• Journal of Bio-Environment Control
• /
• v.18 no.3
• /
• pp.200-207
• /
• 2009

This study was conducted to analyze the variations of air temperature, relative humidity and pressure in a low pressure chamber for plant growth. The low pressure chamber was composed of an acrylic cylinder, a stainless plate, a mass flow controller, an elastomer pressure controller, a read-out-box, a vacuum pump, and sensors of air temperature, relative humidity, and pressure. The pressure leakage in the low pressure chamber was greatly affected by the material and connection method of tubes. The leakage rate in the low pressure chamber with the welding of the stainless tubes and a plate decreased by $0.21kPa{\cdot}h^{-1}$, whereas the leakage in the low pressure chamber with teflon tube and rubber O-ring was given by $1.03kPa{\cdot}h^{-1}$. Pressure in the low pressure chamber was sensitively fluctuated by the air temperature inside the chamber. An elastomer pressure controller was installed to keep the pressure in the low pressure chamber at a setting value. However, inside relative humidity at dark period increased to saturation level.. Two levels (25 and 50kPa) of pressure and two levels (500 and 1,000sccm) of mass flow rate were provided to investigate the effect of low pressure and mass flow rate on relative humidity inside the chamber. It was concluded that low setting value of pressure and high mass flow rate of mixed gas were the effective methods to control the pressure and to suppress the excessive rise of relative humidity inside the chamber.

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.36D no.5
• /
• pp.29-35
• /
• 1999

Inductively coupled plsama etching of platinum thin film was studied using $O_2$ addition to $Cl_2$/Ar gas plasma. In this study, Pt etching mechanism was investigated with Ar/$Cl_2$ /$O_2$ gas plasma by using XPS and QMS. Ion current density was measured with Ar/$Cl_2$ /$O_2$ gas plasma by using single Langmuir probe. It was confirmed by using QMS and single Langmuir probe that Cl and Ar species rapidly decreased and ion current density was also decreased with increasing $O_2$ gas ratios. These results implied that the decrease of Pt etch rate is due to the decrease of reactive species ans ion current density with increasing $O_2$ gas mixing ratios. A maximum etch rate of 150nm/min and the oxide selectivity of 2.5 were obtained at Ar/$Cl_2$ /$O_2$ flow rate of 50 seem, RF power of 600 W, dc bias voltage of 125 V, and the total pressure of 10 mTorr.

• Journal of Sensor Science and Technology
• /
• v.20 no.3
• /
• pp.207-212
• /
• 2011

In this study, pyramid structured black silicon process was developed in order to overcome disadvantages of using wet etching to texture the surface of single crystalline silicon and using grass/needle-like black silicon structure. In order to form the pyramidal black silicon structure on the silicon surface, the RIE system was modified to equip with metal-mesh on the top of head shower. The process conditions were : $SF_6/O_2$ gas flow 15/15 sccm, RF power of 200 W, pressure at 50 mTorr ~ 200 mTorr, and temperature at $5^{\circ}C$. The pressure did not affect the pyramid structure significantly. Increasing processing time increased the size of the pyramid, however, the size remained constant at 1 ${\mu}M$ ~ 2 ${\mu}M$ between 15 minutes ~ 20 minutes of processing. Pyramid structure of 1 ${\mu}M$ in size showed to have the lowest reflectivity of 7 % ~ 10 %. Also, the pyramid structure black silicon is more appropriate than the grass/needle-like black silicon when creating solar cells.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1999.07a
• /
• pp.79-79
• /
• 1999

The varous techniques for fabrication of si or metal tip as a field emission electron source have been reported due to great potential capabilities of flat panel display application. In this report, 240nm thermal oxide was initially grown at the p-type (100) (5-25 ohm-cm) 4 inch Si wafer and 310nm Si3N4 thin layer was deposited using low pressure chemical vapor deposition technique(LPCVD). The 2 micron size dot array was photolithographically patterned. The KOH anisotropic etching of the silicon substrate was utilized to provide V-groove formation. After formation of the V-groove shape, dry oxidation at 100$0^{\circ}C$ for 600 minutes was followed. In this procedure, the orientation dependent oxide growth was performed to have a etch-mask for dry etching. The thicknesses of the grown oxides on the (111) surface and on the (100) etch stop surface were found to be ~330nm and ~90nm, respectively. The reactive ion etching by 100 watt, 9 mtorr, 40 sccm Cl2 feed gas using inductively coupled plasma (ICP) system was performed in order to etch ~90nm SiO layer on the bottom of the etch stop and to etch the Si layer on the bottom. The 300 watt RF power was connected to the substrate in order to supply ~(-500)eV. The negative ion energy would enhance the directional anisotropic etching of the Cl2 RIE. After etching, remaining thickness of the oxide on the (111) was measured to be ~130nm by scanning electron microscopy.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1999.07a
• /
• pp.98-98
• /
• 1999

Highly transparent and conducting tin-doped indium oxide (ITO) films were deposited on polycarbonate substrate by ion-assited deposition. Low substrate temperature (<10$0^{\circ}C$) was maintained during deposition to prevent the polycarbonate substrate from be deformed. The influence of ion beam energy, ion current density, and tin doping, on the structural, electrical and optical properties of deposited films was investigated. Indium oxide and tin-doped indium oxide (9 wt% SnO2) sources were evaporated with assisting ionized oxygen in high vacuum chamber at a pressure of 2$\times$10-5 torr and deposition temperature was varied from room temperature to 10$0^{\circ}C$. Oxygen gas was ionized and accelerated by cold hallow-cathode type ion gun at oxygen flow rate of 1 sccm(ml/min). Ion bea potential and ion current of oxygen ions was changed from 0 to 700 V and from 0.54 to 1.62 $\mu$A. The change of microstructure of deposited films was examined by XRD and SEM. The electrical resistivity and optical transmittance were measured by four-point porbe and conventional spectrophotometer. From the results of spectrophotometer, both the refractive index and the extinction coefficient were derived.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.7
• /
• pp.414-423
• /
• 2016

In the present study, the $CuN_x-Cu-CuN_x$ layer the partial pressure ratio Cu metal of Ar and $N_2$ gas using a DC magnetron sputtering device, was generated by the In-situ method. $CuN_x$ layer was able to obtain a surface reflectance reduction effect from the advantages of the process and the external light. $CuN_x$ layer is gas partial pressure, DC the Power, the deposition time variable transmittance in response to the thickness and partial pressure ratio, the reflectance was measured. $Ar:N_2$ gas ratio 10:10(sccm), DC power 0.35 A, was derived Deposition time 90 sec optimum conditions. Thus, according to the optimal thickness and the composition ratio was derived surface reflectance of 20.75%. In addition, to derive the value of ${\Delta}$ Ra surface roughness of 0.467. It was derived $CuN_x$ band-gap energy of about 2.2 eV. Thus, to ensure a thickness and process conditions can be absorbed to maximize the light in a wavelength band in the visible light region. As a result, the implementation of the $12k{\Omega}$ base line resistance of using the Cu metal. This is, 5 inch Metal mesh TSP(L/S: $4/270{\mu}m$) is in the range of the reference operation.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.08a
• /
• pp.158-158
• /
• 2010

최근 전자산업의 발전은 형상 면에서 경박 단소화로 급속하게 진행되고 있으며, 전자소자 내부에서의 배선재료로 사용되고 있는 알루미늄(Al) 박막의 두께 역시 얇아지고 있다. 극박막 범위에서 박막의 두께 증가에 따라 전기가 잘 흐르기 시작하는 박막의 최소두께로 정의 되는 유착두께를 실시간으로 측정하는 방법을 구현하고 임의의 금속박막과 기판의 조합에 있어서 각각의 재료에 대한 유착두께를 제공함으로써 향후 미세전자소자의 제작 시 배선 재료의 선택에 대한 기초자료를 축적할 수 있다. 또한 박막의 미세구조 변화 관점에서 연구함으로써 여러 가지 금속박막에 대한 유착두께를 줄일 수 있는 방법을 도출할 수 있다. 본 연구에서는 유리 기판 위에 사진 식각 공정으로 패턴을 형성하고 패턴이 형성된 유리 기판은 스퍼터에 연결된 4 point probe에 구리 도선으로 연결한 후 DC 마그네트론 스퍼터법으로 Al, Cr, ITO, Sn을 증착하면서 실시간으로 시간에 따른 면저항을 측정하며 이 때 스퍼터 내부 진공도는 $4.6{\times}10^{-5}$까지 낮춰준 후 각각의 금속에 맞는 진공도를 설정하였다. 20.0 sccm의 Ar가스를 넣고 100 W파워로 플라즈마를 형성시켜 금속을 증착하면서 4-point probe를 이용하여 실시간으로 면저항을 측정했다. 1초 단위로 면저항을 측정한 결과 평균적으로 Al은 71초, Cr은 151초, ITO는 61초, Sn은 20초에 저항이 급격히 감소함을 알 수 있었다. 또한 저항이 급격히 감소한 시점의 박막 두께를 알기 위해Surface profiler로 박막두께를 측정한 결과 1초당 Al은 $4\;{\AA}$, Cr은 $1.7\;{\AA}$, ITO는 $2.7\;{\AA}$, Sn은 $6.7\;{\AA}$ 이었다. 실험적으로 R은 면저항, T는 증착 시간이라 할 때 Y축을 $R{\times}T^3$으로 하고 X축을 T로 설정하고 그래프로 나타내면 Y축 값이 최소값을 갖는 시점이 유착두께임을 확인하였다. 본 연구는 실시간 면저항 측정을 통한 금속박막의 전기전도 특성과 미세구조에 대한 기초자료를 제공함으로써 신기술 발전에 공헌할 것이다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.254.1-254.1
• /
• 2014

Atmospheric plasma's electron temperature is less than thermal plasma, so it is useful at bio experiment. We have investigated the optical emission spectroscopy (OES) lines by spectrometer during Atmospheric plasma bombardment onto the PBS surface by using an Ar gas flow. Also we have measured the OH radical density inside the solution induced by the Atmospheric plasma bombardment. OH radical species are appeared at 308 nm and 309 nm. Densities of OH radical species has been found to be significantly decreased versus depth of the solution from 2 mm to 6 mm. OH radical density inside the PBS is measured to be about $1.87{\times}1016cm-3$ downstream at 2 mm from the surface under optimized Ar gas flow of 200 sccm in Atmospheric plasma. Also we have investigated cell viability of lung cancer and normal cell after Atmospheric plasma treatment for fixed exposure time in 60 seconds, but different depths. We used SEM, we observed change of cell morphorogy, did experiment about FDA & PI Staining method. It is found that there is selectivity between the lung cancer and lung normal cell, in which cancer cell definitely has higher cell death ratio more than normal cell. We have investigated change of bond structure in FT-IR spectroscopy, the following peaks were observed: and intense O-H peak at 3422 cm-1 and at 2925 cm-1 corresponds to C-H stretch vibrations of methylene group.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.250.2-250.2
• /
• 2014

Currently, teeth whitening method which is applicable to dental surgery is that physician expertises give medical treatment to teeth directly dealed with a high concentration of hydrogen peroxide and carbamide peroxide. If hydrogen peroxide concentration is too high for treatment of maximized teeth whitening effect [1], it is harmful to the human body [2]. To the maximum effective and no harmful teeth whitening effect in a short period of time at home, we have observed the whitening effect using carbamide peroxide (15%) and a low-temperature atmospheric pressure plasma jet which is regulated by the Food and Drug Administration. The gas supplied conditions of the non-thermal atmospheric pressure plasma jet was with the humidified (0.6%) gas in nitrogen or air at gas flow rate of 1000 sccm. Also, the measurement of chemical species from the jet was carried out using the optical emission spectroscopy (OES), the evidence of increased reactive oxygen species compared to non-humidified plasma jet. We have found that the whitening effect of the plasma is very excellent through this experiment, when bovine teeth are treated in carbamide peroxide (15%) and water vapor (0.2 to 1%). The brightness of whitening teeth was increased up to 2 times longer in the CIE chromaticity coordinates. The colorimetric spectrometer (CM-3500d) can measure color degree of whitening effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.07a
• /
• pp.361-365
• /
• 2003

Planar Inductively Coupled Plasma (PICP) etching of InGaP was performed in $BCl_3,\;BCl_3/Ar\;and\;BCl_3/Ne$ plasmas as a function of ICP source power ($0\;{\sim}\;500\;W$), RIE chuck power ($0\;{\sim}\;150\;W$), chamber pressure ($5\;{\sim}\;15\;mTorr$) and gas composition of $BCl_3/Ar\;and\;BCl_3/Ne$. Total gas flow was fixed at 20 sccm (standard cubic centimeter per minute). Increase of ICP source power and RIE chuck power raised etch rate of InGaP, while that of chamber pressure reduced etch rate. We also found that some addition of Ar and Ne in $BCl_3$ plasma improved etch rate of InGaP. InGaP etch rate was varied from $1580\;{\AA}/min$ with pure $BC_3\;to\;2800\;{\AA}/min$ and $4700\;{\AA}/min$ with 25 % Ar and Ne addition, respectively. Other process conditions were fixed at 300 W ICP source power, 100 W RIE chuck power and 7.5 mTorr chamber pressure. SEM (scanning electron microscopy) and AFM (atomic force microscopy) data showed vertical side wall and smooth surface of InGaP at the same condition. Proper addition of noble gases Ar and Ne (less than about 50 %) in $BCl_3$ inductively coupled plasma have resulted in not only increase of etch rate but also minimum preferential loss and smooth surface morphology by ion-assisted effect.