• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.231-231
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• 2010

현재 Cu배선 제조공정에서 전해도금은 Damascene pattern의 Cu filling에 사용되고 있는데, 우수한 특성의 전해도금을 위해서는 step coverage가 우수한 Cu seed layer가 필수적이다. 현재까지 Cu seed layer를 형성하는 방법으로는 ionized physical vapor deposition(I-PVD)이 사용되고 있는데, 22 nm 이후의 소자에서는 step coverage의 한계로 인해 완벽한 Cu filling 어려울 것으로 예상된다. 본 연구에서는 step coverage가 매우 우수한 atomic layer deposition(ALD) 방법으로 Cu seed layer를 증착하고 그 특성을 기존의 PVD 박막과 비교하였다. Ketoiminate 계열의 +2가 Cu 전구체와 $H_2$를 이용하여 ALD Cu 박막을 증착하였는데 exposure, 기판의 온도를 변화시키면서 기판별로 ALD Cu의 최적공정조건을 도출하였다. ALD Cu seed와 PVD Cu seed 위에 약 $1{\mu}m$의 Cu 박막을 전해도금한 후 박막의 두께, 비저항, 미세구조와 함께 pattern filling 특성을 비교하였다.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• KOREAN JOURNAL OF CROP SCIENCE
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• v.58 no.3
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• pp.308-318
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• 2013

Korean soybean varieties, 'Seonyu' and 'Hwangkeum' were planted in 2012, and three temperature gradient, Tc($19.8^{\circ}C$, ambient temperatured), $Tc+1.7^{\circ}C$, and $Tc+2.5^{\circ}C$, were artificially created by controlling the green house system during seed filling period. Mature seeds that developed under these conditions were analyzed for variances in physicochemical properties. The 100-seed weight and seed-coat ratio of soybean were decreased, but small seed rate was increased by high temperature during seed filling period. Protein content was increased, but oil content was decreased significantly with increasing the seed filling temperature. The decrement of carbon to nitrogen ratio (C/N), and the increment of monosaccharide, fructose and sucrose, in seeds explained that carbohydrate assimilation during seed filling was restricted by high temperature. Rapid increments of seed volume and weight were observed in the seeds of high seed filling temperature, but as soaking time increased the highest values were observed in the seeds of ambient seed filling temperature. The 100-seed weight and seed-coat ratio of soybean were closely related not only to the increment of soaking volume and weight, but also the increments of total dissolved solids (TDS) and electro conductivity (EC). Whereas protein content and C/N ratio showed less relationship with the soaking properties, but they had a positive correlation with TDS and EC. From the results, it was considered that high values of TDS and EC in the seeds of high temperature were mainly due to the incomplete conversion of assimilates into storage compounds. However, sugar content showed less influence on the soaking properties and the values of TDS and EC.

• Korean Journal of Materials Research
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• v.23 no.10
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• pp.550-554
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• 2013

As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.

• Korean Journal of Plant Resources
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• v.10 no.3
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• pp.221-226
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• 1997

Improvement of seed protein quality might be an essential issus in soybean and would give more profit directly to both farmers and users. This study was carried out to investigate the effects of reduced-S form(s) on seed storage protein components in soybean during seed filling stages. The reduced-S forms during seed fill were sodium thiosulfate, sodium sulfite, sodium sulfide, thioaceteat, $\beta$-mercaptoethanol, thiourea, thiamine-HCI, L-cysteine, L-cystine, and L-methionine. Seed storage protein concentration did not appear to be affected by any reduced-S forms. However, glycinin and $\beta$-conglycinin concentration seemed to be changed greatly by L-methionine. This resulted in the increase in the 11S/7S ratio(3.58). Among the $\beta$-conglycinin, $\beta$-subunit was not accumulated at all. $\alpha$-subunit concentration appeared to be decreased and $\alpha'$-subunit concentration was not altered in comparison with sulfate control. Also, $\beta$-conglycine concentration, especially $\beta$-subunit concentration, tended to be decreased with L-cystine treatment, resulting in an increase in the 11S/7S ratio(1.83). The glycinin concentration tended to be increased at the expense of the decrease in the $\beta$-conglycinin concentration. Therefore, it is suggested that enhancing soybean protein quality would be achieved by improving metabolic pathways of S assimilation in soybean plants during seed filling period under sulfate-sufficient condition.

• Proceedings of the Plant Resources Society of Korea Conference
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• 2000.05a
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• pp.62-62
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• 2000

• Korean Journal of Medicinal Crop Science
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• v.2 no.1
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• pp.32-37
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• 1994

This experiment was conducted to obtain the basic information for the increase ofgermination percent by the seed diameter, specific gravity, different grain filling period and stratification in Bupleurum falcatum seeds. The seed size of B.falcatum ranged from 2.0 to 3.9mm in diameter, The large seed showed the higher germinability, The optimum specific gravity of salt selection for seed screening was 1.05 resulting in screening out seeds with high germinability over 70%.The seeds needed grain filling period for 60 days or longer after flowering to keep high germinability The optimum period of stratification treatment to promote seed germination was about 80 days.

• Asian Journal of Turfgrass Science
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• v.9 no.3
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• pp.173-185
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• 1995

Hydroseeding technique is a very popular method of revegetating slope areas through the control of soil erosion and stability by seeding grasses. This study was conducted to select turfgrass species and cultivars for hydroseeding. Experiment plots were established on various soil types and environmental conditions at Singar-Ansan high-way construction site. The investigation was designed in three cutting, one back-filling and other three spare sites with various seed mixtures. Results indicated that combinations of seed mixtures influenced seed germination and rates of surface cover. In a view of long term, vegetation shifts should be influenced by characters of slopes and micro-climate conditions. Hydroseeding did not show good results on rocky slope areas. Revegetation was only going on where there had soil. The combination of seed mixture with a higher rate of perennial ryegrass had relatively good revegetation with faster germination and seedling growth. Improved turf-type tall fescue Arid ⓡ and Falcon ⓡ seemed to have good environ-mental adaptation and drought tolerance. Wild or old type cultivars showed relatively slow green-up in spring and growth rates at the next year of seeding. For the harmonious landscaping with surrounding area, the combination of native grass mixture with cool-season grasses had good results. Slow and low revegetation rate at hack-filling site seemed to be caused by the poor development of capillary tubes in sub-soil. It was shown that a high correlation between seed germination and revegetation rate, and between three-month later coverage rate and final rate. The evaluation of coverage rate after three month seems to he acceptable to decide the accomplishment of hydroseeding results on rode side slopes.

• Korean Journal of Materials Research
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• v.9 no.6
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• pp.583-588
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• 1999

The characteristics of copper thin films and pattern filling capability were investigated by ECD. Prior to deposition of copper film, seed-Cu/Ta(TaN)/$SIO_2$(BPSG)/Si structure was manufactured. Copper deposition was performed with various current waveforms(DC/PC, 1~10,000Hz) and current densities(10~60 mA/$\textrm{cm}^2$) after pretreatment (Oxident removal, wetting) of seed-layer. Conformal pattern filling was performed using PC method with fast deposition rate of 6,000~8,000$\AA$/min. Heat-treated($450^{\circ}C$, 30min) copper films showed good resistivities of 1.8~2.1$\mu$$\Omega$.cm. According to the XRD analysis, (111)-preferred orientation of copper film was found in ECD-Cu/seed-Cu/Ta/$Sio_2$/Si structure. Also, we have successfully achieved to fill via holes with 0.35$\mu\textrm{m}$ width and 4:1 aspect ratio.

• KOREAN JOURNAL OF CROP SCIENCE
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• v.51 no.4
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• pp.310-317
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• 2006

This study was conducted to investigate the influence of drought stress during the pod developing and seed filling stage on source-sink relationships of soybean (Glycine max). Drought treatments were imposed by withholding water at the full-pod stage, 19 days after flowering, and then limited watering was relieved at 15 days after the initiation of drought treatment. Soybean seed yield was reduced by 39% mainly due to decreased pod number under drought stress, but the 100-seed weight was relatively less reduced. In spite of the 15-day drought during the full-pod stage, soybean produced good seeds showing similar l00-seed weight, protein, starch and soluble sugar content to those from the well-watered. Although drought during the full-pod stage caused source limitations; i.e. accelerated leaf senescence and reduced leaf soluble sugars, it did not cause limitations of other source characteristics such as SGR and leaf starch level. This is because the reduction in size of sinks, such as pod and seed abortions compensated for source limitations, resulting in balanced source-sink as expressed by LAR and the ratio of leaf area to seed dry weight. Drought stress during the pod developing and seed filling stage did not disrupt the source-sink balance