• E2M - 전기 전자와 첨단 소재
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• 제9권1호
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• pp.38-43
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• 1996

A coprecipitation method was used for preparing Ca and Pt doped $SnO_2$ fine powder. Components of the powder were investigated by XPS and SIMS. Crystallite size and specific surface area were investigated by TEM, XRD, and BET analysis. $SnO_2$(Ca)/Pt based thick film devices were prepared by a screen printing technique for methane gas detection. Then sensing characteristics of the devices were investigated. As Ca and Pt added, the crystal growth of $SnO_2$ was suppressed during calcining and sintering, and the sensitivity of $SnO_2$(Ca)/Pt thick film to methane gas was enhanced. For the Pt doped $SnO_2$ fine particle, the thick film device shows sensitivity of about 83% to 2000 ppm methane gas at an operating temperature of >$400^{\circ}C$.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1529-1531
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• 2003

Thick film mechanical sensors can be categorized into four main areas piezoresistive, piezoelectric, piezocapastive and mechanic tube. In this areas, the thick film strain gage is the earliest example of a primary sensing element based on the substrates. The latest thick film sensor is used various pastes that have been specifically developed for pressure sensor application. The screen printing technique has been used to fabricate the pressure sensors on alumina substrate($Al_2O_3$). Thick film capacitive of strain sensing characteristics are reported and dielectric paste based on (Ti+Ba) materials. The electric property of dielectric paste has been studied and exhibit good properly with good gage factor comparable to piezoresistive strain gage. New piezocapacitive strain sensor was designed and tested. The output of capacitive value was good characteristics.

• 한국산업융합학회 논문집
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• 제12권4호
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• 한국의류산업학회지
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• 제6권4호
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• pp.433-439
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• 2004

Hanji costumes has four aspects that allow the creator or artist to create many variations. The pictorial effects of Hanji costumes are produced through variations in the dyes and brushes used for its application. The amount of water and texture of the Hanji mixture also influences the Hanji clothing. This effect was expressed using a dry brush technique, a dripping technique, India inks, and fragments from other Hanji works. A second aspect of Hanji clothing is the coloring effect in the Hanji costumes. The coloring is due to the fibers in the preparation mixture and the uniqueness of the dyes. The Hanji clothing was dyed various colors and patterns by dip dyeing, block dyeing, silk screens, digital printing. The third aspect of Hanji imagination in clothing is the decorative details. The details in Hanji clothing can be seen using frills, pleats, tucks and ribbons. The last variation of Hanji clothing can be expressed through crafting techniques. These techniques are the quality of paper string, cuts in the paper and paste ingredients. With Hanji cloth, it is possible to plait, roll, and crample into other flexible & useful materials.

• 한국군사과학기술학회지
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• 제13권1호
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• pp.114-119
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• 2010

There are a number of studies on chemically strengthened glass. Most of them are strengthened in molten salt bath below transformation range of glass. This research is distinguished from the aforementioned studies in that single $KNO_3$ powder was used by employing screen printing technique. In this study soda-lime-silicate(SLS) glasses for bulletproof glass application with various thicknesses were used. The maximum value of the bending strength is 791MPa heat treated at $480^{\circ}C$, which is about 4.3 times higher than the parent glass, which is the highest strength of all soda-lime glasses. In this study, it is also observed that Vickers hardness increased to $657H_v$, which is about 15% higher than the parent glass($568.7H_v$) and fracture toughness was not changed. Depth profiles measured by electron probe micro analyzer(EPMA) showed a correlation between the migrations of $K^+$ ions with bending strength of ion exchanged glasses.

• 공업화학
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• 제17권6호
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• pp.604-608
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• 2006

폴리설폰 기저층에 무기섬광체인 ZnS(Ag)를 도포시켜 방사성 오염도를 측정하는데 사용될 수 있는 고분자 복합체를 제조하였다. 복합체는 방사성 오염물과 반응하여 섬광을 일으키는 무기섬광체의 활성층과 기계적 물성을 소지하여 전체적인 안정성을 부여하며 생성된 섬광의 광자들이 원활하게 투과될 수 있도록 하는 투명층의 폴리설폰 기저층으로 이루어져 있다. 기저층에 섬광체를 포함하는 활성층의 접착은 별도의 접착제 없이 기저 고분자와 동일한 폴리설폰을 바인더로 이용하여 도포시켰으며, 도포 방법으로는 어플리케이터를 이용한 제막방법과 스크린 프린팅을 이용하는 프린팅 기법을 사용하였다. 제조된 복합체는 기저층과 활성층이 일체형을 이루며 서로 완벽하게 접착되었음을 보였다. 제막방법을 통해 이루어진 복합체는 알파선을 탐지에 적합한 검출 특성을 보였으나, 도포 후 형상변형이 일어났으며 스크린 프린팅을 통해 제조된 복합체는 알파오염물에 대한 적절한 탐지특성 및 안정된 형상을 유지하는 것으로 나타났다.

• 산업융합연구
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• 제21권9호
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• pp.33-39
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• 2023

나노 크기의 물질은 여러 기판에 코팅이 가능하며, 이 소재는 투명하며, 전도성이 있기 때문에 전자소자의 투명전극이나 전원 공급용 전극으로 활용이 가능하다. 본 연구에서는 CNT와 Ag 나노와이어를 실크스크린 기법을 이용하여 반복적으로 코팅하였으며, 5번까지 형성한 샘플을 제작하여, 광학 및 전기 특성을 측정하고, 분석하였다. 실크스크린 코팅된 샘플 표면은 코팅 방향에 의한 자국이 형성되었음을 확인하였으며, 코팅한 횟수에 따른 투과도 및 표면 저항의 경향성을 조사하였다. 코팅 횟수가 늘어남에 따라 투과도 및 표면 저항은 감소하는 경향을 나타내었다. 특히 투과도의 경우 2번과 5번에서 변화폭이 컸으며, 이러한 변화는 Ag 나노와이어 코팅에 의한 것으로 확인되었다. 또한, 700nm를 기점으로 이전 파장 영역에서는 파장에 따라 증가하는 반면 이상에서는 감소하는 경향을 보였다. 표면 저항은 1번 코팅했을 때 9Ω/cm² 에서 5번 코팅을 진행하였을 때 0.856Ω/cm² 으로 낮아졌다. 투과도와 유사하게 Ag에 의하여 저항값이 영향을 받는다는 것을 알 수 있었다. 향후 Ag 나노와이어의 Ag 농도 및 다른 방법으로 코팅하여 투명도가 높은 CNT와의 융합을 통하여 원하는 투명 전극을 구현하여 전자소자에 적용할 필요가 있다.

• 한국수소및신에너지학회논문집
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• 제17권1호
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• pp.69-74
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• 2006

Thick film $H_2$ sensors were fabricated using $SnO_2$ loaded with $Ag_2O$ and $PtO_x$. The composition that gave the highest sensitivity for $H_2$ was in the weight% ratio of $SnO_2 : PtO_x : Ag_2O$ as 93 : 1 : 6. The nano-crystalline powders of $SnO_2$ synthesized by sol-gel method were screen printed with $Ag_2O$ and $PtO_x$ on alumina substrates. The fabricated sensors were tested against gases like $H_2$, $CH_4$, $C_3H_8$, $C_2H_5OH$ and $SO_2$. The composite material was found sensitive against $H_2$ at the working temperature $130^{\circ}C$, with minor interference of other gases. The $H_2$ gas as low as 100 ppm can be detected by the present fabricated sensors. It was found that the sensors based on $SnO_2-Ag_2O-PtO_x$ system exhibited the high performance, high selectivity and very short response time to $H_2$ at ppm level. These characteristics make the sensor to be a promising candidate for detecting low concentrations of $H_2$.

• Current Photovoltaic Research
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• 제9권4호
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• pp.128-132
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• 2021

Advances in screen printing technology have been led to development of high efficiency silicon solar cells. As a post PERx structure, an n-type wafer-based rear side TOPCon structure has been actively researched for further open-circuit voltage (Voc) improvement. In the case of the metal contact of the TOPCon structure, the poly-Si thickness is very important because the passivation of the substrate will be degraded when the metal paste penetrates until substrate. However, the thin poly-Si layer has advantages in terms of current density due to reduction of parasitic absorption. Therefore, poly-Si thickness and firing temperature must be considered to optimize the metal contact of the TOPCon structure. In this paper, we varied poly-Si thickness and firing peak temperature to evaluate metal induced recombination (Jom) and contact resistivity. Jom was evaluated by using PL imaging technique which does not require both side metal contact. As a results, we realized that the SiN_x deposition conditions can affect the metal contact of the TOPCon structure.

• Advances in materials Research
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• 제2권3호
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• pp.133-140
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• 2013

This paper aims to focus on the microwave processing of thick films which is a fast, cheap technique and could be the alternative to the currently used conventional high temperature processing technique. Microwave processing has gained worldwide acceptance as a novel method for heating and sintering a variety of materials, as it offers specific advantages in terms of speed, energy efficiency, process simplicity, finer microstructures and lower environmental hazards. Silver conducting thick films were prepared and processed in the household microwave oven. The films sintered at different time period by keeping the other parameter such as microwave power, film thickness etc constant. The microstructure analysis revealed that the surface morphology of the microwave processed films become compact with respect to the processing time. The sheet resistance for microwave sintered silver films is in the range of 0.003 to $1.207{\Omega}/{\Box}$ where as the films fired at 750 and $850^{\circ}C$ showed the resistance of 0.009 and $0.003{\Omega}/{\Box}$ which can be comparable. The results revealed that the microstructure of the microwave sintered films has more uniform and compact surface than that of the conventionally fired films. The paper reports upon the preparation of silver thick film by screen printing technique and processing the same by microwave which also compared with the conventionally processed thick films.