• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.119-123
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• 2016

In this paper, we have fabricated the position detection system with LED and optical sensor to detect a position and trace of robot through visible light communication (VLC). The fabricated position detection system did not have been affected by sunlight in outdoor and a fluorescent light in building. Because 4 LEDs, respectively, transmitted different signals, we have known the position of robot. And we have also observed a trajectory of robot in real time.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.25-29
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• 2002

We have fabricated a vertical trench Hall device which is sensitive to the magnetic field parallel to the sensor surface. The vertical trench Hall device has been built on SOI wafer which is produced by silicon direct bonding technology using bulk micromachining, where buried $SiO_2$ layer and surround trench define active device volume. Sensitivity up to 150 V/AT has been measured.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.7
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• pp.1218-1223
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• 2007

A surface micro machined angular rate sensor utilizing a vibrating MEMS structure on a silicon has been developed. These tuning fork angular rate sensors are extremely rugged, inherently balanced, and easy to fabricate. The device is fabricated using a temperature compensation method based on automatic gain control technique. A linearity of approximately 0.6%, limited by the on-chip electronics has been obtained with this new sensor. Tests of the sensor demonstrate that its performance is equivalent to that required for implementation of a yaw control system. Vehicle handling and safety are substantially improved using the sensor to implement yaw control.

• Proceedings of the IEEK Conference
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• 2009.05a
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• pp.344-346
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• 2009

Cell type packaging line is more suitable for the products with various models and small quantities like mobile phone or mp3 player than conveyor type packaging line. Cell type packaging line is applicable to package various product models, but it can cause wrong product compositions and missing of items. So, automatic missing item detection system is needed. We designed an missing item detection system with a bar code reader, infrared sensors, and s digital camera. and also developed the programs for sensor data acquisition, image data processing, GUI, and data management.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.19-24
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• 2014

This article reviews the recent progress in nanowell array biosensors that use the label-free detection protocol, and are detected in their natural forms. These nanowell array biosensors are fabricated by nanofabrication technologies that should be useful for developing highly sensitive and selective also reproducible biosensors. Moreover, electrochemical method was selected as analysis method that has high sensitivity compared with other analysis. Finally, highly sensitive nanobiosensor was achieved by combining nanofabrication technologies and classical electrochemical method. Many examples are mentioned about the sensing performance of nanowell array biosensors will be evaluated in terms of sensitivity and detection limit compared with other micro-sized electrode without nanowell array.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.74-78
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• 2002

MEMS공정을 이용하여 폴리실리콘의 piezoresistivity를 이용한 스트레인 센서어레이를 제작하였고, 이 센서 어레이를 flexible substrate에 패키징하는 공정을 개발하였다. 실리콘 웨이퍼에 표면 가공(surface micromachining)된 센서는 폴리이미드 코팅, release-etch 방법을 통해 웨이퍼로부터 분리되어 폴리이미드를 기판으로 하는 flexible sensor array module을 완성할 수 있었다. 공정은 희생층과 절연층을 증착하고 폴리실리콘 0.5 $\mu\textrm{m}$을 증착, 도핑 및 패터닝하여 센서 어레이를 구성하였다. 이 센서어레이를 flexible substrate에 패키징 하기 위해서 폴리이미드를 코팅하여 15 $\mu\textrm{m}$의 막을 구성하였고, 100% $O_2$RIE를 이용한 선택적 식각 방법으로 via hole을 구성하였다. 이후 전기도금을 통해 회로를 구성하여 1단계 패키징(die to chip carrier)과 2단계 패키징(chip to substrate)을 웨이퍼 레벨에서 완성하였다. 희생층을 제거함으로서 웨이퍼로부터 센서어레이 모듈을 분리하였다. 제작되어진 센서 모듈은 임의의 곡면에 실장이 가능하도록 충분한 flexibility를 얻을 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.49-57
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• 2004

The modified polyionene polyelectrolyte inks were newly prepared and applied to the humidity-sensitive membrane of humidity sensor. The films were fabricated on the alumina substrate with comb-type gold electrode using a ink-jet printing technique. The copolymers of methyl methacrylate, acrylic acid, 2-hydroxyethyl methacrylate and [(2-methacryloyloxy)ethyl]trimethylammonium chloride were also prepared for the humidity-sensing material. which was fabricated by dip-coating method. Electrical measurements under various relative humidity were performed. The humidity-sensitive characteristics of sensors obtained by ink-jet printing technique were compared with that of dip-coating method. Humidity sensors showed a decrease in resistance as an increase of relative humidity and their resistance characteristics are in a close agreement each other.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.57-61
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• 2021

A formation process of indium bump arrays on micro-pillar structures is proposed. The space to form indium bump on the narrow structures can be secured applying the benzocyclobutene (BCB) planarization and its etch-back process. We exhibit a detailed overview of the process steps involved in the fabrication of 320×256 hybrid camera sensor for short-wavelength infrared (SWIR) detection. The shear strength of the BCB, which has undergone the different processes, is extracted by quartz crystal microbalance measurement. The shear strength of the BCB is three orders of magnitude higher than that of the indium bump itself. The measured dark current distribution of the fabricated SWIR camera sensor indicates the suggested process of indium bumps can be useful for embodying highly sensitive infared camera sensors.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.23-29
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• 2017

The packaged optical fiber Bragg grating sensors which were networked by multiplexing the Bragg grating sensors with WDM technology were investigated in application for the structural health monitoring of the marine trestle structure transporting the ship. The optical fiber Bragg grating sensor was packaged in a cylindrical shape made of aluminum tubes. Furthermore, after the packaged optical fiber sensor was inserted in polymeric tube, the epoxy was filled inside the tube so that the sensor has resistance and durability against sea water. The packaged optical fiber sensor component was investigated under 0.2 MPa of hydraulic pressure and was found to be robust. The number and location of Bragg gratings attached at the trestle were determined where the trestle was subject to high displacement obtained by the finite element simulation. Strain of the part in the trestle being subjected to the maximum load was analyzed to be ${\sim}1000{\mu}{\varepsilon}$ and thus shift in Bragg wavelength of the sensor caused by the maximum load of the trestle was found to be ~1,200 pm. According to results of the finite element analysis, the Bragg wavelength spacings of the sensors were determined to have 3~5 nm without overlapping of grating wavelengths between sensors when the trestle was under loads and thus 50 of the grating sensors with each module consisting of 5 sensors could be networked within 150 nm optical window at 1550 nm wavelength of the Bragg wavelength interrogator. Shifts in Bragg wavelength of the 5 packaged optical fiber sensors attached at the mock trestle unit were well interrogated by the grating interrogator which used the optical fiber loop mirror, and the maximum strain rate was measured to be about $235.650{\mu}{\varepsilon}$. The modelling result of the sensor packaging and networking was in good agreements with experimental result each other.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1627-1628
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• 2006

In this paper, mesoporous only platinum electrode and micro pore platinum electrode with mesoporous Pt are fabricated and characterized on a silicon substrate to check their usability as enzymeless sensing electrodes for developing non-disposable glucose sensors integrated with silicon CMOS read out circuitry. Since most of electrochemical glucose sensors are disposable due to the use of the enzymes that are living creatures, these are limited to use in the in-vivo and continuous monitoring system applications. The proposed mesoporous Pt electrode with approximately 2.5nm in pore diameter and 150nm in height was fabricated by using a nonionic surfactant $C_{16}EO_8$ and an electroplating technique. The micro pore Pt electrode with mesoporous Pt means the mesoporous Pt electrode fabricated on top of micro pore arrayed Pt electrode with approximately $10{\mu}m$ in pore diameter and $80{\mu}m$ in height. The measured current responses at 10mM glucose solution of plane Pt, micro pore Pt, micro pore with mesoporus Pt, and mesoporous Pt electrodes are approximately $9.9nA/mm^2$, $92.4nA/mm^2$, $3320nA/mm^2$ and $44620nA/mm^2$, respectively. These data indicate that the mesoporous Pt electrode is much more sensitive than the other Pt electrodes. Thus, it is promising for non-disposable glucose sensor and electrochemical sensor applications.