayleigh criterion for silicon wafer in solar cell. Also, a new laser scattering mechanism is designed using characteristics of light scattering against silicon wafer surfaces. Its parameters are to be optimally selected to obtain effective and featured patterns of laser scattering. The optimal parametric ranges of laser scattering are determined using the mean intensity of laser scattering. Scattering patterns of micro defects are investigated at the extracted parameter region. Among a lot of pattern features, both maximum connected area and number of connected component in patterns of laser scattering are regarded as the important information for detecting micro defects. Their usefulness is verified in the experiment.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1083-1086
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• 2005

Light scattering measurement system that can evaluate light scattering characteristic from defects on silicon wafer surface has been developed. The system uses $Ar^+$ laser as an illumination source, and a highly sensitive photomultiplier tube (PMT) for detecting scattered light from defects. Unlike with conventional measurement system, our system has ability to measure scattered light pattern from wide range of scattering angles with changeable incidence condition. It is shown that our developed system is effective to discriminate the types and sizes of defects from basic experimental results using a microscatch and a PSL sphere.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 하계종합학술대회논문집
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• pp.335-338
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• 1998

We have calculated ultra-low energy silicon-self ion implantations and silicon damages through classical molecular dynamics simulation using empirical potentials. We tested whether the recently developed environment-dependent interatomic ptential (EDIP) was suitable for ultra low ion implantation simulation, and found that point defects formation energies were in good agrrement with other theoretical calculations, but the calculated vacancy migration energy was overestimated. The number of isolated defects that are produced by collision cascades are onlya few of the total number of defects, and fmost of the damages are concentrated into amorphous-like pockets.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.185-186
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• 2005

Intrinsic gettering is usually used to improve wafer quality which is an important factor for reliable ULSI devices. The two-step annealing method was adopted in order to investigate interactions between oxygens and secondary defects during oxygen precipitation process in lightly and heavily boron doped silicon wafers with high energy $^{11}B^+$ ion implantation. Secondary defects were inspected nearby the projected range by high resolution transmission electron microscopy. Oxygen pileup was measured in the vicinity of the projected range by secondary ion mass spectrometry for heavily boron doped silicon wafers.