Browse > Article
http://dx.doi.org/10.3740/MRSK.2018.28.12.714

Fabrication of Anti-Reflection Thin Film by Using Screen Printing Method  

Choi, Chang-Sik (Korea Institute of Ceramic Engineering and Technology, Optic & Display Materials Center)
Nam, Jeong-Sic (Korea Institute of Ceramic Engineering and Technology, Optic & Display Materials Center)
Lee, Ji-Sun (Korea Institute of Ceramic Engineering and Technology, Optic & Display Materials Center)
Jeon, Dae-Woo (Korea Institute of Ceramic Engineering and Technology, Optic & Display Materials Center)
Lee, Young-jin (Korea Institute of Ceramic Engineering and Technology, Optic & Display Materials Center)
Bae, Hyun (Shinceramic co., ltd)
Kim, Jin-Ho (Korea Institute of Ceramic Engineering and Technology, Optic & Display Materials Center)
Publication Information
Korean Journal of Materials Research / v.28, no.12, 2018 , pp. 714-718 More about this Journal
Abstract
Anti-reflection thin films are fabricated on glass substrates using the screen printing method. Tetra ethyl silicate(TEOS) and methyl tri methoxy silane(MTMS) are used as starting materials and buthyl carbitol acetate(BCA) and buthyl cellusolve(BC) are mixed to improve the viscosity of the solution. Anti-reflection thin films are fabricated according to the number of the screen mesh and the characteristics improve as the mesh size increases. The transmittance and reflectance of the coated thin film using 325 mesh are about 94 % and 0.43 % in the visible wavelength. The thickness and refractive index of the AR thin film are 107 nm and n = 1.26, respectively.
Keywords
anti-reflection; screen printing; sol-gel; transmittance; thin film;
Citations & Related Records
연도 인용수 순위
  • Reference
1 D. chen, Sol. Energ. Mater. Sol. C, 68, 313 (2001).   DOI
2 R. Prado, G. Beobide, A. Marcaide, J. Goikoetxea and A. Aranzabe, Sol. Energ. Mater. Sol. C, 94, 1081 (2010).   DOI
3 U. Schulz, P. Munzert, R. Leitel, I. Wendling, N. Kaiser and A. Tunnermann, Opt. Express, 15, 13108 (2007).   DOI
4 G. Xu, P. Jin, M. Tazawa and K. Yoshimura, Sol. Energ. Mater. Sol. C, 83, 29 (2004).   DOI
5 D. Wan, H. L. Chen, T. C. Tseng, C. Y. Fang, Y. S. Lai and F. Y. Yeh, Adv. Funct. Mater., 20, 3064 (2010).   DOI
6 J. Y. Kim, J. S. Lee, J. H. Hwang, T. Y. Lim, M. J. Lee, S. K. Hyun and J. H. Kim, Korean J. Mater. Res., 24, 689 (2014).   DOI
7 P. Chrysicopoulou, D. Davazoglou, Chr. Trapalis and G. Kordas, Thin Solid Films, 323, 188 (1998).   DOI
8 M. A. Aegerter, R. Almedia, A. Soutar, K. Tadamaga and H. Yang, J. Sol-gel Sci. Technol., 47, 203 (2008).   DOI
9 U. Gangopadhyay, K. H. Kim, D. Mangalaraj and J. Yi, Appl. Surf. Sci., 230, 364 (2004).   DOI
10 C. S. Choi, J. S. Lee, M. J. Lee, Y. J. Lee, D. W. Jeon, B. J. Ahn and J. H. Kim, J. Korean Inst. Electr. Electron. Mater. Eng., 30, 199 (2017).
11 J. K. Park and C. Y. Kim, Korean Chem. Eng. Res., 48, 397 (2010).
12 C. Martinet, V. Paillard, A. Gagnaire and J. Joseph, J. Non-Cryst. Solids, 216, 77 (1997).   DOI
13 J. Zhao and M. A. Green, IEEE Trans. Electron Dev., 38, 1925 (1991).   DOI