• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.130-133
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• 2003

Vertical Colour Selection (VCS) is an option for slim CRTs with increased sharpness and brightness. The direction of self-convergence of the DY is changed to vertical in order to obtain better spot uniformity, but the line scan direction remains horizontal. Hence, no video conversion is needed, contrary to transposed scan. In this paper we address two issues: First, there is a high risk of moire, since the scan lines and the phosphor stripes are parallel. We propose a feedback mechanism guiding the electron beams towards the middle of the mask slots. As positive side effects, the brightness is improved and the shadow mask can be made of a cheap type of steel. Secondly, VCS deflection coils have to satisfy different requirements than coils in ordinary CRTs. We discuss the design rules for self-convergent VCS coils and present simulation results.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.10a
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• pp.51-55
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• 2004

A composite Iso-grid panel is manufactured and tested by compressive load. Vertical stringers and side stringers are joined with skin by secondary bonding using a liquid type adhesive. Bonding fixtures were developed to attach the stringers to skin. A-scan was done for inspection of secondary bonding region. The out of displacement field is visualized by shadow moire system. The strain and vertical displacement are measured by strain gages and L VDT (Linear Variable Differential Transformer). A local buckling is occurred at all grid sections. After that, the final failure is occurred. The strain of side stringer is much less than that of vertical stringer and skin. Due to the side stringer, the local buckling is delayed. Therefore the ratio of the first buckling to failure load is greater than that of vertical stringer stiffened panel.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.43-48
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• 2022

In this study, simulation method was developed to improve the accuracy of the warpage simulation based on the equivalent anisotropic viscoelastic model. First, a package with copper traces and bumps was modeled to implement anisotropic viscoelastic behavior. Then, equivalent anisotropic viscoelastic properties and thermal expansion coefficient for the bump region were derived through the representative volume element model. A thermal cycle of 0 to 125 degrees was applied to the package based on the derived mechanical properties, and the warpage according to the thermal cycle was simulated. To verify the simulation results, the actual package was manufactured, and the warpage with respect to the thermal cycle was measured through shadow moiré interferometer. As a result, by applying the equivalent anisotropic viscoelastic model, it was possible to calculate the warpage of the package within 5 ㎛ error and predict the shape of the warpage.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.81-87
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• 2012

This paper focuses on three-dimensional measurement system of micro balls on micro Ball-Grid-Array(BGA) packages in-line. Most of visual inspection system still suffers from sophisticate reflection characteristics of micro balls. For accurate shape measurement of them, a specially designed visual sensor system is proposed under the sensing principle of phase shifting moire interferometry. The system consists of a pattern projection system with four projection subsystems and an imaging system. In the projection system, four subsystems have spatially different projection directions to make target objects experience the pattern illuminations with different incident directions. For the phase shifting, each grating pattern of subsystem is regularly moved by PZT actuator. To remove specular noise and shadow area of BGA balls efficiently, a compact multiple-pattern projection and imaging system is implemented and tested. Especially, a sensor fusion algorithm to integrate four information sets, acquired from multiple projections, into one is proposed with the basis of Bayesian sensor fusion theory. To see how the proposed system works, a series of experiments is performed and the results are analyzed in detail.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.11
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• pp.1999-2010
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• 1992

The fixed slab analogy device which can measure stress intensity factors(S.I.F) experimentally by slab analogy theory is developed in this paper. The margin of errors resulted from the new testing apparatus are between 0.02% and 8.25%. Therefore, it is assured that this one can be effectively used for the more accurate measurement of S.I.F.( $k_{I}$, $k_{I I}$) than conventional apparatus. The pitch of master grating used in this experiment is 0.1mm It is known that the ratio of the distance from crack tip to the crack length on obtaining the accurate stress intensity factor is between 0.4 and 0.7. The optimum curvature radius of slab is about 125mm. The thickness of slab(plate) used in the fixed slab analogy device is 0.05mm(P.V.C. ; E = 64 MN/ $m^{2}$, .nu.=0.38), which is proved to be suitable for the test. The optimum material for the frame(slab`s external boundary) is a alloy tool steel(SKS 5) plate and its thickness is 1mm. In this research, the rigid cracks are directly bonded to the slab surface by cyanoacrylate adhesive for the easiness of slab making and conformity to the practical crack figure. The material of rigid crack is thin steel plate. It is expected that the developed method can be used effectively for the analysis of $k_{I}$ and $k_{I I}$ of arbitrary shaped or distributed cracks.cks.