• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.231-231
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• 2010

현재 Cu배선 제조공정에서 전해도금은 Damascene pattern의 Cu filling에 사용되고 있는데, 우수한 특성의 전해도금을 위해서는 step coverage가 우수한 Cu seed layer가 필수적이다. 현재까지 Cu seed layer를 형성하는 방법으로는 ionized physical vapor deposition(I-PVD)이 사용되고 있는데, 22 nm 이후의 소자에서는 step coverage의 한계로 인해 완벽한 Cu filling 어려울 것으로 예상된다. 본 연구에서는 step coverage가 매우 우수한 atomic layer deposition(ALD) 방법으로 Cu seed layer를 증착하고 그 특성을 기존의 PVD 박막과 비교하였다. Ketoiminate 계열의 +2가 Cu 전구체와 $H_2$를 이용하여 ALD Cu 박막을 증착하였는데 exposure, 기판의 온도를 변화시키면서 기판별로 ALD Cu의 최적공정조건을 도출하였다. ALD Cu seed와 PVD Cu seed 위에 약 $1{\mu}m$의 Cu 박막을 전해도금한 후 박막의 두께, 비저항, 미세구조와 함께 pattern filling 특성을 비교하였다.

• 한국재료학회지
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• 제22권7호
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• 한국작물학회지
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• 제58권3호
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• pp.308-318
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• 2013

콩의 수량은 건물생산성에 비해 고온에 민감하게 반응하는 하는 형질로 알려져 있다. 따라서 본 연구는 등숙기 고온이 종실의 발달, 품질특성 및 수분흡수특성에 미치는 영향을 검토하기 위해 수행하였으며 그 결과를 요약하면 다음과 같다. 1. 등숙온도가 높을수록 백립중은 감소되었는데, 황금콩은 선유콩에 비해 감소폭이 컸고, 등숙기 지속적인 고온은 종실비대를 억제시켜 소립종의 비율이 증가될 뿐만 아니라 종피율을 감소시키는 것으로 나타났다. 2. 등숙온도가 높을수록 지방 함량 및 C/N율이 감소되고, 단백질 및 총당 함량이 증가되었으나 당의 조성으로 볼 때 단당류와 이당류는 증가되고 올리고당류는 오히려 감소되는 것으로 나타나 고온은 동화물질의 축적을 억제시키는 것으로 판단되었다. 3. 고온에서 등숙된 콩은 침지초기에 부피 및 무게의 증가가 비교적 빠르게 이루어졌으나 침지시간이 경과됨에 따라 대조구에 비해 부피 및 무게증가율이 모두 낮게 나타났고, 황금콩은 선유콩에 비해 침지에 따른 부피증가율 및 무게증가율이 상대적으로 낮았다. 4. 콩의 백립중과 종피율은 침지에 따른 종실의 부피 및 무게증가율뿐만 아니라 용출액의 TDS와 EC에 영향을 미치는 주요 형질로 판단되었고, 단백질 함량과 C/N율은 TDS 및 EC와 유의한 상관을 보였으나, 당 함량은 부피증가율과 무게증가율뿐만 아니라 TDS 및 EC와 상관이 인정되지 않았다. 5. 따라서 등숙온도가 높을수록 종실에 동화물질의 축적이 불완전하게 이루어져 침지에 따른 가용성 고형물의 용출량이 많아지고, 결과적으로 TDS 및 EC가 높아지는 것으로 판단되었다.

• 한국재료학회지
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• 제23권10호
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• pp.550-554
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• 2013

As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.

• 한국자원식물학회지
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• 제10권3호
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• pp.221-226
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• 1997

Improvement of seed protein quality might be an essential issus in soybean and would give more profit directly to both farmers and users. This study was carried out to investigate the effects of reduced-S form(s) on seed storage protein components in soybean during seed filling stages. The reduced-S forms during seed fill were sodium thiosulfate, sodium sulfite, sodium sulfide, thioaceteat, $\beta$-mercaptoethanol, thiourea, thiamine-HCI, L-cysteine, L-cystine, and L-methionine. Seed storage protein concentration did not appear to be affected by any reduced-S forms. However, glycinin and $\beta$-conglycinin concentration seemed to be changed greatly by L-methionine. This resulted in the increase in the 11S/7S ratio(3.58). Among the $\beta$-conglycinin, $\beta$-subunit was not accumulated at all. $\alpha$-subunit concentration appeared to be decreased and $\alpha'$-subunit concentration was not altered in comparison with sulfate control. Also, $\beta$-conglycine concentration, especially $\beta$-subunit concentration, tended to be decreased with L-cystine treatment, resulting in an increase in the 11S/7S ratio(1.83). The glycinin concentration tended to be increased at the expense of the decrease in the $\beta$-conglycinin concentration. Therefore, it is suggested that enhancing soybean protein quality would be achieved by improving metabolic pathways of S assimilation in soybean plants during seed filling period under sulfate-sufficient condition.

• 한국자원식물학회:학술대회논문집
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• 한국자원식물학회 2000년도 춘계임시총회 및 학술발표대회
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• pp.62-62
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• 2000

• 한국약용작물학회지
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• 제2권1호
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• pp.32-37
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• 1994

본 연구는 시호 종자를 파종했을 때 발아율이 낮고 발아 소요기간이 길어 입모확보가 문제점으로 대두되어 발아율을 향상시키고 단기(短期) 동시 발아시킬 방안을 모색하고자 시호 종자의 발아특성에 대하여 시험한 결과를 요약하면 다음과 같다. 1. 시호종자의 크기는 입경 $2.0{\sim}3.0mm$ 범위이었으며, 평균입경은 삼도시호가 3.0mm 재래시호가 3.1mm이었다. 대립종자일수록 발아기간이 짧고 발아율이 높았다. 2. 시호 종자의 선종에 알맞는 비중은 1.05로 판단되었으며 비중선에 의해 70% 이상의 발아율을 기대할 수 있었다. 3. 시호 종자의 등숙기간은 최소 60일 이상되어야 하며 80일간의 저온 층적 처리에 의해 발아율은20% 이상 증가하였다.

• 아시안잔디학회지
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• 제9권3호
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• pp.173-185
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• 1995

Hydroseeding technique is a very popular method of revegetating slope areas through the control of soil erosion and stability by seeding grasses. This study was conducted to select turfgrass species and cultivars for hydroseeding. Experiment plots were established on various soil types and environmental conditions at Singar-Ansan high-way construction site. The investigation was designed in three cutting, one back-filling and other three spare sites with various seed mixtures. Results indicated that combinations of seed mixtures influenced seed germination and rates of surface cover. In a view of long term, vegetation shifts should be influenced by characters of slopes and micro-climate conditions. Hydroseeding did not show good results on rocky slope areas. Revegetation was only going on where there had soil. The combination of seed mixture with a higher rate of perennial ryegrass had relatively good revegetation with faster germination and seedling growth. Improved turf-type tall fescue Arid ⓡ and Falcon ⓡ seemed to have good environ-mental adaptation and drought tolerance. Wild or old type cultivars showed relatively slow green-up in spring and growth rates at the next year of seeding. For the harmonious landscaping with surrounding area, the combination of native grass mixture with cool-season grasses had good results. Slow and low revegetation rate at hack-filling site seemed to be caused by the poor development of capillary tubes in sub-soil. It was shown that a high correlation between seed germination and revegetation rate, and between three-month later coverage rate and final rate. The evaluation of coverage rate after three month seems to he acceptable to decide the accomplishment of hydroseeding results on rode side slopes.

• 한국재료학회지
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• 제9권6호
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• pp.583-588
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• 1999

The characteristics of copper thin films and pattern filling capability were investigated by ECD. Prior to deposition of copper film, seed-Cu/Ta(TaN)/$SIO_2$(BPSG)/Si structure was manufactured. Copper deposition was performed with various current waveforms(DC/PC, 1~10,000Hz) and current densities(10~60 mA/$\textrm{cm}^2$) after pretreatment (Oxident removal, wetting) of seed-layer. Conformal pattern filling was performed using PC method with fast deposition rate of 6,000~8,000$\AA$/min. Heat-treated($450^{\circ}C$, 30min) copper films showed good resistivities of 1.8~2.1$\mu$$\Omega$.cm. According to the XRD analysis, (111)-preferred orientation of copper film was found in ECD-Cu/seed-Cu/Ta/$Sio_2$/Si structure. Also, we have successfully achieved to fill via holes with 0.35$\mu\textrm{m}$ width and 4:1 aspect ratio.

• 한국작물학회지
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• 제51권4호
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• pp.310-317
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• 2006

This study was conducted to investigate the influence of drought stress during the pod developing and seed filling stage on source-sink relationships of soybean (Glycine max). Drought treatments were imposed by withholding water at the full-pod stage, 19 days after flowering, and then limited watering was relieved at 15 days after the initiation of drought treatment. Soybean seed yield was reduced by 39% mainly due to decreased pod number under drought stress, but the 100-seed weight was relatively less reduced. In spite of the 15-day drought during the full-pod stage, soybean produced good seeds showing similar l00-seed weight, protein, starch and soluble sugar content to those from the well-watered. Although drought during the full-pod stage caused source limitations; i.e. accelerated leaf senescence and reduced leaf soluble sugars, it did not cause limitations of other source characteristics such as SGR and leaf starch level. This is because the reduction in size of sinks, such as pod and seed abortions compensated for source limitations, resulting in balanced source-sink as expressed by LAR and the ratio of leaf area to seed dry weight. Drought stress during the pod developing and seed filling stage did not disrupt the source-sink balance