• Title/Summary/Keyword: sensor failure

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A Study for Failure Examples Including with Timing Belt, Camshaft Position Sensor and Ignition Coil Damage of LPG Vehicle Engine (액화석유가스 자동차 엔진의 타이밍벨트, 캠샤프트포지션센서, 점화코일 손상과 관련된 고장사례에 대한 연구)

  • Lee, IL Kwon;Kook, Chang Ho;Ham, Sung Hoon;Kim, Jee Hyun;Lee, Jae Gang;Han, Seung Min;Hwang, Woo Chan;Hwang, Han Sub;Moon, Hak Hoon;Lee, Jeong Ho
    • Journal of the Korean Institute of Gas
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    • v.26 no.3
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    • pp.54-59
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    • 2022
  • This paper is a purpose to study and analyze the failure examples for timing belt, camshaft position sensor and ignition coil of LPG automotive engine. The first example, whe the service man install the front case bracket of engine, he excessively tightened up a 12mm bolt for being fixed of brackct. As a results, the bolt was separated from joint part so that it was put in between the crankshaft sprocket. Therefore the belt was broken off because of interference between timing belt and sprocket tooth. The second example, it verified the disharmony phenenomen of engine that the gap of the camshaft position sensor and camshaft senseing point assembled on cylinder head part was small more than iregular value so that the it was generated senseing damage phenomenon by pulse signal misconduct. The third example, it was found the engine disharmony phenomenon that the fire in the ignition coil was leaked by inner damage of Number 2 ignition coil.Therefore, the the manager of a car throughtly have to inspect not in order to arise the failure symptoms.

Uncooled Microbolometer FPA Sensor with Wafer-Level Vacuum Packaging (웨이퍼 레벨 진공 패키징 비냉각형 마이크로볼로미터 열화상 센서 개발)

  • Ahn, Misook;Han, Yong-Hee
    • Journal of Sensor Science and Technology
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    • v.27 no.5
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    • pp.300-305
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    • 2018
  • The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

Fabrication and characteristics of vibration sensor using conductive ball (전도성 볼을 이용한 진동센서의 제작 및 특성)

  • Jang, Sung-Wook;Cho, Yong-Soo;Kong, Seong-Ho;Choi, Sie-Young
    • Journal of Sensor Science and Technology
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    • v.14 no.6
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    • pp.374-380
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    • 2005
  • Vibration sensors have a wide scope of applications in the field of monitoring systems that needs to perceive an undesirable physical vibration before a critical failure occurs in a system, and then costly unplanned repairs can be avoided. The conventional vibration sensors developed so far have many disadvantages, such as complex manufacturing process, bulkiness, high cost, less reliability and so on. This paper reports a simple-structured vibration sensor, which has been developed using a commercialized conductive ball and silicon bulk-micromachining technology. The sensor consists of a conductive ball placed in $600{\mu}m$-deep micromachined silicon groove, in which Au thin film has been patterned using a shadow mask technique. Prior to the formation of the Au thin film, the sharp convex corner was rounded for smooth meatl deposition on the non-planar surface at the edge of the groove. The measurement results of the fabricated vibration sensor demonstrate a stable response characteristic to low-frequency vibration range ($1{\sim}30{\;}Hz$).

Fault Tolerant Control of Sensor Fault of EPB System (EPB 시스템의 센서 고장 허용 제어 기법)

  • Lee, Won-Goo;Lee, Young-Ok;Jang, Min-Seok;Lee, Choong-Woo;Chung, Chung-Choo;Chung, Han-Byul
    • Transactions of the Korean Society of Automotive Engineers
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    • v.18 no.4
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    • pp.8-17
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    • 2010
  • In this paper, a fault tolerant control against sensor faults of electric parking brake (EPB) is proposed. Fault tolerant control method of EPB system is strongly demanded since sensor faults can endanger a driver's safety. In this paper, a clamp force estimation method is presented using motor's armature current and angular velocity. Clamp force estimation method is applied for fault detection method with parity equations. The goal of the detection method is to detect and identify faults in encoder, current sensor, force sensor, and parking cable. And a switching logic for fault tolerant control against the three sensor faults is suggested. Experimental results show that the proposed force estimation method satisfies the specifications of EPB system. The effectiveness of the fault detection method is validated with experimental results. Although a single sensor fault happens, EPB system with the proposed fault detection method does not develop into a failure on subsystem or system level.

A Study on the Fail Safety Logic of Smart Air Conditioner using Model based Design (모델 기반 설계 기법을 이용한 지능형 공조 장치의 이중 안전성 로직 연구)

  • Kim, Ji-Ho;Kim, Byeong-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.12
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    • pp.1372-1378
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    • 2011
  • The smart air condition system is superior to conventional air condition system in the aspect of control accuracy, environmental preservation and it is foundation for intelligent vehicle such as electric vehicle, fuel cell vehicle. In this paper, failure analyses of smart air condition system will be performed and then sensor fusion technique will be proposed for fail safety of smart air condition system. A sensor fusion logic of air condition system by using CO sensor, $CO_2$ sensor and VOC, $NO_x$ sensor will be developed and simulated by fault injection simulation. The fusion technology of smart air condition system is generated in an experiment and a performance analysis is conducted with fusion algorithms. The proposed algorithm adds the error characteristic of each sensor as a conditional probability value, and ensures greater accuracy by performing the track fusion with the sensors with the most reliable performance.

Application of Consensus Algorithm to Mate' for Identifying Faulty Sensor Node in Sensor Networks

  • Kim Sung-Ho;Kim Hyeong-Joo;Han Yun-Jong;Bogdana Diaconescu
    • Journal of the Korean Institute of Intelligent Systems
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    • v.15 no.5
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    • pp.615-620
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    • 2005
  • Sensor networks are usually composed of tens or thousands of tiny devices with limited resources. Because of their limited resources, there will often be some faulty nodes within the network. As nodes in some certain regions rely on each other to route the information gathered by different sensors to a base station (sink), the network should be able to detect a non-operational node in order to determine new paths for routing the information. Failure detection, which identifies the faulty nodes, is rather necessary in sensor networks and a very important research issue. The detection of a non-operational node can be performed using Consensus Algorithm with the purpose of achieving agreement about a node which is supposed to be faulty (non-operational). In this work, we discuss the application of a Consensus Algorithm to sensor node called 'mote'. Our experimental results show that it works efficiently for identifying faulty nodes in sensor networks.

A Forwarding Scheme for (m,k)-firm Streams Based on Local Decision in Wireless Sensor Networks

  • Li, Bijun;Kim, Ki-Il
    • Journal of information and communication convergence engineering
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    • v.9 no.6
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    • pp.775-779
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    • 2011
  • As the technology of multimedia sensor networks is desired in large numbers of applications nowadays, real-time service becomes one of the most important research challenges. Even though lots of related works have been conducted to meet this requirement in several ways, the specific traffic model for real-time has not been taken yet. Thus, it causes lack of adaptability of those approaches in real deployment. To solve this problem, in this paper, we model the application via (m,k)-firm streams which have weakly hard real-time property. And then, a novel forwarding scheme based on modified DBP (Distance-Based Priority) is proposed by considering local-DBP and stream DBP together. Local-DBP can contribute to identify the detailed causes of unsatisfied quality, that is, network congestion or wireless link failure. Simulation results reveal that (m,k)-firm is a good traffic model for multimedia sensor networks and the proposed scheme can contribute to guarantee real-time requirement well.

Distributed Borrowing Addressing Scheme for ZigBee/IEEE 802.15.4 Wireless Sensor Networks

  • Park, Sung-Jin;Lee, Eun-Ju;Ryu, Jae-Hong;Joo, Seong-Soon;Kim, Hyung-Seok
    • ETRI Journal
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    • v.31 no.5
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    • pp.525-533
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    • 2009
  • This paper proposes a distributed borrowing addressing (DIBA) scheme to solve problems of failure in address assignments resulting from limited tree depth and width when the distributed address assignment mechanism is used in a ZigBee/IEEE 802.15.4 wireless sensor network. DIBA is a method of borrowing addresses from neighbor nodes for newly entering nodes and assigning the borrowed addresses. Its network or sensing coverage can increase with almost the same overhead as the existing method. DIBA is a simple and lightweight means of addressing and routing, making it suitable for wireless sensor networks. Simulations showed that DIBA is a distributed addressing scheme with consistently excellent performance.

Damage Detection of Fiber-Metal Laminates Under Axial and Indentation Load (섬유-금속 적층판의 인장 및 압입 하중에서의 손상감지)

  • Yang, Yoo-Chang;Han, Kyung-Seop
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.370-375
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    • 2003
  • Optical fiber vibrations sensors (OFVSs) and extrinsic Fabry-Perot interferometer (EFPI) were used in damage monitoring of fiber-metal laminates(FML). The optical fiber vibration sensor and EFPI were applied in order to detect and evaluate the strain, damage and failure of FML. Damages in composites, such as matrix cracks, delamination and fiber breakage may occur as a result of excessive load, fatigue and low-velocity impacts. Tensile and indentation test was performed with the measurement of optical signal and acoustic emission (AE). The signals of the optical fiber vibration sensor due to damages were quantitatively evaluated by wavelet transform. It was found that damage information of comparable in quality to acoustic emission data could be obtained from the optical fiber vibration sensor signals.

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Implementation of the Arc Detection Device Using IR Sensor (IR 센서를 이용한 아크 발생 검출 장치 구현)

  • Hyun, Deuk-Chang
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.4
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    • pp.258-262
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    • 2017
  • Recently energy consumption has been increasing because of advances in the industry, and electrical fires have accounted for 31.9% of all fire accidents. An electrical fire is caused by a short circuit, power surge, or poor contact. Safety devices for short circuits or power surges are currently mandatory and can actually detect problems, but arcing caused by contact failure is difficult to detect in advance. This study used an IR sensor to detect the heat concentration caused by the arc. The data from the low-resolution sensor was amplified as much as four times by interpolation to find the exact location of the heat source and were then investigated.