• Journal of Industrial and Engineering Chemistry
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• v.67
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• pp.219-230
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• 2018

The present study examined a moving bed biofilm reactor (MBBR) bioreactor on a laboratory scale for simultaneous removal of atrazine, organic carbon, and nutrients from wastewater. The maximum removal efficiency of atrazine, chemical oxygen demand (COD), total phosphorus (TP) and total nitrogen (TN) were 83.57%, 90.36%, 90.74% and 87.93 respectively. Increasing salinity up to 40 g/L NaCl in influent flow could inhibit atrazine biodegradation process strongly in the MBBR reactor.Results showed that MBBR is so suitable process for efficiently biodegrading of atrazine and nitrogen removal process was based on the simultaneous nitrification-denitrification (SND) process.

• Analytical Science and Technology
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• v.21 no.5
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• pp.345-363
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• 2008

Process analytics has been already widely utilized in a large-scale continuous production line such as petroleum industries for several decades. Although the process analytics has a long history, a concept of "Process Analytical Technology (PAT)" has been rapidly adopted as a new paradigm for the process monitoring in the production process of various industries. In this review, current status and recent developments of PAT in various research bodies have been introduced, including the introduction of various types of analytical instruments, chemometrics tools, and perspectives and future applications of PAT as well as the fundamentals on PAT such as terminology and its historical background.

• ETRI Journal
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• v.37 no.2
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• Journal of Information Management
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• v.36 no.2
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• pp.73-98
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• 2005

The growing emphasis on knowledge management is given to research institutes whose work processes including R&D are mainly focused on knowledge or technology. It is due to the fact that the system integrating, sharing and generating knowledge serves as the growth engine of those institutes. This study creates the knowledge management framework based on the research process which is the key process in research institutes, and applies to POSCO Research Institute(POSRI) who is a leading institute in this domain. Practical framework and methodology are found in POSRI through systematic operation of knowledge management process.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.225-225
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• 2005

• Composites Research
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• v.33 no.6
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• pp.390-394
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• 2020

The carbon fiber has been damaged via tow spreading process for carbon fiber spread tow. The fiber damage is caused by friction between equipment and fibers or between fibers and fibers in the process of spreading. As a result, mechanical properties are decreased due to differences in process via material and equipment condition. Therefore, minimizing fiber damage have to be considered in the process. In this study, the change in carbon fiber pneumatic spreading process was observed by according to the filament count, sizing content of carbon fiber and process variables in spreading equipment (fiber tension at the beginning, air temperature in spreading zone, vacuum pressure in spreading zone). Tensile strength was evaluated using samples prepared under optimal conditions for each of the carbon fiber varieties, and mechanical properties were reduced due to damage on the carbon fiber.

• Journal of Korean Society of Water and Wastewater
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• v.34 no.6
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• pp.445-462
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• 2020

Industrial wastewater often contains a number of recalcitrant organic contaminants. These contaminants are hardly degradable by biological wastewater treatment processes, which requires a more powerful treatment method based on chemical oxidation. Advanced oxidation technology (AOT) has been extensively studied for the treatment of nonbiodegradable organics in water and wastewater. Among different AOTs developed up to date, ozonation and the Fenton process are the representative technologies that widely used in the field. Based on the traditional ozonation and the Fenton process, several modified processes have been also developed to accelerate the production of reactive radicals. This article reviews the chemistry of ozonation and the Fenton process as well as the cases of application of these two AOTs to industrial wastewater treatment. In addition, research needs to improve the cost efficiency of ozonation and the Fenton process were discussed.

• Clean Technology
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• v.20 no.4
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• pp.359-366
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• 2014

Attrition characteristics of PKM1-SU particles, $CO_2$ absorbents for pre-combustion $CO_2$ capture process, and FCC particles, catalytic particles for hydro cracking of crude oil, were investigated at high temperature and high pressure conditions. Particle attrition tests were executed at various kinds of temperature ($0-400^{\circ}C$) and pressure (0-20 bar) conditions in a cylinder type bubbling fluidized bed with 15.1 cm diameter, 120 cm height and 1 mm orifice-sparger tube. Attrited particles before and after tests were analyzed by BET, optical microscopy, and particle size analyzer. Effects of bed material height (solid inventory) and steam injection were also verified by using ASTM D5757-95, conventional attrition test method.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.864-867
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• 2002

LG Electronics developed a perfect flat color display tube which was named "FLATRON" . This tube provides ergonomic performances with perfectly flat face and innovative manufacturing process. Foil transfer is a new technology for manufacturing screen layer for Flatron. Its main features include several properties of film, releasing agent, adhesive, aluminum layer, holes after bake-out and foil transfer process. It will be used innovative and cost oriented process for FLATRON for in CRT mass production..