• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.1109-1112
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• 2005

The software reliability is defined, and not only the relations between testing time and reliability, but also the relation between duration following failure fixing and reliability are studied in this paper. The release time making the testing cost to be minimum is determined through evaluating the cost for each condition. Also, the release time is determined depending on the conditions of the first reliability, considering the specified reliability. The optimum release time is determined by simultaneously studying two optimum release time issues that determine both the cost related time and the specified reliability related time. And, each condition and limitation are studied. The trend of the optimum time is also examined.

• 대한전기학회논문지:시스템및제어부문D
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• 제51권1호
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• pp.18-25
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• 2002

The software reliability is defined, and not only the relations between testing time and reliability, but also the relation between duration following failure fixing and reliability are studied in this paper. The release time making the testing cost to be minimum is determined through evaluating the cost for each condition. Also, the release time is determined depending on the conditions of the first reliability, considering the specified reliability. the optimum release time is determined by simultaneously studying two optimum release time issues that determine both the cost related time and the specified reliability related time. And, each condition and limitation are studied. The trend of the optimum time is also examined.

• 한국항행학회논문지
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• 제14권1호
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• pp.119-126
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• 2010

지난 30여년간 개발소프트웨어의 잔여결함, 결함률 및 신뢰도와 같은 신뢰도 척도를 분석하기 위해 소프트웨어의 신뢰도 성장 모델이 개발되어 왔다. 이들 대부분은 개발중 검출되는 소프트웨어의 오류가 완벽하게 수정되는 것으로 가정하였다. 즉, 이들은 테스트중에 검출되는 오류가 완벽하게 제거되는 것을 가정하여 그들의 연구를 진행해왔던 것이다. 그러나 오류를 검출하는 것이 어려울 뿐만 아니라 그 과정에서 새로운 오류가 도입되기도 하기 때문에 오류를 완벽하게 제거하기는 대단히 어렵다. 따라서 본 논문에서는 그동안 가장 보편 타당한 것으로 평가되어 왔던 웨이불형과 비교하여 로지스틱 테스트 노력함수를 적용한 불왼전한 소프트웨어의 테스트 노력을 제안하여 연구 검토한다.

• 한국전기전자재료학회논문지
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• 제18권5호
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• pp.431-438
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• 2005

In this paper, we propose the built-in current testing circuit for improving reliability As the integrated CMOS circuits in a chip are increased, the testability on design and fabrication should be considered to reduce the cost of testing and to guarantee the reliability In addition, the high degree of integration makes more failures which are different from conventional static failures and introduced by the short between transistor nodes and the bridging fault. The proposed built-in current testing method is useful for detecting not only these failures but also low current level failures and faster than conventional method. In normal mode, the detecting circuit is turned off to eliminate the degradation of CUT(Circuits Under Testing). The differential input stage in detecting circuit prevents the degradation of CUT in test mode. It is expected that this circuit improves the quality of semiconductor products, the reliability and the testability.

• 한국시뮬레이션학회논문지
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• 제27권1호
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• pp.25-32
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• 2018

본 논문은 모델 기반 내장형 소프트웨어의 자동 생성 코드에 대한 효율적인 신뢰성 시험 절차와 구체화된 동적 시험 방안에 대해서 제시하고 있다. 모델 정적/동적 시험 각각을 코드 정적/동적 시험 전에 수행함으로서 코드 신뢰성 시험 수행의 이점이 있음을 기술하였다. 또한, 모델과 코드의 신뢰성 시험 상관관계를 모델의 경우 Model Advisor와 Verification and Validation tool, 코드의 경우 Polyspace와 LDRA를 이용하여 살펴보고 제시한 절차대로 수행한 신뢰성 시험의 결과를 보여주고 있다.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2006년도 학술발표대회 논문집
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• pp.3-19
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• 2006

The Status quo of the reliability in China is described in this paper, a reliability surge is now spreading in China, covering the fields such as hardware, software, machinery and electronics. The reliability work in China was firstly conducted by the CEPREI Lab as far as early in the 1950s, and the reliability engineering in China has developed from the reliability of electronic products to that of machinery and non-electronic products, from hardware reliability to software reliability, from the attention to the reliability statistical test to emphasis on the reliability engineering test. Concern of Chinese companies about the reliability is the complete import of reliability engineering, the reliability testing, the software reliability and the reliability of lead-free soldering. Demonstration of reliability cases is given.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2000년도 추계학술대회
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• pp.87-95
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• 2000

The testing product is the HSU(Hydrostatic Steering Unit) installed in the armored vehicle which has the compact structure of assembly with hydraulic pump, hydraulic motor, and several hydraulic valves. There are no assesment testing code for HSU within a country because the testing code for HUS is not involved in the technical concert from USA. Therefore the testing code is developed by the dynamic analysis of the armored vehicle. By the developed testing code, the test equipment is designed, manufactured, and used to apply the assesment test.

• 한국섬유공학회:학술대회논문집
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• 한국섬유공학회 2007년도 학술발표회 논문집
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• pp.385-386
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• 2007

• International Journal of Reliability and Applications
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• 제10권1호
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• pp.59-62
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• 2009

We comment on a new testing procedure for testing exponentiality against different ageing classes. We show that the proposed test is inappropriate at least for two alternatives. We point out the subtle flaw in their argument.

• 공학기술논문지
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• 제6권2호
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• pp.121-124
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• 2013

This paper proposed a new concept of estimating method for LED(light-emitting diode) delamination with high accuracy. Usually, The LED is composed several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in a trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost, moisture be absorbed easily and a thermal resistance be increased attendantly. As a conventional method to estimate a delamination of LEDs, a solution immersing method is usually used in a field of LED manufacturing companies or researching institutes. This method has an advantage of simplicity but it is only shown that the existence of delamination or not. In this paper, we have proposed an estimating method for LEDs delamination using the polishing and the electron microscope. New proposed method has shown the result of confirming delamination without destruction and enabled quantitative analysis for LED delamination.