• Proceedings of the IEEK Conference
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• 2002.07a
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• pp.365-368
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• 2002

We investigated the influence of RTP annealing of multi-layered metal films deposited on oxides layer. Two types of oxides, BPSG and P-7205, were used as a bottom layer under multi-layered metal film. The bonding was not good in metal/BPSG/Si samples because adhesion between metal layer and BPSG oxide layer was poor by interfacial reaction during RTP annealing above 650$^{\circ}C$. On the other hand bonding was always good in metal/ P-TEOS /Si samples regardless of annealing temperature. We observed the interface between oxide and metal layers using AES and TEM. The phosphorus and oxygen profile in interface between metal and oxide layers were different in metal/BPSG/Si and metal/P-TEOS/Si samples. We have known that the properties of interface was improved in metal/BPSG/Si samples when the sample was annealed below 650$^{\circ}C$.

• Journal of Contemporary Eastern Asia
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• v.14 no.1
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• pp.5-22
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• 2015

This study examines how different uses of social network sites (SNS) and mobile phones (MP) to communicate with friends and business associates are related to the acquisition of job-related information, job mobility, and entrepreneurial intentions, using social capital as its main theoretical lens. To this end, a nationally representative, random digit dialing (RDD) survey was conducted in Singapore. Path analyses show that SNS interactions with friends are positively related to both bonding and bridging social capital. The former is linked with greater job mobility, the latter with entrepreneurship, and both are associated with more job-related information. SNS interactions with business contacts are directly positively related to job-related information and entrepreneurship. For mobile phones, interactions with friends are positively related to social capital, job information and entrepreneurship. Professional networking is associated with more bridging social capital, job information and job mobility. Bonding capital is found to be linked with greater job mobility, while bridging capital has a positive relationship with both entrepreneurship and job mobility.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.8
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• pp.607-614
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• 2007

This paper investigated that the functional group and chemical structure of additives affect ice adhesion in aqueous solutions cooling with stirring. In order to compare the effect on the ice adhesion in aqueous solutions, the functional group like carboxyl (-COOH), hydroxyl(-OH) or amine($-NH_{2}$) one were compared each other. Among the functional group, the strength of the hydrogen bonding force order is amine, hydroxyl and carboxyl one. It supports that ethylene diamine 7 mass% solution including amine group was effective to suppress the ice adhesion, though it is corrosive. Also, the ice adhesion were effectively resisted and formed lots of ice slurries in cooling experiment of 7 mass% solution of 1, 2-and 1, 3-propanediol which is different molecular structure but equal molecular weight each other.

• Journal of Internet Computing and Services
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• v.17 no.1
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• pp.83-89
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• 2016

This study aimed to examine how gender and regional differences affect the relationships between SNS use and social capital. By analyzing a large set of data from Korean teenagers, significant roles of gender and regional differences could be found. In regards to gender difference, the most notable finding was the negative effects of SNS use on bonding and bridging social capital among male teenagers. Furthermore, it was found that such negative effects of SNS use were significant particularly among urban teenagers. These findings theoretically contribute to broadening the understanding of the relationships between SNS use and social capital.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.21-26
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• 2004

In this paper, a direct method is developed to extact RF equivalent circuit of a packaged BJT without optimization. First, parasitic components of plastic package are removed from measured S-parameters using open and short package patterns. Using package do-embedded S-parameters, a direct and simple method is proposed to extract bonding wire inductance and chip pad capacitance between package lead and chip pad. The small-signal model parameters of internal BJT are next determined by Z and Y-parameter formula derived from RF equivalent circuit. The modeled S-parameters of packaged BJT agree well with measured ones, verifying the accuracy of this new extraction method.

• Structural Engineering and Mechanics
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• v.9 no.5
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• pp.505-518
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• 2000

A major cause of premature debonding of tension face plates is shear peeling (Jones et al. 1988, Swamy et al. 1989, Ziraba et al. 1994, Zhang et al. 1995), that is debonding at the plate ends that is associated with the formation of shear diagonal cracks that are caused by the action of vertical shear forces. It is shown in this paper how side plated beams are less prone to shear peeling than tension face plated beams, as the side plate automatically increases the resistance of the reinforced concrete beam to shear peeling. Tests are used to determine the increase in the shear peeling resistance that the side plates provide, and also the effect of vertical shear forces on the pure flexural peeling strength that was determined in the companion paper. Design rules are then developed to prevent premature debonding of the plate ends due to peeling and they are applied to the strengthening and stiffening of continuous reinforced concrete beams. It is shown how these design rules for side plated beams can be adapted to allow for propped and unpropped construction and the time effects of creep and shrinkage, and how side plates can be used in conjunction with tension face plates.

• Structural Engineering and Mechanics
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• v.9 no.5
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• pp.491-504
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• 2000

A convenient method for enhancing the strength and stiffness of existing reinforced concrete beams is to bond adhesively steel plates to their tension faces. However, there is a limit to the applicability of tension face plating as the tension face plates are prone to premature debonding and, furthermore, the addition of the plate reduces the ductility of the beam. An alternative approach to tension face plating is to bond adhesively steel plates to the sides of reinforced concrete beams, as side plates are less prone to debonding and can allow the beam to remain ductile. Debonding at the ends of the side plates due to flexural forces, that is flexural peeling, is studied in this paper. A fundamental mathematical model for flexural peeling is developed, which is calibrated experimentally to produce design rules for preventing premature debonding of the plate-ends due to flexural forces. In the companion paper, the effect of shear forces on flexural peeling is quantified to produce design rules that are applied to the strengthening and stiffening of continuous reinforced concrete beams.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.10
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• pp.1541-1550
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• 2001

This paper describes experimental investigations in the direct extrusion of copper clad aluminum rods through conical dies. Composite materials consist of two or more different material layers. Copper clad aluminum composite materials are being used fur economic and structural purposes and the development of an efficient production method of copper clad aluminum composite material rods by extrusion is very important, It is necessary to know the conditions in which successful uniform extrusion ,and sound cladding may be carried out without any defects in the direct extrusion. There are several variables that have an influence on determining a sound clad extrusion. In order to investigate the influence of these parameters on the hot direct extrudability of the copper clad aluminum composite material rods, the experimental study have been performed with various extrusion temperatures, extrusion ratios and semi-cone angles of die. Subsequently, the microscopic inspection of interface bonding is carried out for extruded products. By measuring hardness, along extrusion way of products, a variation of hardness has been discussed. Proportional flow state has been considered by measuring radius ratio of Cu sleeve and Al core before and after extrusion.

• Journal of Welding and Joining
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• v.29 no.4
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• pp.93-99
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• 2011

This study was performed to compare the shear strength of the bondings between stainless steel crown/direct type composite resin and stainless steel crown/indirect type composite resin. Four groups of bonding conditions were prepared. Two groups of bonding conditions were made by the indirect type composite resin system and the other two groups were made by the direct type composite resin system. The shear strength tests were carried out using universal testing machine, Model 4465 of Instron Co.. It was indicated that the bond strength values of the indirect type composite resins were higher than those of the direct type composite resins. TE-SE group was superior to the TE-ONE in indirect type resin system. These results were thought to be the high degree of the polymerization accompanied with temperature and pressure of the resin of indirect type resin. It was also found that indirect composite resin contains less amount of porosity in resin.