• EDISON SW 활용 경진대회 논문집
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• 제5회(2016년)
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• pp.55-61
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• 2016

$A{\beta}_{40}$ peptides form oligomers that later aggregate into a plaque, which is deemed to be a leading cause of Alzheimer's Disease. Its non-crystalline morphology has limited an understanding of comprehensive structural study. In this research, computational biomolecular simulations were performed in the following order: solvent and ion addition in a box, energy minimization of protein, equilibration, and periodic boundary condition disaggregation of a monomer from fibril. The result founded the two-fold model is 25% more stable in the simulation environment, and the steric zippers held on most tightly until 220 ps of simulation. The study supports the previous findings that two-fold aggregate $A{\beta}_{40}$ is more stable at 310 K and discusses further how much contribution steric-zipper and hydrogen bonding are making.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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• pp.2392-2394
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• 2005

This paper presents a tuneable bandstop resonator with two possible configurations, it can be used to tune its center frequency, or it can be used to tune its bandwidth. The tuneable bandstop resonator has potential application in microwave communications receivers, where it can be used to tune out interfering signals. The proposed resonator is comb actuated, where the resonator's displacement produces different values of frequency or bandwidth, this is achieved by decoupling electromagnetic energy from a main transmission line. The proposed fabrication process for the resonator is by anodic bonding pyrex glass and tow resistivity silicon, where the comb resonator structure is patterned by deep reactive ion etching (DRIE). This paper presents the resonator and actuator design in both configurations, as well as the fabrication process intended for its development.

• 센서학회지
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• 제21권2호
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• pp.121-126
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• 2012

Piezoresistive type contact force sensor array is fabricated by (111) Silicon bulk micromachining for continuous blood pressure monitoring. Length and width of the unit sensor structure is $200{\mu}m$ and $190{\mu}m$, respectively. The gap between sensing elements is only $10{\mu}m$. To achieve wafer level packaging, the sensor structure is capped by PDMS soft cap using wafer molding and bonding process with $10{\mu}m$ alignment precision. The resistance change over contact force was measured to verify the feasibility of the proposed sensor scheme. The maximum measurement range and resolution is 900 mm Hg and 0.57 mm Hg, respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 추계학술대회 논문집 전기물성,응용부문
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• pp.251-253
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• 2002

We have fabricated a novel Vertical Trench Hall-Effect Device sensitive to the magnetic field parallel to the sensor chip surface for non-contact angular position sensing applications. The Vertical Trench Hall-Effect Device is built on SOI wafer which is produced by silicon direct bonding technology using bulk micromachining, where buried $SiO_2$ layer and surround trench define active device volume. Sensitivity up to 150 V/AT is measured.

• 센서학회지
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• 제28권3호
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• pp.152-156
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• 2019

An ultraviolet (UV) image sensor is an extremely important optoelectronic device used in scientific and medical applications because it can detect images that cannot be obtained using visible or infrared image sensors. Because photodetectors and transistors are based on different materials, conventional UV imaging devices, which have a hybrid-type structure, require additional complex processes such as a backside etching of a GaN epi-wafer and a wafer-to-wafer bonding for the fabrication of the image sensors. In this study, we developed a monolithic GaN UV passive pixel sensor (PPS) by integrating a GaN-based Schottky-barrier type transistor and a GaN UV photodetector on a wafer. Both individual devices show good electrical and photoresponse characteristics, and the fabricated UV PPS was successfully operated under UV irradiation conditions with a high on/off extinction ratio of as high as $10^3$. This integration technique of a single pixel sensor will be a breakthrough for the development of GaN-based optoelectronic integrated circuits.

• 대한약학회:학술대회논문집
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• 대한약학회 2002년도 Proceedings of the Convention of the Pharmaceutical Society of Korea Vol.2
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• pp.408.1-408.1
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• 2002

A interpolymer complexes composed of poly(acrylic acid)(PAA) and po!y(vinyl alcohol)(PVA) were prepared by template polymerization of acrylic acid in the presence of PVA for mucoadhesive drug delivery. FT -IR results showed that the PAA/PVA interpolymer complex was formed by hydrogen bonding between the carboxyl groups of PAA and the hydroxyl group of PVA. The dissolution rate or the swelling ratio of the PAA/PVA interpolymer complexes was dependent on the pH and molecular weight of PVA that was used as a template. (omitted)

• 한국정밀공학회지
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• 제28권11호
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• pp.1234-1241
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• 2011

In this work the potential, and the perspectives of the dielectric elastomer actuator are overviewed briefly. As an exemplary work, we introduce a novel contractile artificial muscle actuator based on Synthetic Elastomer(SE). SE is the name of new dielectric elastomer material we have developed and its synthesis procedures and evaluations are described in the first. The contractile artificial muscle actuator is made by stacking the actuator unit one by one along the in thickness direction and finished up by bonding the multi-stacked actuator. Its possibility for the robotic actuator is discussed and demonstrated via experiments.

• 한국지역사회생활과학회지
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• 제21권3호
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• pp.323-339
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• 2010

This study examines how family and school social capital moderate the relation between family income and academic achievement. I use the data from the Korean Educational and Employment Panel(KEEP) on the third year middle school students in 2004. Results show that higher levels of family and school social capital, as well as financial capital such as family income are more positively associated with academic achievement. In addition, family and school social capital are served as moderators of the influences of family income on academic achievement. For example, higher parental concern about children and teacher-student bonding provides an extra boost to the positive relationship between family income and student achievement. Furthermore, lower educational expectations can make the relation between income and achievement negative. These findings underscore the importance of social capital at home and at school as the alternatives to promote academic achievement. In particular, greater concern and support encouraging social capital at home and school should be directed at low-income students who are struggling with academic achievement.

• 한국심리학회지:학교
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• 제18권1호
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• pp.49-70
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• 2021

본 연구의 목적은 우리나라 남녀고등학생의 우정에 대한 경험과 인식을 탐색적으로 알아보고, 귀납적으로 우정을 개념화하는 것이었다. 이를 위해 질적 자료를 양적으로 분석하는 개념도 방법을 사용하여 우정에 대한 참여자들의 경험과 인식을 확인하고 그 내용을 시각화하였다. 브레인스토밍 과정을 통해 남학생그룹에서 93개, 여학생그룹에서 100개의 진술문을 산출하였으며, 이를 분류하고 범주화하는 작업을 통해 최종 개념도를 완성하였다. 분석결과, 남녀 집단의 최종 개념도 모두 '실제적-관념적' 측면과 '행동적-정서적' 측면의 2개 차원을 가지는 것으로 나타났다. 범주의 수는 4개로 동일했으나, 범주에 속한 진술문의 구체적 내용에는 남녀 집단에 있어 다소간 차이가 있었다. 남학생들은 우정을 행복의 원천이자, 일상을 공유하는 격 없는 사이, 그리고 감정을 공유하고 정서적인 유대를 나누며 서로 돕고 돌보는 관계로 개념화한 반면, 여학생들은 일상을 공유하는 격 없는 사이이자, 서로 돕고 돌보는 관계, 그리고 행복의 원천이자 정서적 연결과 헌신을 주고받는 관계로 인식하는 것으로 나타났다. 범주의 중요도를 살펴본 결과, 남학생은 '공감과 유대', 그리고 '행복의 원천'을 더 중요시하고, 여학생은 '돌봄과 지원'과 '격 없는 사이'를 더 중요시하는 것으로 나타나 차이를 보였다.

• Korean Chemical Engineering Research
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• 제45권5호
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• pp.466-472
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• 2007

웨이퍼 레벨(WL) 3차원(3D) 집적을 구현하기 위해 저유전체 고분자를 본딩 접착제로 이용한 웨이퍼 본딩과, 적층된 웨이퍼간 전기배선 형성을 위해 구리 다마신(damascene) 공정을 사용하는 방법을 소개한다. 이러한 방법을 이용하여 웨이퍼 레벨 3차원 칩의 특성 평가를 위해 적층된 웨이퍼간 3차원 비아(via) 고리 구조를 제작하고, 그 구조의 기계적, 전기적 특성을 연속적으로 연결된 서로 다른 크기의 비아를 통해 평가하였다. 또한, 웨이퍼간 적층을 위해 필수적인 저유전체 고분자 수지를 이용한 웨이퍼 본딩 공정의 다음과 같은 특성 평가를 수행하였다. (1) 광학 검사에 의한 본딩된 영역의 정도 평가, (2) 면도날(razor blade) 시험에 의한 본딩된 웨이퍼들의 정성적인 본딩 결합력 평가, (3) 4-점 굽힘시험(four point bending test)에 의한 본딩된 웨이퍼들의 정량적인 본딩 결합력 평가. 본 연구를 위해 4가지의 서로 다른 저유전체 고분자인 benzocyclobutene(BCB), Flare, methylsilsesquioxane(MSSQ) 그리고 parylene-N을 선정하여 웨이퍼 본딩용 수지에 대한 적합성을 검토하였고, 상기 평가 과정을 거쳐 BCB와 Flare를 1차적인 본딩용 수지로 선정하였다. 한편 BCB와 Flare를 비교해 본 결과, Flare를 이용하여 본딩된 웨이퍼들이 BCB를 이용하여 본딩된 웨이퍼보다 더 높은 본딩 결합력을 보여주지만, BCB를 이용해 본딩된 웨이퍼들은 여전히 칩 back-end-of-the-line (BEOL) 공정조건에 부합되는 본딩 결합력을 가지는 동시에 동공이 거의 없는 100%에 가까운 본딩 영역을 재현성있게 보여주기 때문에 본 연구에서는 BCB가 본딩용 수지로 더 적합하다고 판단하였다.