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http://dx.doi.org/10.6117/kmeps.2022.29.3.043

Development of Warpage Simulation Method according to Thermal Stress based on Equivalent Anisotropic Viscoelastic Model  

Kim, Heon-Su (Department of Mechanical Convergence Engineering, Hanyang University)
Kim, Hak-Sung (Department of Mechanical Convergence Engineering, Hanyang University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.3, 2022 , pp. 43-48 More about this Journal
Abstract
In this study, simulation method was developed to improve the accuracy of the warpage simulation based on the equivalent anisotropic viscoelastic model. First, a package with copper traces and bumps was modeled to implement anisotropic viscoelastic behavior. Then, equivalent anisotropic viscoelastic properties and thermal expansion coefficient for the bump region were derived through the representative volume element model. A thermal cycle of 0 to 125 degrees was applied to the package based on the derived mechanical properties, and the warpage according to the thermal cycle was simulated. To verify the simulation results, the actual package was manufactured, and the warpage with respect to the thermal cycle was measured through shadow moiré interferometer. As a result, by applying the equivalent anisotropic viscoelastic model, it was possible to calculate the warpage of the package within 5 ㎛ error and predict the shape of the warpage.
Keywords
Package; Warpage; Anisotropic viscoelastic property; Representative volume element model; Finite element method;
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