Characteristic of Through Silicon Via's Seed Layer Deposition and Via Filling |
Lee, Hyunju
(School of Materials Science and Engineering, Pusan National University)
Choi, Manho (ACI Inspection Group, Samsung Electro Mechanics) Kwon, Se-Hun (School of Materials Science and Engineering, Pusan National University) Lee, Jae-Ho (Department of Materials Science and Engineering, Hongik University) Kim, Yangdo (School of Materials Science and Engineering, Pusan National University) |
1 | M. Uemoto, K. Tanida, Y. Nemoto, M. Hoshino, K. Kojima, Y. Shirai, K. Takahashi, Proc. 54th Electron. Comp. Technol. Conf., 616 (2004). |
2 | J-J. Sun, K. Kondo, T. Okamura, S. J. Oh, M. Tomisaka, H. Yonemura, M, Hoshino, J. Electrochem. Soc., 150(6), G355 (2003). DOI ScienceOn |
3 | M. Hirano, K. Nishikawa, I. Toyoda, S. Aoyama, S. Sugitani, K. Yamasaki, Solid-State Electron., 41(10), 1451 (1997). DOI ScienceOn |
4 | S. F. Al-sarawi, D. Abbott, P. D. Franzon, IEEE trans. Comp., Packag. Manufact. Technol., 21(1), 2 (1988). |
5 | S. Sheng, A. Chandrakasan, R. W. Brodersen, IEEE Commun. Mag., 30(12), 64 (1992). |
6 | N. Tanaka, Y. Yoshimira, Proc. 55th Electron. Comp. Technol. Conf., 788 (2005). |
7 | W-P. Dow, C-C. Li, Y-C. Su, S-P. Shen, C-C. Huang, C. Lee, B. Hsu, S. Hsu, Electrochim. Acta, 54, 5894 (2009). DOI ScienceOn |