• Journal of Korean Institute of Industrial Engineers
• /
• v.40 no.2
• /
• pp.215-222
• /
• 2014

This paper provides a real-time loading strategy for batch processing machines in which a number of jobs are simultaneously processed as a batch. The batch processing machines can be seen in both manufacturing industries (e.g., semiconductor, automobile and metal working) and service industries (transportation vehicles, mail shipment and theme park). This paper focuses on batch processing machines in semiconductor manufacturing. We present a look-ahead loading strategy for tardiness minimization where future arrivals and due dates are taken into consideration. Simulation tests are performed on the presented strategy and some existing loading heuristics under various production settings with different traffic intensities and forecasting errors. Experimental results show that our strategy provides the performance of good quality.

• Journal of the Semiconductor & Display Technology
• /
• v.11 no.4
• /
• pp.13-18
• /
• 2012

The semiconductor equipments generate a lot of data traffic via communication channels for the effective manufacturing processes of semiconductors and for the automation of semiconductor equipments. These data should be sent to a host computer in order to keep in a safe. The IEEE 802.11e specification gives differentiated and distributed access to a wireless communication medium with four access categories. These four access categories use different priority parameters which lead to quality of service in data traffic. In this paper, it is shown that the throughput of data depends upon the priority parameters provided by IEEE802.11e. We implement the usage of priority parameters in the SECS protocol for semiconductor equipments. It is necessary that the data from semiconductor equipments should be classified with certain priority for the effective use of our proposed method. Therefore, our scheme will contribute to improving the performance of the manufacturing processes of semiconductors.

• Journal of the Semiconductor & Display Technology
• /
• v.21 no.4
• /
• pp.168-173
• /
• 2022

As the function of a product is advanced and the process is refined, the yield in the fine manufacturing process becomes an important variable that determines the cost and quality of the product. Since a fine manufacturing process generally produces a product through many steps, it is difficult to find which process or equipment has a defect, and thus it is practically difficult to ensure a high yield. This paper presents the system architecture of how to build a smart manufacturing system to analyze the big data of the manufacturing plant, and the equipment factor analysis methodology to increase the yield of products in the smart manufacturing system. In order to improve the yield of the product, it is necessary to analyze the defect factor that causes the low yield among the numerous factors of the equipment, and find and manage the equipment factor that affects the defect factor. This study analyzed the key factors of abnormal equipment that affect the yield of products in the manufacturing process using the data mining technique. Eventually, a methodology for finding key factors of abnormal equipment that directly affect the yield of products in smart manufacturing systems is presented. The methodology presented in this study was applied to the actual manufacturing plant to confirm the effect of key factors of important facilities on yield.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.67 no.3
• /
• pp.474-478
• /
• 2018

The use of metals such as aluminum and titanium and the related industrial facilities have been continuously increasing to meet the requirements of the improvement of high-tech products due to the development of industry, and explosion of metal dust. Semiconductor process Metal dust is essential, but research is insufficient. The purpose of this study is to identify risk by analyzing the quantitative risk such as maximum explosion pressure and minimum explosion concentration applied international test standard in order to select the semiconductor process facilities handling dust and to predict possible risk of accidents.

• Journal of the Semiconductor & Display Technology
• /
• v.14 no.1
• /
• pp.45-49
• /
• 2015

Process gases with vapor or liquid phase as well as gas phase may experience alteration in itself or be contaminated in the fluid pipe to the process chamber. And thus it result in as particles or defects on the substrates in semiconductor, LCD, LED manufacturing. Purifiers and filters are used for control of contamination. However, none of detection device is available in the delivery line. In this paper, we propose simple device with lighting and sensing in order to predict contamination of the fluid or the tube wall. For some general purpose gases, it showed constant voltage output regardless of the flow rates. But, the smoke and the moisture in the air lowered the figure due to its concentration. Numerical values for several solid and liquid media were obtained. And, the operating temperature tendency was investigated.

• Journal of the Korean Operations Research and Management Science Society
• /
• v.29 no.3
• /
• pp.9-21
• /
• 2004

Semiconductor industry is the one whose supply chain network is distributed all over the world. And it has different characteristics with other manufacturing industries as reentrancy, binning, substitution. In this paper, we suggest supply chain models for the semiconductor industry, consisting of production and distribution chains, where manufacturing characteristics are considered. Three policies for the production chain and two policies for the distribution chain are suggested and formulated mathematically. Six combination policies are tested for the evaluation of performances with example. It is shown that the supply chain is operated, if production and distribution are coordinated and managed based on the demand information, without inventory, as efficiently as the chain with inventory.

• IE interfaces
• /
• v.16 no.spc
• /
• pp.93-98
• /
• 2003

This paper addresses an AGV dispatching problem in semiconductor clean-room bays where AGVs move cassettes of wafers between machines or machines and a central buffer. Since each machine in a bay has a local buffer of limited capacity, material flow should be controlled in a careful way to maintain high system performance. It is regarded that two most important performance measures in a semiconductor bay are throughput rate and lead-time. The throughput rate is determined by a bottleneck resource and the lead-time depends on smooth material flow in the system. This paper presents an AGV dispatching procedure based on the concept of theory of constraints (TOC), by which dispatching decisions are made to utilize the bottleneck resource at the maximum level and to smooth the flow of material. The new dispatching procedure is compared with existing dispatching rules through simulation experiments.

• IE interfaces
• /
• v.23 no.1
• /
• pp.12-23
• /
• 2010

A semiconductor market is one of the most competitive markets in the world. To survive this competition, important targets for production planning are on-time delivery and profit maximization. In our research, we modify the linear programming model for the current production planning by adding new objective functions that maximize the profit. In addition, we propose a production planning process that gives a priority to new products, reflecting daily fluctuations in demand to weekly production planning. We validate our model with real data sets obtained from a major company semiconductor manufacturer and performed the paired t-test to verify the results. The results showed that our model forecasted profit and loss with 93.2% accuracy and improved the due date satisfaction by 10%.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.2
• /
• pp.56-63
• /
• 2023

This paper presents a method using finite element analysis and topology optimization to address the issue of overdesign in pressure-explosion proof enclosure doors for semiconductor manufacturing processes. The design conducted in this paper focuses on the pattern design of the enclosure door and its fixation components. The process consists of a solid-filled model, a topology optimization model, and a post-processing model. By applying environmental conditions to each model and comparing the maximum displacement, maximum equivalent stress, and weight values, it was confirmed that a reduction of about 13% in weight is achievable.

• International Journal of Quality Innovation
• /
• v.6 no.3
• /
• pp.173-189
• /
• 2005

A life-cycle assessment (LCA) is based on the attention given to the environmental protection and concerning the possible impact while producing, making, and consuming products. It includes all environmental concerns and the potential impact of a product's life cycle from raw material procurement, manufacturing, usage, and disposal (that is, from cradle to grave). This study assesses the environmental impact of the ultra pure water process of semiconductor manufacturing by a life-cycle assessment in order to point out the heavy environmental impact process for industry when attempting a balanced point between production and environmental protection. The main purpose of this research is studying the development and application of this technology by setting the ultra pure water of semiconductor manufacturing as a target. We evaluate the environmental impact of the Precoat filter process and the Cation/Anion (C/A) filter process of an ultra pure water manufacturing process. The difference is filter material used produces different water quality and waste material, and has a significant, different environmental influence. Finally, we calculate the cost by engineering economics so as to analyze deeply the minimized environmental impact and suitable process that can be accepted by industry. The structure of this study is mainly combined with a life-cycle assessment by implementing analysis software, using SimaPro as a tool. We clearly understand the environmental impact of ultra pure water of semiconductor used and provide a promotion alternative to the heavy environmental impact items by calculating the environmental impact during a life cycle. At the same time, we specify the cost of reducing the environmental impact by a life-cycle cost analysis.