• Proceedings of the IEEK Conference
• /
• 2005.11a
• /
• pp.1109-1112
• /
• 2005

The software reliability is defined, and not only the relations between testing time and reliability, but also the relation between duration following failure fixing and reliability are studied in this paper. The release time making the testing cost to be minimum is determined through evaluating the cost for each condition. Also, the release time is determined depending on the conditions of the first reliability, considering the specified reliability. The optimum release time is determined by simultaneously studying two optimum release time issues that determine both the cost related time and the specified reliability related time. And, each condition and limitation are studied. The trend of the optimum time is also examined.

• The Transactions of the Korean Institute of Electrical Engineers D
• /
• v.51 no.1
• /
• pp.18-25
• /
• 2002

The software reliability is defined, and not only the relations between testing time and reliability, but also the relation between duration following failure fixing and reliability are studied in this paper. The release time making the testing cost to be minimum is determined through evaluating the cost for each condition. Also, the release time is determined depending on the conditions of the first reliability, considering the specified reliability. the optimum release time is determined by simultaneously studying two optimum release time issues that determine both the cost related time and the specified reliability related time. And, each condition and limitation are studied. The trend of the optimum time is also examined.

• Journal of Advanced Navigation Technology
• /
• v.14 no.1
• /
• pp.119-126
• /
• 2010

The software reliability growth model(SRGM) has been developed in order to estimate such reliability measures as remaining fault number, failure rate and reliability for the developing stage software. Almost of them assumed that the faults detected during testing were eventually removed. Namely, they have studied SRGM based on the assumption that the faults detected during testing were perfectly removed. The fault removing efficiency, however, is imperfect and it is widely known as so in general. It is very difficult to remove detected fault perfectly because the fault detecting is not easy and new error may be introduced during debugging and correcting. Therefore, We want to study imperfect software testing effort for the logistic testing effort which is thought to be the most adequate in this paper.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.18 no.5
• /
• pp.431-438
• /
• 2005

In this paper, we propose the built-in current testing circuit for improving reliability As the integrated CMOS circuits in a chip are increased, the testability on design and fabrication should be considered to reduce the cost of testing and to guarantee the reliability In addition, the high degree of integration makes more failures which are different from conventional static failures and introduced by the short between transistor nodes and the bridging fault. The proposed built-in current testing method is useful for detecting not only these failures but also low current level failures and faster than conventional method. In normal mode, the detecting circuit is turned off to eliminate the degradation of CUT(Circuits Under Testing). The differential input stage in detecting circuit prevents the degradation of CUT in test mode. It is expected that this circuit improves the quality of semiconductor products, the reliability and the testability.

• Journal of the Korea Society for Simulation
• /
• v.27 no.1
• /
• pp.25-32
• /
• 2018

This paper presents an efficient software reliability testing method for the model based auto-generated code and reify a dynamic test procedure. The benefits of executing the model-based each static/dynamic reliability test before the code-based static/dynamic reliability test are described. Also, The correlations of code/model based reliability test are demonstrated by using model testing tool, Model Advisor and Verification and Validation, and the code testing tool, PolySpace and LDRA. The result of reliability test is indicated in this paper.

• Proceedings of the Korean Reliability Society Conference
• /
• 2006.05a
• /
• pp.3-19
• /
• 2006

The Status quo of the reliability in China is described in this paper, a reliability surge is now spreading in China, covering the fields such as hardware, software, machinery and electronics. The reliability work in China was firstly conducted by the CEPREI Lab as far as early in the 1950s, and the reliability engineering in China has developed from the reliability of electronic products to that of machinery and non-electronic products, from hardware reliability to software reliability, from the attention to the reliability statistical test to emphasis on the reliability engineering test. Concern of Chinese companies about the reliability is the complete import of reliability engineering, the reliability testing, the software reliability and the reliability of lead-free soldering. Demonstration of reliability cases is given.

• Proceedings of the Korean Reliability Society Conference
• /
• 2000.11a
• /
• pp.87-95
• /
• 2000

The testing product is the HSU(Hydrostatic Steering Unit) installed in the armored vehicle which has the compact structure of assembly with hydraulic pump, hydraulic motor, and several hydraulic valves. There are no assesment testing code for HSU within a country because the testing code for HUS is not involved in the technical concert from USA. Therefore the testing code is developed by the dynamic analysis of the armored vehicle. By the developed testing code, the test equipment is designed, manufactured, and used to apply the assesment test.

• Journal of Advanced Engineering and Technology
• /
• v.6 no.2
• /
• pp.121-124
• /
• 2013

This paper proposed a new concept of estimating method for LED(light-emitting diode) delamination with high accuracy. Usually, The LED is composed several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in a trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost, moisture be absorbed easily and a thermal resistance be increased attendantly. As a conventional method to estimate a delamination of LEDs, a solution immersing method is usually used in a field of LED manufacturing companies or researching institutes. This method has an advantage of simplicity but it is only shown that the existence of delamination or not. In this paper, we have proposed an estimating method for LEDs delamination using the polishing and the electron microscope. New proposed method has shown the result of confirming delamination without destruction and enabled quantitative analysis for LED delamination.

• Proceedings of the Korean Fiber Society Conference
• /
• 2007.11a
• /
• pp.385-386
• /
• 2007

• International Journal of Reliability and Applications
• /
• v.10 no.1
• /
• pp.59-62
• /
• 2009

We comment on a new testing procedure for testing exponentiality against different ageing classes. We show that the proposed test is inappropriate at least for two alternatives. We point out the subtle flaw in their argument.