• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.643-644
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• 2013

• 산업공학
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• 제23권1호
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• pp.12-23
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• 2010

A semiconductor market is one of the most competitive markets in the world. To survive this competition, important targets for production planning are on-time delivery and profit maximization. In our research, we modify the linear programming model for the current production planning by adding new objective functions that maximize the profit. In addition, we propose a production planning process that gives a priority to new products, reflecting daily fluctuations in demand to weekly production planning. We validate our model with real data sets obtained from a major company semiconductor manufacturer and performed the paired t-test to verify the results. The results showed that our model forecasted profit and loss with 93.2% accuracy and improved the due date satisfaction by 10%.

• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 1996년도 춘계공동학술대회논문집; 공군사관학교, 청주; 26-27 Apr. 1996
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• pp.565-565
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• 1996

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.34-37
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• 2004

Recently advancing mobile communication tools and I.T industry, semiconductor device is requested more integrated, faster operation time and more scaled-down. Because of these reasons semiconductor device is requested multilayer interconnection. For the multilayer interconnection chemical mechanical polishing (CMP) becomes one of the most useful process in semiconductor manufacturing process. In this experiment, we focus on understand the characterize and improve the CMP technology by control of slurry flow rate. Consequently, we obtain that optimal flow rate of slurry is 170ml/min, since optimal conditions are less chemical flow and performance high with good selectivity to Ta. If we apply this results to copper CMP process. it is thought that we will be able to obtain better yield.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.1-5
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• 2019

This study has been focused on properties of surface technology for large diameter upper electrode using in high density plasma process as like semi-conductor manufacturing process. The experimental studies have been carried out to get mirror surface for upper electrode. For a formation of high surface quality upper electrode, single crystal silicon upper electrode has been mechanical and chemical machining worked. Mechanical machining work of the upper electrode is carried out with varying mesh type using diamond wheel. In case of chemical machining work, upper electrode surface roughness was observed to be strongly dependent upon the etchant. The different surface roughness characteristics were observed according to etchant. The machining result of the surface roughness and surface morphology have been analyzed by use of surface roughness tester, laser microscope and ICP-MS.

• 한국기계가공학회지
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• 제11권3호
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• pp.182-186
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• 2012

This paper aims to analyze the vibration characteristics of the test equipment that inspects any defects in manufactured semiconductor chips and classifies defective chips. This type of equipment should be robust against any vibrations because such vibrations can cause disruption in the process that requires higher precision. 3D model of the structure of the equipment has been used to configure vibration simulation model. Model analysis have been carried out to analyze which part of the equipment is weak against vibration. To minimize the vibration effect of the equipment, the thickness of the plate consist of the equipment and weights are modified. The results show that thicker plate and higher weight in the equipment can decrease vibration effect.

• 한국전기전자재료학회논문지
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• 제16권3호
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• pp.175-180
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• 2003

As the integrated circuit device shrinks to the deep submicron regime, the ion implantation process with high ion dose has been attracted beyond the conventional ion implantation technology. In particular, for the case of boron ion implantation with low energy and high dose, the stabilization and throughput of semiconductor chip manufacturing are decreasing because of trouble due to the machine conditions and beam turning of ion implanter system. In this paper, we focused to the improved characteristics of processing conditions of ion implantation equipment through the modified deceleration mode. Thus, our modified recipe with low energy and high ion dose can be directly apply in the semiconductor manufacturing process without any degradation of stability and throughput.

• 반도체디스플레이기술학회지
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• 제16권3호
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• pp.20-24
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• 2017

For process improvement and cutting down on expenses in solar cell industry, it is necessary to improve recycling process of wafer manufacturing. In this research, a study is introduced to develop classifier which is for recycling of abrasive. First of all, recycling process of wafer manufacturing is analyzed. And then, 3 steps of experiments such as oil removal, impurities removal and classification were executed. For the classification of slurry, a classifier is designed and manufactured. From experiments, it is verified that ultra sound vibration and flux are very important factors for classification. By experiencing the recycling processes and making devices, the technique can be initiated industry if needed such as decreasing waste and cutting down on expenses.

• 한국정보과학회논문지:컴퓨팅의 실제 및 레터
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• 제6권3호
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• pp.311-318
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• 2000

본 연구는 복잡하고 다양한 반도체 웨이퍼 가공 (FAB) 공정의 전체적인 흐름을 컴퓨터 모델로 구축하고 이를 Device 단면도를 나타내는 프리젠테이션 툴과 연동시키는 교육 모델의 개발을 목적으로 하였다. 급변하는 세계 반도체 시장에서 국내 반도체 업체는 지속적인 기술 개발과 더불어 효율적인 생산관리에 대응할 수 있도록 하여 국제 경쟁력을 키워야 할 것이다. 따라서 본 연구에서 다루어진 공정의 흐름과 각 단위공정의 특성을 바탕으로 설립된 모델은 서울대학교 반도체 공동 연구소를 대상으로 구현되었으나 앞으로 생산 관리를 담당할 국내 반도체 업체들의 신입사원과 현장기술자의 질적 향상을 위한 시청각 교육용 자료로의 활용 시 상당한 효과를 거둘 것이라 예상된다. 이는 생산업체에 국한되어지는 것만은 아니며 반도체 공정에 관련된 대학 학과목에서도 활용되어지리라 생각된다. 또한 확장성과 변화에 유연한 모델을 개발함으로써 반도체 생산 업체들은 구성된 표준 모델을 이용하여 각 회사의 실정에 맞추어 자사에 대한 시뮬레이션을 손쉽게 수행함으로써 많은 교육 효과와 이에 따른 원가 절감의 효과까지 거둘 수 있을 것이다.

• 한국입자에어로졸학회지
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• 제12권3호
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• pp.57-63
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• 2016

The laser-induced breakdown spectroscopy (LIBS) has been used for rapid detection of elemental compositions of various materials in multi-media (solid, liquid, gas, and aerosols). In this study, the aerosol-LIBS has been developed for real-time monitoring of process-induced particles produced during the semiconductor manufacturing. The developed aerosol-LIBS mainly consists of laser, optics, spectrometer, and aerosol chamber. A new aerosol chamber was constructed for the aerosol-LIBS to be applied for various semiconductor manufacturing process, including exhaust tubes, and low pressure and high temperature chamber. The aerosol-LIBS was evaluated by using laboratory generated aerosols for detection of various elements. As a result, P, Fe, Mg, Cu, Co, Ni, Ca, Na, and K emission lines were successfully detected by the aerosol-LIBS. Further evaluation of the aerosol-LIBS is being conducted.