• 정보저장시스템학회논문집
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• 제3권3호
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• pp.118-122
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• 2007

Phase-change wet-etching technology using GeSbTe phase-change films is developed. Selective etching between an amorphous and a crystalline phase can be carried out with an alkaline etchant of NaOH. Etching selectivity is dependent not only on the concentration of the alkaline etchant but also on the film structure. Specifically, metal films for heat control cause marked effects on the etching properties of GeSbTe film. Surviving amorphous pits can be obtained with Al metal layer, however etched amorphous pits are seen with Ag metal layer. An opposite selective etching behavior can be observed between samples with two different metal layers.

• 한국정보통신학회논문지
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• 제24권2호
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• pp.321-324
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• 2020

In this work, we developed a selective etching process for GaN that is a key process in p-GaN/AlGaN/GaN enhancement-mode (E-mode) power switching field-effect transistor (FET) fabrication. In order to achieve a high current density of p-GaN/AlGaN/GaN E-mode FET, the p-GaN layer beside the gate region must be selectively etched whereas the underneath AlGaN layer should be maintained. A selective etching process was implemented by oxidizing the surface of the AlGaN layer and the GaN layer by adding O2 gas to Cl2/N2 gas which is generally used for GaN etching. A selective etching process was optimized using Cl2/N2/O2 gas mixture and a high selectivity of 53:1 (= GaN/AlGaN) was achieved.

• Electronic Materials Letters
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• 제18권
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• pp.198-204
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• 2022

The design of the material synthesis process is important because this process can be applied to a variety of materials and used in different applications. Herein, we selectively oxidized two types of metals in a carbon nanofiber (CNF) support and then left only one type of metal on a porous support using selective etching. Ni and MgO were formed in the CNFs through annealing, and then MgO was etched with an HCl etchant. In the selective oxidation process, two types of metal were selected by considering the oxidation tendency between the metal and C. Ni was selected as an oxidant of C, and Mg was selected as a reductant of C. The two metals with significantly different oxidation tendencies were predicted to have different reactivity with the etchant, making them suitable for selective etching. The effectiveness of selective etching was verified by energy-dispersive X-ray spectroscopy (EDS) and transmission electron microscopy (TEM). In EDS, the atomic concentration of Mg was selectively reduced. In TEM, the formation of a porous structure was confirmed.

• JSTS:Journal of Semiconductor Technology and Science
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• 제13권6호
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• pp.668-675
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• 2013

We investigate the effect of the ageing time and etching time on the etching rate of SiGe mixed etching solution, namely 1 vp HF (6%), 2 vp $H_2O_2$ (30%) and 3 vp $CH_3COOH$ (99.8%). For this etching solution, we found that the etch rate of SiGe layer is saturated after the ageing time of 72 hours, and the selectivity of $Si_{0.8}Ge_{0.2}$ layer and Si layer is 20:1 at ageing time of 72 hours. The collapse was appeared at the etching time of 9min with etching solution of after saturation ageing time.

• Journal of Electrochemical Science and Technology
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• 제10권4호
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• pp.402-407
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• 2019

Water electrolysis is known as the most sustainable and clean technology to produce hydrogen gas, however, a serious drawback to commercialize this technology is due to the slow kinetics in oxygen evolution reaction (OER). Thus, we report on the nanoporous IrNi thin film that reveals a markedly enhanced OER activity, which is attained through a selective etching of Os from the IrNiOs alloy thin film. Interestingly, electrochemical selective etching of Os leads to the formation of 3-dimensionally interconnected nanoporous structure providing a high electrochemical surface area (ECSA, 80.8 ㎠), which is 90 fold higher than a bulk Ir surface (0.9 ㎠). The overpotential at the nanoporous IrNi electrode is markedly lowered to be 289 mV at 10 mA cm^-2, compared with bulk Ir (375 mV at 10 mA cm^-2). The nanoporous IrNi prepared through the selective de-alloying of Os is promising as the anode material for a water electrolyzer.

• 전자공학회논문지A
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• 제32A권1호
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• pp.152-158
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• 1995

Eteching characteristics of the Indium Tin Oxide (ITO), which is transparent conductor, was investigated with CH4/H2 and Ar as etching gases for the Reactive Ion Etching (RIE). With CH4/H2 for the etching gas, the highly selective etching characteristics for the ITO on GaAs was obtained. It was examined that the dominant etching parameter for the selective etchning of ITO on GaAs structure was the chamber pressure. But, the etching selectivity for ITO on InP was poor eventhough we tried systematic etching. RIE etching conditins using CH4/H2 gas was limited due to the formation of polymer on the substrates. In the case of Ar gas for the reactive gas, the selectivity of ITO on BaTiO3 was above 10. The etch rete of ITO was more sensitive to the etching parameters than that of BaTiO3, which was almost constant with different etching parameters.

• 한국진공학회지
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• 제5권2호
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• pp.169-174
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• 1996

The applications of the high density plasma sources to the etching in semiconductor fabrication process are actively studied because of the more strict requirement from the dry etching process due to shrinking down of the critical dimension. But in the oxide etching with the high density plasma sources, abundant fluorine atoms released from the flurocarbon feed gas make it difficult to get the highly selective $SiO_2/Si$ etching. In this study, to improve the $SiO_2/Si$ etch selectivity through the control of the radical loss channels, we propose the wall heating , one of methods of controlling loss mechanisms. With appearance mass spectroscopy(AMS) and actinometric optical emission spectroscopy(OES), the increase of both radicals impinging on the substrate and existing in bulk plasma, and the decrease of the fluorine atom with wall temperature are observed. As a result, a 40% improvement of the selectivity was achieved for the carbon rich feed gas.

• 대한기계학회논문집A
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• 제30권3호
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• pp.328-333
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• 2006

Movable nanometer-scale structures are fabricated by selective etching of single crystalline Au nanoplates. The nanostructures have arbitrary shapes like gear and alphabet 'A' with in-plane size less than 500 m and thickness of $25\sim60nm$. They could be moved successfully on the substrate using a nanornanipulator installed in a focused ion beam system. Our approach is expected to be useful in fabricating various kinds of nanocomponents which can play a role as building blocks for the sophisticated nanodevices or micromachines.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.483.2-483.2
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• 2014

In this study, we describe a simple selective etching method that produces noncurling, freestanding, large-area, aligned $TiO_2$ nanotube (NT) with doubly ends opened. The novel selective etching process only removed the thin 2nd bottom layer from the physically and chemically stable thick amorphous 1st top layer under thermal treatment at $250^{\circ}C$, yielding ordered doubly open-ended NT (DNT) that could be easily transferred to an FTO substrate for the fabrication of front-illuminated dye sensitized solar cells (DSCs). The DNT-DSCs yielded a higher PCE (8.6%) than was observed from $TiO_2$ nanoparticle (TNP)-based DSCs (7.3%), for comparable film thicknesses of $16{\mu}m$, despite of 20% decreased amount of dye. Intensity-modulated photocurrent and photovoltage spectroscopy (IMPS and IMVS, respectively) revealed that the DNT-DSCs exhibited electron lifetimes that were 10 times longer than those of TNP-DSCs, which contributed to high device performances.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권7호
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• pp.354-358
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• 2006

In this paper, we investigated the selective etching rate of amorphous As-Ge-Se-S thin film due to the photoexpansion effect and fabricated the 2-dimensional embossing type diffraction grating hologram. We measured the thickness change with the etching time among NaOH solution after forming 1-dimension diffraction grating. As a results, we found that the selective etching rate were $2.5\AA/s,\;3.3\AA/s,\;3.9\AA/s$ where NaOH solution concentration were 0.26N, 0.33N, 0.36N, respectively. Also after the formation of 2-dimensional diffraction grating by the $90^{\circ}$ degree of circulation on the formed 1-dimensional diffraction grating, we etched selectively during 60sec, among 0.26N NaOH solution and obtained 2-dimensional embossing diffraction grating. As the results of AFM (Atomic Force Microscopy), we confirmed the formation of distinct embossing type 2-dimensional diffraction grating hologram, successfully.