• 센서학회지
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• 제21권1호
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• pp.34-38
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• 2012

We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.

• Journal of Information Display
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• 제5권2호
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• pp.1-5
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• 2004

We developed an a-Si TFT-LCD panel with integrated gate driver circuit using a standard 5-MASK process. To minimize the effect of the a-Si TFT current and LC's capacitance variation with temperature, we developed a new a-Si TFT circuit structure and minimized coupling capacitance by changing vertical architecture above gate driver circuit. Integration of gate driver circuit on glass substrate enables single chip and 3-side free panel structure in a-Si TFT-LCD of QVGA ($240{\times}320$) resolution. And using double ASG structure the dead space of TFT-LCD panel could be further decreased.

• Current Optics and Photonics
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• 제8권4호
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• pp.399-405
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• 2024

In this paper, an optical modulator based on monolayer graphene and triple-layer black phosphorus (BP) heterojunction in the optical communication band range is designed. The influences of geometric parameters, chemical potential, BP orientation and dispersion on the fundamental mode of this modulator were determined in detail by the finite-difference time-domain (FDTD) method. Using appropriate geometric parameter settings, the extinction ratio of this proposed modulator is 0.166 dB, while the modulator with a working length of 3 ㎛ can realize a 0.498 dB modulation depth. The 3-dB bandwidth of this modulator could achieve up to 2.65 GHz with 27.23 fJ/bit energy consumption. The extinction ratio and bandwidth of the proposed modulator increased by 66% and 120.83%, respectively, compared to the monolayer graphene-based ridge-type waveguide modulator. Energy consumption was reduced by 97.28%, compared to a double-layer graphene-based modulator.

• Biotechnology and Bioprocess Engineering:BBE
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• 제9권2호
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• pp.118-126
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• 2004

Recombinant E.coli ACV 1003 (recA::lacZ) releasing ${\beta}$-galactosidase by a SOS regulon system, when exposed to DNA-damaging compounds, have been used to effectively monitor endocrine disruptors. Low enzyme activity of less than 10 units/mL, corresponding to a $\mu\textrm{g}$/L(ppb) range of an endocrine disruptor (tributyl tin, bisphenol A. etc.), can be rapidly determined, not by a conventional time-consuming and tedious enzyme assay, but by an alternative interferometric biosensor. Heavily boron-doped porous silicon for application as an interferometer, was fabricated by etching to form a Fabry-Perot fringe pattern, which caused a change in the refractive index of the medium including ${\beta}$-galactosidase. In order to enhance the immobilization of the porous silicon surface, a calyx crown derivative (ProLinker A) was applied, instead of a conventional biomolecular affinity method using biotin. This resulted in a denser linked formation. The change in the effective optical thickness versus ${\beta}$-galactosidase activity, showed a linear increase up to a concentration of 150 unit ${\beta}$-galactosidase/mL, unlike the sigmoidal increase pattern observed with the biotin.

• 전기학회논문지
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• 제60권9호
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• pp.1733-1740
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• 2011

In this research, a MEMS vibratory gyroscope with dual-mass system in the sensing mode has been proposed to increase the stability of the device using wide bandwidth. A wide flat region between the two resonance peaks of the dual-mass system removes the need for a frequency matching typically required for single mass vibratory gyroscopes. Bandwidth, mass ratio, spring constant, and frequency response of the dual-mass system have been analyzed with MATLAB and ANSYS simulation. Designed first and second peaks of sensing mode are 5,917 and 8,210Hz, respectively. Driving mode resonance frequency of 7,180Hz was located in the flat region between the two resonance peaks of the sensing mode. The device is fabricated with anodically bonded silicon-on-glass substrate. The chip size is 6mm x 6mm and the thickness of the silicon device layer is $50{\mu}m$. Despite the driving mode resonance frequency decrease of 2.8kHz and frequency shift of 176Hz from the sensing mode due to fabrication imperfections, measured driving frequency was located within the bandwidth of sensing part, which validates the utilized dual-mass concept. Measured bandwidth was 768Hz. Sensitivity calculated with measured displacement of driving and sensing parts was 22.4aF/deg/sec. Measured slope of the sensing point was 0.008dB/Hz.

• Journal of Electrochemical Science and Technology
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• 제7권3호
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• pp.218-227
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• 2016

The light harvesting efficiency is counted as an important factor in the power conversion efficiency of DSSCs. There are two measures to improve this parameter, including enhancing the dye-loading capacity and increasing the light trapping in the photoanode structure. In this paper, these tasks are addressed by introducing a macro-porous silicon (PSi) substrate as photoanode. The effects of the novel photoanode structure on the DSSC performance have been investigated by using energy dispersive X-ray spectroscopy, photocurrent-voltage, UV-visible spectroscopy, reflectance spectroscopy, and electrochemical impedance spectroscopy measurements. The results indicated that bigger porosity percentage of the PSi structure improved the both anti-reflective/light-trapping and dye-loading capacity properties. PSi based DSSCs own higher power conversion efficiency due to its remarkable higher photocurrent, open circuit voltage, and fill factor. Percent porosity of 64%, PSi(III), resulted in nearly 50 percent increment in power conversion efficiency compared with conventional DSSC. This paper showed that PSi can be a good candidate for the improvement of light harvesting efficiency in DSSCs. Furthermore, this study can be considered a valuable reference for more investigations in the design of multifunctional devices which will profit from integrated on-chip solar power.

• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.51-57
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• 2013

The current expanding mobile markets incessantly demands small form factor, low power consumption and high aggregate throughput for silicon-level integration such as memory to logic system. One of emerging solution for meeting this high market demand is 3D through silicon stacking (TSS) technology. Main challenges to bring 3D TSS technology to the volume production level are establishing a cost effective supply chain and building a reliable manufacturing processes. In addition, this technology inherently help increase number of IOs and shorten interconnect length. With those benefits, however, potential signal and power integrity risks are also elevated; increase in PDN inductance, channel loss on substrate, crosstalk and parasitic capacitance. This paper will report recent progress of wide IO memory to high count TSV logic device assembly development work. 28 nm node TSV test vehicles were fabricated by the foundry and assembled. Successful integration of memory wide IO chip with less than a millimeter package thickness form factor was achieved. For this successful integration, we discussed potential signal and power integrity challenges. This report demonstrated functional wide IO memory to 28 nm logic device assembly using 3D package architecture with such a thin form factor.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 추계학술대회 논문집 전기물성,응용부문
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• pp.60-63
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• 2002

This paper presents bead-based microbiocihps to detect and separate target proteins. Micro beads coated with capture proteins were introduced into a microchamber, and target proteins flowing across the chamber were bound and concentrated. The chip was connected with an external fluid system. Bead surfaces were double-coated with photo-cleavable linkers and capture proteins. The proteins bound on the beads were photo-separated under UV irradiation, and excited to be measured in fluorescence. $38{\sim}50{\mu}m$ sized polystyrene beads were used. SOGs(silicon-on-glass) were used to fabricate the microchip having glasses bonded on both sides. 100 ${\mu}m$ thick silicon channel was formed through silicon deep RIE process. The upper glass cover had holed through to have inlets and outlets fabricated by powder-blastings. In this study, biotin and streptavidin were used as capture proteins and detection proteins, respectively. The protein mixtures of streptavidin, HSA(human serum albumin) and ovalbumin were applied for selective detection test.

• Design & Manufacturing
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• 제7권1호
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• pp.55-59
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• 2013

A Light Emitting Diode(LED) is a semiconductor device which converts electricity into light. LEDs are widely used in a field of illumination, LCD(Liquid Crystal Display) backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. In general, LEDs production does die bonding and wire bonding on board, and do silicon and phosphor dispensing to protect LED chip and improve brightness. Then lens molding process is performed using mixed liquid silicon rubber(LSR) by resin and hardener. A mixture of resin and hardener affect the optical characteristics of the LED lens. In this paper, computational design of static mixer was performed for mixing of liquid silicon. To evaluate characteristic of mixing efficiency, finite element model of static mixer was generated, and fluidic analysis was performed according to length of mixing element. Finally, optimal condition of length of mixing element was applied to static mixer from result of fluidic analysis.

• Transactions on Electrical and Electronic Materials
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• 제16권1호
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• pp.10-15
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• 2015

A thin-film transmission line (TFTL) employing a microstrip line/coplanar waveguide (ML/CPW) was fabricated on a silicon substrate for application to a miniaturized on-chip RF component, and the RF characteristics of the device with the proposed structure were investigated. The TFTL employing a ML/CPW composite structure exhibited a shorter wavelength than that of a conventional coplanar waveguide and that of a thin-film microstrip line. When the TFTL with the proposed structure was fabricated to have a length of ${\lambda}/8$, it showed a loss of less than 1.12 dB at up to 30 GHz. The improvement in the periodic capacitance of the TFTL caused for the propagation constant, ${\beta}$, and the effective permittivity, ${\varepsilon}_{eff}$, to have values higher than those of a device with only a conventional coplanar waveguide and a thin film microstrip line. The TFTL with the proposed structure showed a ${\beta}$ of 0.53~2.96 rad/mm and an ${\varepsilon}_{eff}$ of 22.3~25.3 when operating from 5 to 30 GHz. A highly miniaturized impedance transformer was fabricated on a silicon substrate using the proposed TFTL for application to a low-impedance transformation for broadband. The size of the impedance transformer was 0.01 mm2, which is only 1.04% of the size of a transformer fabricated using a conventional coplanar waveguide on a silicon substrate. The impedance transformer showed excellent RF performance for broadband.