• Korean Chemical Engineering Research
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• v.44 no.3
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• pp.265-269
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• 2006

Considerable attention has been given to supply chains and their management in order to increase competitiveness in current ever-increasing business environments. The attention is due to the common belief that SCM contributes to reducing the redundancy between its supply chain entities and increasing profits correspondingly. However implementing SCM in actual industries involves a large number of difficulties unexpected before. In this paper, experiences in implementing SCM in a semiconductor manufacturing enterprise are discussed with some remarks on how process systems engineering can contribute to establishing SCM. It is hoped that the lessons of the specific enterprise can be of good help to others as well.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.65-70
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• 2022

In manufacturing and semiconductor industries, transfer robots increase productivity through accurate and continuous work. Due to the nature of the semiconductor process, there are environments where humans cannot intervene to maintain internal temperature and humidity in a clean room. So, transport robots take responsibility over humans. In such an environment where the manpower of the process is cutting down, the lack of maintenance and management technology of the machine may adversely affect the production, and that's why it is necessary to develop a technology for the machine failure diagnosis system. Therefore, this paper tries to identify various causes of failure of transport robots that are widely used in semiconductor automation, and the Prognostics and Health Management (PHM) method is considered for determining and predicting the process of failures. The robot mainly fails in the driving unit due to long-term repetitive motion, and the core components of the driving unit are motors and gear reducer. A simulation drive unit was manufactured and tested around this component and then applied to 6-axis vertical multi-joint robots used in actual industrial sites. Vibration data was collected for each cause of failure of the robot, and then the collected data was processed through signal processing and frequency analysis. The processed data can determine the fault of the robot by utilizing machine learning algorithms such as SVM (Support Vector Machine) and KNN (K-Nearest Neighbor). As a result, the PHM environment was built based on machine learning algorithms using SVM and KNN, confirming that failure prediction was partially possible.

• Laser Solutions
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• v.15 no.4
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• pp.12-15
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• 2012

On behalf of the existing semiconductor process, the electronic devices to low-cost mass production to mass print the way, the research for development of roll-to-roll printing process is actively underway. This study was performed in about the research on the manufacturing technology of the printing roll used in the printing process of electronic devices. The indirect laser imprinting technology was used to create printable roll, and after coating copper on the surface of steel and thereon after coating polymer, after removing the polymer on the surface of roll, the printable roll was made. The laser system and roll feeder system were constructed and control program was developed. We has found the optimal conditions to perform laser patterning experiments using a system developed and We can make the minimum line width of 18 ${\mu}m$.

• Journal of Institute of Control, Robotics and Systems
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• v.4 no.6
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• pp.811-821
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• 1998

A new scheduling algorithm for large scale semiconductor processes is addressed. The difficulties of scheduling for semiconductor fabrication processes are mainly due from repeating production of wafers that experience reentrant flows. Sequence branch algorithm (SBA) is proposed for large real scheduling problems when all processing times are deterministic. The SBA is based on the reachability graph of Petri net of which the several defects such as memory consumption and system deadlock are complemented. Though the SBA shows the solution deviating a little from the optimal solution of mixed integer programming, it is adjustable for large size scheduling problems. Especially, it shows a potential that is capable of handling commercial size problems that are intractable with mathematical programming.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.55-59
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• 2024

Plasma Enhanced Chemical Vapor Deposition (PE-CVD) is a widely used technology in semiconductor manufacturing for thin film deposition. The implementation of wafer guide rings in PE-CVD processes is crucial for enhancing efficiency and product quality by ensuring uniform deposition around wafer edges and reducing particle generation. On the other hand, to prevent overall temperature non-uniformity and degradation of thin film quality within the chamber, it is essential to consider various parameters comprehensively. In this study, after applying the wafer guide rings, temperature variations and fluid flow changes were simulated. Additionally, by simulating the temperature and flow changes when applied to the PE-CVD chamber, this paper discusses the importance of optimizing variables within the entire chamber.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.2
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• pp.311-315
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• 2012

Diaphragm type noncontact automatic control valve is a valve for controling acidic PR(Photo Resist) liquid used in the semiconductor process. PR is photosensitive liquid that changes phases depending on light transmittance. PR is very toxic and expensive; the purpose of this paper is to address methods that prevent loss due to leaks. The design of noncontact precise automatic control valve is expected to play an important role in controlling fluid flow, therefore influencing energy conservation and environmental improvement. In this paper, diaphragm type automatic control valve's part design, assembly and simulation are introduced. Also, through the analysis of fluid flow the valve's internal velocity, pressure, and turbulent intensity are interpreted. This paper proposes to contribute to the improvement of the valve's performance.

• IE interfaces
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• v.23 no.3
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• pp.229-238
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• 2010

Virtual metrology (VM), a critical component of semiconductor manufacturing, is an efficient way of assessing the quality of wafers not actually measured. This is done based on a model between equipment sensor data (obtained for all wafers) and the quality characteristics of wafers actually measured. This paper considers principal component regression (PCR), partial least squares regression (PLSR), kernel PCR (KPCR), and kernel PLSR (KPLSR) as VM models. For each regression model, two cases are considered. One utilizes all explanatory variables in developing a model, and the other selects significant variables using the genetic algorithm (GA). The prediction performances of 8 regression models are compared for the short- and long-term etch process data. It is found among others that the GA-KPLSR model performs best for both types of data. Especially, its prediction ability is within the requirement for the short-term data implying that it can be used to implement VM for real etch processes.

• Transactions on Electrical and Electronic Materials
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• v.15 no.4
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• pp.221-225
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• 2014

Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.1
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• pp.43-50
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• 2009

The manufacturing process of the semiconductor is guided by the controller, which is supposed to sense the unexpected shocks and/or vibrations to shutdown the hard disk and the whole system in order to prevent the malfunction. This feature of controller would shutdown the system due to the instability of the controller itself as well as the instability of the manufacturing system. And consequently will cause significant losses. In this study the structure of a controller has been investigated to find ways to suppress the vibrations from the structure. The frequency response test and the computer simulation has been implemented to find the structure with improved stability. The result of the study shows that the relatively simple design alterations can eliminate most of the vibrations.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.51-55
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• 2004

In the design stage of high precision manufacturing/inspection FAB facilities, it is necessary to investigate the allowable vibration limits of high precision equipments and to study structural dynamic characteristics of C/R and Sub-structure in order to provide structural vibration criteria to satisfy these allowable limits. The goal of this study is to investigate the dynamic characteristics of PC-Type mock-up structures designed for next generation TFT-LCD FAB through experiments and analysis procedures. Therefore, in order to provide a proper dynamic structural design for high precision manufacturing/inspection work process, these allowable limits must be satisfied.