• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1258-1263
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• 2004

The present study proposes a new structure for a heat spreader which could embody a thin thickness, any shapes and high heat flux per unit area. It is on the structure for the formation of vapor passages and the support of the case of the heat spreader. A screen mesh is used as the one. To verify the validity of the one, the heat spreader of 1.4mm and 1.6mm thickness was made with 14 mesh and 100 mesh number. In this paper, The performance test of heat spreader conducted in order to compare with the heat transfer performance of conventional heat pipe. As the results, The heat spreader has excellent cooling and heat transfer performance.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.212-213
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• 2006

BSCT(60/30/10) powder specimens were fabricated by sol-gel method and BSCT thick films were fabricated by screen-printing method. The coating and drying procedure was repeated 6 times. Then the structural properties as a function of the sintering temperature. As a result of the TG-DTA, exothermic peak was observed at around $670^{\circ}C$ due to the crystalline phase. The BSCT sintered at $1430^{\circ}C$ showed the cubic perovskite structure. The prosity and thickness of the BSCT thick films was decreased with sintering temperature. The thickness of BSCT thick films at $1420^{\circ}C$ was approximately $40{\mu}m$.

• 한국표면공학회지
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• 제49권6호
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• pp.575-579
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• 2016

The metal mesh films with thickness of 1.0, 1.5, $2.0{\mu}m$ were prepared by photolithography using Ag, Al, and Cu metals. Every metal films were showed C(111) preferred orientation and Ag showed the lowest resistivity and followed by Al and Cu. The transmittance of almost films were higher than 90%. But, the Ag film with thickness of $2.0{\mu}m$ was delaminated during photolithography process due to low adhesion. So, Cu and Ti metal films were introduced under Ag film to improve adhesion property. The Cu film showed higher adhesion properties compared to Ti film. Furthermore, the Ti films that deposited on Ag film showed higher acid resistance.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권4호
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• pp.210-218
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• 2000

For the fabrication of $YBa_2Cu_3O_x$ thick film, a substrate of $Y_2BaCuO_5$ was fabricated by adding $CeO_2$ into $Y_2BaCuO_5$ and two types of doping materials added with binder material were prepared. Each doping material was patterned on $Y_2BaCuO_5$substrate by the screen printing method and then was annealed at the temperature with a few step. It could be observed by X-ray diffraction patterns and SEM photographs that through the diffusion process of the $Y_2BaCuO_5$ and each doping material, the $YBa_2Cu_3O_x$ phase was formed. And with n additive of $CeO_2$ the thickness of formed $YBa_2Cu_3O_x$decreased. From the experiment of current limiting on thick film, the sample with thiner thickness of $YBa_2Cu_3O_x$ showed the more effective characteristics of current limiting.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.407-408
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• 2013

Thin transparent conductive oxides (TCOs) having a thickness lower than 30 nm have been widely usedin touch screen panels. However the resistivity of the TCO films significantly increases as the thickness decreases, due to the poor crystallinity at very thin thickness of TCO films. In this study, we have investigated the effect of electron beam irradiation during the sputtering on the electrical properties and transmittance of 30 nm-thick ITO films, which have a different SnO2 atomic percent, prepared by magnetron sputtering at room temperature. Fig. 1 shows the variation of resistivity of ITO films with a different SnO2 atomic percent for both the normal ITO films and electron beam irradiated ITO films. As shows in Fig. 1, the electron beam irradiation to the ITO (SnO2 weight percent 10%) films during the sputtering resulted in a significantly decreased in resistivity from $7.4{\times}10^{-4}{\Omega}-cm$ to $1.5{\times}10^{-4}{\Omega}-cm$ and it also increased in transmittance from 84% to 88% at a wavelength of 550 nm. These results can be attributed to energy transfer from electron to ad-atoms of ITO films during the electron beam irradiated sputtering, which can enhance the crystallinity of 30 nm-thick ITO films. It is strongly indicate that electron beam irradiation can greatly improve the electrical properties and transmittance of very thin ITO films for touch screen panels, flexible displays and solar cells.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2011년도 춘계학술발표대회 논문집
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• pp.116-120
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• 2011

In this paper, we studied the optimization of the screen pringting method for crystalline silicon solar cell fabrication. The 156 * 156 mm2 p-type silicon wafers with $200{\mu}m$ thickness and $0.5-3{\Omega}cm$ resistivity were used after texturing, doping, and passivation. Screen printing method is a common way to make the c-Si solar cell with low-cost and high-efficiency. We studied the optimized condition for screen printing with crystalline silicon solar cell as changing the printing direction (finger line or bus bar), finger width, and mesh angle. As a result, the screen printing with finger line direction showed higher finger height and better conversion efficiency, compared with one with bus bar direction. The experiments with various finger widths and mesh angles were also carried out. The characteristics of solar cells was obtained by measuring light current-voltage, optical microscope and electroluminescence.

• 한국분말재료학회지
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• 제18권5호
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• pp.423-429
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• 2011

Thermoelectric-thick films were fabricated by using a screen printing process of n and p-type bismuth-telluride-based pastes. The screen-printed thick films have approximately 30 ${\mu}m$ in thickness and show rough surfaces yielding an empty gap between an electrode and the thick film. The gap might result in an increase of an electrical resistivity of the fabricated thick-film-type thermoelectric module. In this study, we suggest a conductive metal coating onto the surfaces of the screen-printed paste in order to reduce the contact resistance in the module. As a result, the electrical resistivity of the thermoelectric module having a gold coating layer was significantly reduced up to 30% compared to that of a module without any metal coating. This result indicates that an introduction of conductive metal layers is effective to decrease the contact resistivity of a thick-film-typed thermoelectric module processed by screen printing.

• 한국재료학회지
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• 제28권12호
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• pp.714-718
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• 2018

Anti-reflection thin films are fabricated on glass substrates using the screen printing method. Tetra ethyl silicate(TEOS) and methyl tri methoxy silane(MTMS) are used as starting materials and buthyl carbitol acetate(BCA) and buthyl cellusolve(BC) are mixed to improve the viscosity of the solution. Anti-reflection thin films are fabricated according to the number of the screen mesh and the characteristics improve as the mesh size increases. The transmittance and reflectance of the coated thin film using 325 mesh are about 94 % and 0.43 % in the visible wavelength. The thickness and refractive index of the AR thin film are 107 nm and n = 1.26, respectively.

• Journal of the Korean Wood Science and Technology
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• 제16권1호
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• pp.21-44
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• 1988

팔만칩 및 톱밥을 보오드에 활용(活用)하기 위한 방안(方案)의 하나로, 이들의 취약한 처리(物理) 및 기계적(機械的) 성질(性質)을 개선(改善)시키기 위하여 비목질재료(非木質材料)인 폴리프로필렌망(網)을 결체(結締)하여 보오드를 제조(製造)하였다. 보오드의 제조조건(製造條件)은 비중(比重)을 0.40, 0.55, 0.70 및 0.85의 4수준으로 하고 수지첨가율(樹脂添加率)을 8%, 10%, 12% 및 14%의 4수준으로 하였으며, 망수(網數)는 1장에서 4장으로 하여 보오드를 각각 제조(製造)하였다. 이들 보오드의 물리(物理) 및 기계적(機械的) 성질(性質)은 두께팽창율(膨脹率), 휨파괴계수(破壞係數), 휨탄성계수(彈性係數), 인장강도(引張强度), 박리저항(剝離抵抗) 및 나사못보지력(保持力) 등을 측정조사(測定調査)하고 고찰(考察)하였는데 본연구(本硏究)에서 얻은 중요한 결론(結論)은 다음과 같다. 1) 지수첨가율(指數添加率)이 증가함에 따라 두께팽창율(膨脹率)은 감소(減少)하였고, press-lam 보오드는 일반성형(一般成形)보오드 보다 낮은 값을 보여 주었다. 2) 보오드의 휨파괴계수(破壞係數) 및 탄성계수(彈性系數)는 비중(比重)이 증가하였으며 press-lam 보오 드는 일반적형(一般的形)보오드보다 높은 값을 나타내었다. 망수(網數)가 증가함에 따라 휨파괴계수(破壞係數)는 증가하였고, 수지첨가율(樹脂添加率)이 증가함에 따라서도 같은 양상이 나타났으나 휨탄성계수(彈性係數)의 경우 망수(網數)에 따른 효과(效果)는 나타나지 아니하였다. 3) 비중(比重)이 증가함에 따라 보오드의 인장강도(引張强度)는 증가하였으며, 망구성(網構成)보오드는 대조보오드보다 높은 값을 나타내었다. 또 망수(網數)가 증가함에 따라서도 인장강도(引張强度)는 증가하였으며, press-lam 보오드는 일반적형(一般的形)보오드보다 높은 인장강도치(引張强度値)를 보여 주었다. 4) 보오드의 박리저항(剝離抵抗)은 비중(比重)이 증가함에 따라 증가하였으며 망(網)을 결체(結締)한 보오드는 대조보오드 보다 모두 낮은 값을 보여 주었다. 기수매구성(奇數枚構成)보오드는 우수매구성(偶數枚構成)보오드보다 낮은 박리저항치(剝離抵抗値)를 보였다. 5) 수지첨가율(樹脂添加率) 및 비중(比重)이 증가함에 따라 나사못 보지력(保持力)은 증가하였으나, 망구성(網構成)보오드와 대조보오드사이에서의 차이는 크지 아니하였다. presslam 보오드에서 팔만칩보오드의 경우 고비중(高比重)보오드가, 톱밥보오드의 경우 저비중(低比重)보오드가 각각 대조보오드보다 높은 값을 보여 주었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.125-125
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• 2011

In this study, we investigated the electrical, optical, structural, and surface properties of indium zinc oxide (IZO)/Ag/IZO multilayer electrode grown by specially designed roll-to-roll sputtering system using the flexible substrate. By the continuous roll-to-roll sputtering of the bottom IZO, Ag, and top IZO layers at room temperature, they were able to fabricate a high quality IZO/Ag/IZO multilayer electrode. At optimized conditions, the bottom IZO layer (40 nm) was deposited on a flexible substrate. After deposition of the Bottom IZO layer, Ag layer was deposited onto the bottom IZO film as a function of DC power (200~500 W). Subsequently, the top IZO layer was deposited onto the Ag layer at identical deposition conditions to the bottom IZO layer (40 nm). We investigated the characteristics of IZO/Ag/IZO multilayer electrode as a function of Ag thickness. It was found that the electrical and optical properties of IZO/Ag/IZO multilayer electrode was mainly affected thickness of the Ag layer at optimized condition. In case of IZO/Ag/IZO multilayer electrode with the Ag power (350W), it exhibited a low sheet resistance of 7.1 ohm/square and a high transparency of 86.4%. Furthermore, we fabricated the touch screen panel using the IZO/Ag/IZO multilayer electrode, which demonstrate the possibility of the IZO/Ag/IZO multilayer electrode grown by roll-to-roll sputtering system as a transparent conducting layer in the touch screen panel.