• Journal of Construction Engineering and Project Management
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• 제1권1호
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• pp.18-23
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• 2011

Conservation of energy and fuel is the trend in smart building design. Radio Frequency Integrated Circuit (RFIC) technology is often used in temperature sensing and signal transmission to manage indoor temperature, but it is rarely applied to the shell of the building. Heat retention and poor insulation in building shells are the largest causes of high energy consumption by indoor air conditioning. Through combining RFIC technology with temperature sensors, this study will develop smart temperature information material that can be embedded in concrete. In addition to accurately evaluating the effectiveness of shell insulation material, the already-designed Building Physiology Information System can monitor long-term temperature changes, leading to smarter building health management.

• 국제학술발표논문집
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• The 4th International Conference on Construction Engineering and Project Management Organized by the University of New South Wales
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• pp.480-486
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• 2011

Conservation of energy and fuel is the trend in smart building design. Radio Frequency Integrated Circuit (RFIC) technology is often used in temperature sensing and signal transmission to manage indoor temperature, but it is rarely applied to the shell of the building. Heat retention and poor insulation in building shells are the largest causes of high energy consumption by indoor air conditioning. Through combining RFIC technology with temperature sensors, this study will develop smart temperature information material that can be embedded in concrete. In addition to accurately evaluating the effectiveness of shell insulation material, the already-designed Building Physiology Information System can monitor long-term temperature changes, leading to smarter building health management.

• ETRI Journal
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• 제33권1호
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• pp.13-17
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• 2011

A highly miniaturized on-chip $180^{\circ}$ hybrid employing periodic ground strip structure (PGSS) was realized on a silicon radio frequency integrated circuit. The PGSS was placed at the interface between $SiO_2$ film and silicon substrate, and it was electrically connected to top-side ground planes through the contacts. Owing to the short wavelength characteristic of the transmission line employing the PGSS, the on-chip $180^{\circ}$ hybrid was highly miniaturized. Concretely, the on-chip $180^{\circ}$ hybrid exhibited good radio frequency performances from 37 GHz to 55 GHz, and it was 0.325 $mm^2$, which is 19.3% of a conventional $180^{\circ}$ hybrid. The miniaturization technique proposed in this work can be also used in other fields including compound semiconducting devices, such as high electron mobility transistors, diamond field effect transistors, and light emitting diodes.

• Journal of Advanced Marine Engineering and Technology
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• 제32권2호
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• pp.330-335
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• 2008

In this study, highly miniaturized short-wavelength transmission line employing periodically perforated ground metal (PPGM) structures were developed for application to miniaturized on-chip passive component on Si RFIC. The transmission line employing PPGM structure showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PPGM structure was 57% of the conventional coplanar-type transmission line on Si Radio Frequency Integrated Circuit (RFIC) substrate. Basic characteristics of the transmission line employing PPGM structure were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components. According to the results, it was found that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.

• Journal of Advanced Marine Engineering and Technology
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• 제39권1호
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• pp.45-51
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• 2015

본 논문에서는 실리콘 RFIC 상에서 무선 통신 시스템의 소형화에의 응용을 위하여 마이크로스트립/코프레너 복합구조를 가지는 단파장 박막필름 전송선로의 RF특성에 관하여 연구하였다. 마이크로스트립/코프레너 복합구조를 가지는 박막필름 전송선로의 파장은 종래의 코프레너 선로에 비하여 단파장특성을 보여주고 있으며, 특히 10 GHz에서 파장이 6.26 mm로 종래의 코프레너 선로의 60.5 %이다. 또한 본 논문에서는 마이크로스트립/코프레너 복합구조를 가지는 박막필름 전송선로의 등가회로와 대역폭에 관하여 연구를 진행하였다. 등가회로는 단위 셀로 나타냈으며, 상기 등가회로의 각 소자들은 closed-form 수식을 통하여 이론적으로 계산하였다. 측정 결과 0 ~ 30 GHz 범위에서 계산수치와 측정수치가 유사하게 나온 것을 확인 할 수 있었다. 대역폭 계산결과 마이크로스트립/코프레너 복합구조를 가지는 박막필름 전송선로는 차단주파수가 377 GHz 이상의 광대역 특성을 보여주고 있다. 상기 결과들로부터 본 논문에서 제안한 전송선로를 이용하여 광대역 및 초소형 RF 수동소자로써 유용하게 사용될 수 있다는 것을 알 수 있었다.

• 전자공학회논문지C
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• 제36C권11호
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• pp.18-28
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• 1999

RFIC 설계를 위한 새로운 패키지(SOP, Small Outline Package) 등가 회로 모델을 제시한다. RF 영역의 패키지에서 패들(paddle)은 이상적인 그라운드(ground)로 동작하지 못하며 패들과 MMIC 다이(die) 사이의 커플링(coupling) 문제 및 손실에 의한 기생 효과로 인해 MMIC 회로에 심각한 영향을 준다. 패키지의 전기적 효과에 대한 새로운 등가 회로 모델과 파라미터(parameter) 추출 방법을 SOP 패키지를 예로 들어 제시한다. 제시한 모델의 정확성은 상용 full-wave solver와 제시한 모델을 HSPICE 시뮬레이션하여 구한 5-파라미터를 상호 비교함으로써 모델의 정확성을 평가하고 모델이 약 8㎓까지 full-wave 해석 결과와 일치함을 보인다.

• Journal of Advanced Marine Engineering and Technology
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• 제35권4호
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• pp.483-490
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• 2011

본 논문에서는 주기적 접지구조(PAGS)를 이용하여 실리콘 RFIC 반도체 기판상에 다단 임피던 스변환기를 제작 평가하였다. 제작된 임피던스변환기의 면적은 종래의 약 8.7 %인 0.026 $mm^2$이며, 8 ~ 49.5 GHz의 범위에서 양호한 RF특성을 보여주었다.

• Journal of Advanced Marine Engineering and Technology
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• 제33권4호
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• pp.562-568
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• 2009

In this paper, using the periodic ground structure (PGS), highly miniaturized branch-line coupler and impedance transformer were realized on Si radio frequency integrated circuit (RFIC). The branch-line couple exhibited good RF performance from 41.75 to 50 GHz, and its size was $0.46{\times}0.55mm^2$, which is 37 % of conventional one. The impedance transformer exhibited good RF performance from 1 to 40GHz, and its size was $0.01mm^2$, which is 6.99 % of conventional one.

• 대한전자공학회논문지TC
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• 제44권7호통권361호
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• pp.96-104
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• 2007

본 논문에서는 필드 솔버와 회로 시뮬레이션을 통한 온 칩 인덕터의 패드 및 주변 그라운드의 디임베드 방법을 설명하였으며, 필드 솔버의 결과와 회로 시뮬레이션을 통한 디임베드 방법은 각각 측정 결과와 메트리스 연산 결과와 비교하여 검증하였다. 또한 디임베드 된 인덕터의 모델을 적용한 LNA 설계하고 제작하였으며 제작한 LNA의 결과는 측정 결과와 비교하여 디임베드를 적용하였을 때 2.5GHz 이상의 대역에서 보다 측정치에 접근함을 확인하였다. 본 논문에서 제시한 회로 시뮬레이션을 통한 디임베드 방법은 다른 수동 온칩 소자의 소자값을 얻는 데 손쉽게 사용될 수 있는 방법이며 이를 적용하여 보다 정확한 RFIC(radio frequency integrated circuit) 회로 설계가 가능할 것으로 사료된다.

• Journal of Advanced Marine Engineering and Technology
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• 제32권6호
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• pp.964-973
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• 2008

In this study, a short-wavelength coplanar-type transmission line employing periodic ground structure (PGS) was developed for application to miniaturized on-chip passive component on Si Radio Frequency Integrated Circuit (RFIC). The transmission line employing PGS showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PGS structure was 57 % of the conventional coplanar-type transmission line on Si substrate. Using the theoretical analysis. basic characteristics of the transmission line employing PGS (e.g., bandwidth. loss, impedance, and resonance characteristics) were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components on silicon RFIC. According to the results. the bandwidth of the transmission line employing PGS was more than 895 GHz as long as T is less than 20${\mu}m$, and the resonance characteristic was observed in 1239 GHz, which indicates that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.