• 제목/요약/키워드: semiconductor equipment industry

검색결과 95건 처리시간 0.026초

반도체 제조용 CVD 및 Etcher 장비의 탄소배출량과 에너지 소비량 모니터링 (Monitoring of the Carbon Emission and Energy Consumption of CVD and Etcher for Semiconductor Manufacturing)

  • 고동국;배성우;김광선;임익태
    • 반도체디스플레이기술학회지
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    • 제12권3호
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    • pp.19-22
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    • 2013
  • The purpose of this study is to develop a system that can monitor the amounts of energy consumption during CVD and etching process for semiconductor manufacturing. Specifically, this system is designed to measure the $CO_2$ emission amounts quantitatively by measuring the flow rate of gas used and amount of power consumed during the processes. The processes of CVD equipment can be classified generally into processing step and cleaning step and all the two steps were monitored. In CVD and etcher equipments, various gases including Ar and $O_2$ are used, but Ar, $O_2$ and He were monitored with the use of the LCI data of Korea Environmental Industry & Technology Institute and carbon emission coefficients of EcoInvent. As a result, it was found that the carbon emission amounts of CVD equipment for Ar, $O_2$ and He were $0.030kgCO_2/min$, $4.580{\times}10^{-3}kgCO_2/min$ and $6.817{\times}10^{-4}kgCO_2/min$, respectively and those of etcher equipment for Ar and $O_2$ are $5.111{\times}10^{-3}kgCO_2/min$ and $7.172kgCO_2/min$, respectively.

반도체 플라즈마 식각 시스템의 균일도 향상을 위한 CCP와 ICP 결합 임피던스정합 장치 (CCP and ICP Combination Impedance Matching Device for Uniformity Improvement of Semiconductor Plasma Etching System)

  • 정두용;남창우;이정호;최대규;원충연
    • 전력전자학회논문지
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    • 제15권4호
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    • pp.274-281
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    • 2010
  • 본 논문에서는 반도체 플라즈마 식각 시스템의 균일도 향상을 위한 CCP와 ICP 결합 임피던스정합 장치를 제안한다. 이중주파수 전원공급 장치는 CCP와 ICP로 구성되어 있고 첫 번째 구성은 고집적화를 위해 페라이트 코어를 사용한 유도 결합 플라즈마(ICP : Inductively Coupled Plasma)방식이며, 두 번째 구성은 셀 전체의 균일도 향상을 위한 용량 결합 플라즈마(CCP : Capacitively Coupled Plasma)방식이다. 제안된 시스템은 반도체 장비 산업에서 요구되는 높은 생산성을 실현할 수 있다. 본 논문에서는 제안된 시스템의 타당성을 검증하기 위해 CCP와 ICP 결합 임피던스정합 장치를 제작하였고, 이론적 분석과 27.12MHz 와 400kHz의 조건에서 시뮬레이션 및 실험을 진행하였다

Smart Factory Big Data를 활용한 공정 이상 탐지 프로세스 적용 사례 연구 (A case study on the application of process abnormal detection process using big data in smart factory)

  • 남현우
    • 응용통계연구
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    • 제34권1호
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    • pp.99-114
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    • 2021
  • 반도체 제조 산업에서는 Big Data에 기초한 Smart Factory 도입과 적용이 가시화되면서 생산 공정의 각 단계에서 수집 가능한 다양한 센서(sensor) 데이터를 활용하여 공정 이상 탐지 및 최종 수율 예측 등에 다양한 분석 방법을 시도하고 있다. 현재 반도체 공정은 원료인 잉곳(ingot)에서 패키징(packaging) 작업 이전의 웨이퍼(wafer) 생산까지 500 600개 이상의 세부 공정과 이와 연계된 수천 개의 계측 공정으로 구성된다. 개별 계측 공정 내의 실제 계측 비율은 대상 제품 대비 0.1%에서 최대 5%를 넘지 못하고 계측 시점별로 일정하게 유지할 수 없다. 이러한 이유로 공정 각 단계의 정상 상태를 간접적으로 판단할 수 있는 장비 센서(sensor) 데이터를 활용하여 관리 여부를 판단하고자 하는 노력이 계속되고 있다. 본 연구에서는 장비 센서 데이터 기반의 공정 이상 탐지 프로세스를 정의하고 현재 적용 되고 있는 기술 통계량 기반 진단 방법의 단점을 보완하기 위해 FDA(Functional Data Analysis)방법을 활용하였다. 실제 현장 사례 데이터에 머신러닝을 이용하여 이상 탐지 정확도 비교를 통해 효과성을 검증하였다.

정보통신 공공 R&D 기술성 평가 (Technological Assesment on Public R&D Activities)

  • 여인갑
    • 한국산업정보학회:학술대회논문집
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    • 한국산업정보학회 2002년도 추계공동학술대회
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    • pp.433-439
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    • 2002
  • In this paper, we implemented technology assessment on the public R&D activities in IT field in order to select the promising technologies, so called "star technology," making for national industry development. Technology assessment frame in this study included qualitative factors. IT technologies are classified five sector - network, wireless/broadcasting, SW/application/computer/terminal equipment, semiconductor/component. Expert opinion interviews on each field are carried out. Assessment factors consist of technology usefulness and technology competitiveness. In the final analysis, 23 technology items selected as a promising technologies and the results can be used public R&D planning and If industry policy.

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Framework for Reconstructing 2D Data Imported from Mobile Devices into 3D Models

  • Shin, WooSung;Min, JaeEun;Han, WooRi;Kim, YoungSeop
    • 반도체디스플레이기술학회지
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    • 제20권4호
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    • pp.6-9
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    • 2021
  • The 3D industry is drawing attention for its applications in various markets, including architecture, media, VR/AR, metaverse, imperial broadcast, and etc.. The current feature of the architecture we are introducing is to make 3D models more easily created and modified than conventional ones. Existing methods for generating 3D models mainly obtain values using specialized equipment such as RGB-D cameras and Lidar cameras, through which 3D models are constructed and used. This requires the purchase of equipment and allows the generated 3D model to be verified by the computer. However, our framework allows users to collect data in an easier and cheaper manner using cell phone cameras instead of specialized equipment, and uses 2D data to proceed with 3D modeling on the server and output it to cell phone application screens. This gives users a more accessible environment. In addition, in the 3D modeling process, object classification is attempted through deep learning without user intervention, and mesh and texture suitable for the object can be applied to obtain a lively 3D model. It also allows users to modify mesh and texture through requests, allowing them to obtain sophisticated 3D models.

패키지 반도체소자의 ESD 손상에 대한 실험적 연구 (Experimental Investigation of the Electrostatic Discharge(ESD) Damage in Packaged Semiconductor Devices)

  • 김상렬;김두현;강동규
    • 한국안전학회지
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    • 제17권4호
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    • pp.94-100
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    • 2002
  • As the use of automatic handling equipment for sensitive semiconductor devices is rapidly increased, manufacturers of electronic components and equipments need to be more alert to the problem of electrostatic discharges(ESD). In order to analyze damage characteristics of semiconductor device damaged by ESD, this study adopts a new charged-device model(CDM), field-induced charged model(FCDM) simulator that is suitable for rapid, routine testing of semiconductor devices and provides a fast and inexpensive test that faithfully represents ESD hazards in plants. High voltage applied to the device under test is raised by the field of non-contacting electrodes in the FCDM simulator, which avoids premature device stressing and permits a faster test cycle. Discharge current and time are measured and calculated. The characteristics of electrostatic attenuation of domestic semiconductor devices are investigated to evaluate the ESD phenomena in the semiconductors. Also, the field charging mechanism, the device thresholds and failure modes are investigated and analyzed. The damaged devices obtained in the simulator are analyzed and evaluated by SEM. The results obtained in this paper can be used to prevent semiconductor devices form ESD hazards and be a foundation of research area and industry relevant to ESD phenomena.

반도체·디스플레이 탄소중립을 위한 PECVD 챔버세정용 NF3대체가스 개발연구 (Research Progress on NF3 Substitute Gas of PECVD Chamber Cleaning Process for Carbon Neutrality)

  • 조세윤;홍상진
    • 반도체디스플레이기술학회지
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    • 제22권4호
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    • pp.72-75
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    • 2023
  • Carbon neutrality has been emerged as important mission for all the manufacturing industry to reduce energy usage and carbon emission equivalent. Korean semiconductor and display manufacturing industries are also in huge interest by minimize the energy usage as well as to find a less global warming product gases in both etch and cleaning. In addition, Korean government is also investing long term research and development plan for the safe environment in various ways. In this paper, we revisit previous research activities on carbon emission equivalent and current research activities performed in semiconductor process diagnosis research center at Myongji University with respect to the reduction of NF3 usage for the PECVD chamber cleaning, and we present the analytical result of the exhaust gas with residual gas analysis in both 6 inches and 12 inches PECVD equipment. The presented result can be a reference study of the development of new substitution gas in near future to compare the cleaning rate of the silicon oxide deposition chamber.

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전기자동차용 2차전지를 위한 스마트 ICT형 전자식 외부 단락시험기 개발 (Development of Smart ICT-Type Electronic External Short Circuit Tester for Secondary Batteries for Electric Vehicles)

  • 정태욱;신병철
    • 한국산업융합학회 논문집
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    • 제25권3호
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    • pp.333-340
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    • 2022
  • Recently, the use of large-capacity secondary batteries for electric vehicles is rapidly increasing, and accordingly, the demand for technologies and equipment for battery reliability evaluation is increasing significantly. The existing short circuit test equipment for evaluating the stability of the existing secondary battery consists of relays, MCs, and switches, so when a large current is energized during a short circuit, contact fusion failures occur frequently, resulting in high equipment maintenance and repair costs. There was a disadvantage that repeated testing was impossible. In this paper, we developed an electronic short circuit test device that realizes stable switching operation when a large-capacity power semiconductor switch is energized with a large current, and applied smart ICT technology to this electronic short circuit stability test system to achieve high speed and high precision through communication with the master. It is expected that the inspection history management system based on data measurement, database format and user interface will be utilized as essential inspection process equipment.

반도체 산업에서의 Enterprise Document Management Architecture 구현에 관한 연구 (A Study on Constructing Approach of Enterprise Document Management Architecture in Semiconductor Business)

  • 장현성;이영중;송하석;한영준;안정삼
    • 한국경영과학회:학술대회논문집
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    • 한국경영과학회 2001년도 추계학술대회 논문집
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    • pp.11-14
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    • 2001
  • A systematic construction and re-use of technology related to the product development and production has been the most important for the semiconductor industry dependent on process and equipment. Therefore, numerous outputs in the form of paper has been produced in the process of information management ranging from the creation to recycling and disposal of technologies. In this research, the technology and documents necessary for the business management in the field of semiconductor manufacturing were classified in an effort to solve problems while the modeling of document management architecture at the enterprise level was performed by properly setting up the security system to prevent the unauthorized disclosure of the product development technology to the third parties. Especially, the product and process specification are designed in such a way as to ensure a real-time response in interface with the production system in order to shorten the development lead-time and improve the productivity. This paper is to discuss the modeling approach, the strategy to construct the system and its results.

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65nm급 300mm Wafer 세정조 개발을 위한 유동 특성연구

  • 김진태;김광선;이승희;정은미
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
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    • pp.174-178
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    • 2007
  • The cleaning process to remove small particles, ions, and other polluted sources is one of the major parts in the recent semiconductor industry because it can cause fatal errors on the quality of the final products. According to the other reports, the major factors of bath's fluid motion are the cleaning method, nozzle, the geometry (of bath, guide and wafer), and the position (of guide and wafer). So to enhance cleaning efficiency in the bath, these factors must be controlled. The purpose of this study is to analyze and visualize fluid motion in the cleaning bath as basic data for designing the nozzle system and finding the process control parameters. For that, we used the general CFD code FLUENT.

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