Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
권호 표지

Investigation of Laser Scattering Pattern and Defect Detection Based on Rayleigh Criterion for Crystalline Silicon Wafer Used in Solar Cell

태양전지 실리콘 웨이퍼에서의 레일리기준 기반 레이저산란 패턴 분석 및 결함 검출

  • Yean, Jeong-Seung (Graduate School, Aeronautical & Mechanical Design Eng., Chungju National Univ.) ;
  • Kim, Gyung-Bum (Aeronautical & Mechanical Design Eng., Chungju National Univ.)
  • 연정승 (충주대학교 항공기계설계학과 대학원) ;
  • 김경범 (충주대학교 항공기계설계학과)
  • Received : 2010.09.02
  • Accepted : 2011.02.07
  • Published : 2011.05.01
Download PDF
⟨ Previous Next ⟩

Abstract

In this paper, patterns of laser scattering and detection of micro defects have been investigated based on Rayleigh criterion for silicon wafer in solar cell. Also, a new laser scattering mechanism is designed using characteristics of light scattering against silicon wafer surfaces. Its parameters are to be optimally selected to obtain effective and featured patterns of laser scattering. The optimal parametric ranges of laser scattering are determined using the mean intensity of laser scattering. Scattering patterns of micro defects are investigated at the extracted parameter region. Among a lot of pattern features, both maximum connected area and number of connected component in patterns of laser scattering are regarded as the important information for detecting micro defects. Their usefulness is verified in the experiment.

Keywords

References

  1. Lee, J. H., "Current status and future prospects of solar cell," J. of KSPE, Vol. 25, No. 10, pp. 7-22, 2008.
  2. Cho, Y. H., "Solar Cell," KISTI, 2002.
  3. Byelyayev, A., "Stress diagnostics and crack detection in full-size silicon wafers using resonance ultrasonic vibrations," Department of Electrical Engineering, Ph. D. Thesis, University of South Florida, 2005.
  4. Hilmersson, C., Hess, D. P., Dallas, W. and Ostapenko, S., "Crack detection in single-crystalline silicon wafers using impact testing," Applied Acoustics, Vol. 69, No. 8, pp. 775-760, 2008.
  5. Tsai, D. M., Chang, C. C. and Chao, S. M., "Microcrack inspeciton in heterogeneously textured solar wafers using anisotropic diffusion," Image and Vision Computing, Vol. 28, No. 3, pp. 491-501, 2010. https://doi.org/10.1016/j.imavis.2009.08.001
  6. Hong, Y. K. and Kim, G. B., "A study on the analysis of laser scattering characteristics depending on surface shapes," Proceeding of KSPE Spring Conference, pp. 473-474, 2009.
  7. Han, J. C. and Kim, G. B., "A Study on the optimal condition determination of laser scattering using the design of experiment," J. of KSPE, Vol. 7, No. 7, pp. 58-64, 2009.
  8. Stover, J. C., "Optical Scattering Measurement and Analysis 2nd Edition," SPIE Press, 1995.
  9. Beckmann, P. and Spizzichino, A., "The Scattering of electromagnetic waves from rough surface," Pergamon Press, 1963.
  10. Nayar, S. K., Ikeuchi, K. and Kanade, T., "Surface reflection: physical and geometrical perspectives," IEEE Pattern Analysis and Machine Intelligence, Vol. 13, No. 7, pp. 611-634, 1991. https://doi.org/10.1109/34.85654
  11. Bakolias, C., "Oblique imaging of scattered light for surface inspection," Department of Mechanical Engineering, Ph. D. Thesis, London University, 1996.
  12. Guo, R. and Tao, Z., "The modified Beckmann- Kirchhoff scattering theory for surface characteristics in process measurement," Optics and Laser in Engineering, Vol. 47, No. 11, pp. 1205-1211, 2009. https://doi.org/10.1016/j.optlaseng.2009.06.001