• Proceedings of the Korean Geotechical Society Conference
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• 2010.03a
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• pp.240-247
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• 2010

The soil nailing system is becoming common as reinforcement method of slope face in soil. It has application to obtain slope stability method and scaffolding system. It has some troubles when the soil nailing system is applied to the downtown because it could be invaded someone's private area. Thus, in this paper, wedge type removable soil nailing system which can easily remove deformed bar in final excavation step is developed. Field pull-out test is performed to evaluate deformed bars removal and pullout resistance characteristics. According to this result, application of Wedge Type Removable Soil Nailing System is performed.

• Korea-Australia Rheology Journal
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• v.16 no.4
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• pp.219-226
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• 2004

In this study the deformation of liquid-air interface of Newtonian or Boger fluids filled between two par­allel-plates geometry was investigated when two surfaces were separated at a constant speed. The interface between the fluid and air showed either stable or unstable deformation depending on experimental con­ditions. Repeated experiments for a wide range of experimental conditions revealed that the deformation mode could be classified into three types: 'stable region', 'fingering' and 'cavitation'. The experimental condition for the mode of deformation was plotted in a capillary number vs. Deborah number phase plane. It has been found that the elasticity of Boger fluids destabilize the interface deformation. On the other hand, the elasticity suppresses the formation and growth of cavities.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.34-36
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• 2005

Copper wire bonding is an alternative interconnection technology that serves as a viable and cost saving alternative to gold wire bonding. In this paper, ultrasonic wedge bonding with $25{\mu}m$ copper wire on Au/Ni/Cu metallization of a PCB substrate was performed at ambient temperature. The central composite design of experiment (DOE) approach was applied to optimize the copper wire wedge bonding process parameters. After that, pull test of the wedge bond was performed to study the bond strength and to find the optimum bonding parameters. SEM was used to observe the cross section of the wedge bond. The pull test results show good performance of the wedge bond. Additionally, DOE results gave the optimized parameter for both the first bond and the second bond. Cross section analysis shows a continuous interconnection between the copper wire and Au/Ni/Cu metallization. The diffusion of Cu into the Au layer was also observed.

• Proceedings of the Korean Geotechical Society Conference
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• 2008.10a
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• pp.1014-1021
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• 2008

Ground anchor should not be used in soft clay, because anchor resistance can not be guaranteed. However, there is a way to increase the capacity of anchors. The pulse powered anchor is an underreamed anchor by using high voltage electrokinetic pulse energy. In this paper, conceptual introduction of the pulse powered anchor was presented. Anchor pull-out tests were performed at the Geotechnical Experimentation Site at Sungkyunkwan University in Suwon, Korea. Data were analyzed in order to verify the performance of pulse powered anchors.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2003.05a
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• pp.116-120
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• 2003

To study the trafficability on soft and cohesive benthic terrain, a tracked vehicle model($670mm(L){\times}750mm(B_c)$) is designed and tested. The pitch and chevron angle of grouser, weight and center of gravity of vehicle, and drawbar pull force are chosen as experimental variables. Slip, sinkage and inclined angle of vehicle are picked as performance values. Strength of soil is considered as noise factor. A preliminary straight-line motion test is performed. Then, DOE(Design of Experiment) is discussed for further research.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.2
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• pp.200-206
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• 1992

The effect of fiber diameter and gauge length on pull-out test for the interfacial properties in fiber reinforced resin composites have been investigated and these results have been arranged as statistical analysis. The fiber and matrix resins used for this study were stainless steel fiber (SUS316) and carbon fiber (high strength type), epoxy and high density polyethylene resin. From this study, it has been found that shear strength are constant regardless of gauge length of pull-out test and coefficient of variation depend on fiber diameter. In addition, it has been found that the interfacial shear strength decreased with the increasing fiber diameter, and in all case, Weibull parameter (m) has approximately 1.2/C.O.V.

• Journal of the Korean Society of Safety
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• v.22 no.1 s.79
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• pp.54-60
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• 2007

This paper describes typical design and construction practice for in-situ ground reinforcement technique using improved steel pipe pressure grouting. A case history is presented to illustrate the benefit gained by application of the technique. This technique was applied to cut slopes developed in the construction of auxiliary spillway of 00 dam. Applicable conditions, method of survey, slope stability analysis and construction are given in this parer. As for the construction method, a procedure is given and the main points are the control of construction work. As a result of the pull-out test, it is shown that seel pipe nailing is particularly useful for stabilizing rock slope.

• Journal of the Korean Wood Science and Technology
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• v.43 no.1
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• pp.60-67
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• 2015

In order to evaluate the bond performance of domestic larch glulam and the glass fiber reinforced plastic (GFRP) rod, the specimen with the GFRP rod bonded-in domestic larch glulam for pull-out test was produced. The test was carried out using various specimens with different gluing depth, width of glue-line and type of adhesive. The cantilever type rahmen structure specimen with bonded-in GFRP rods was produced based on the result of pull-out test, and its moment resistance performance was compared and examined with the moment resistance performance of slotted-in steel plate specimen. As a result of the pull-out test, the most excellent bond performance was found when the insertion depth of GFRP rods was 5 times larger than the diameter of GFRP rods. When the glue-line thickness was 1 mm, the bond performance improved by 17%~29% in comparison to the bond performance in the case of the glue-line thickness of 2 mm. Also, the bonded strength of the specimen used with poly-urethane adhesive was 2.9~4.0 times greater than the bonded strength of specimen used with resorcinol adhesive. The cantilever type rahmen structure specimen with bonded-in GFRP rods showed the moment resistance performance 0.82 times lower in comparison to the slotted-in steel plate specimen used with the drift pin, but the initial stiffness was similar as 0.93 times.

• 한국도로학회:학술대회논문집
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• 2005.03a
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• pp.129-134
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• 2005

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.129-133
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• 2001

In this paper, hermetic sealing was studied fur wafer level packaging of the MEMS devices. With the flip-chip bonding method, this B-stage epoxy sealing will be profit to MEMS device sealing and further more RF-MEMS device sealing. B-stage epoxy can be cured 2-step and hermetic sealing can be obtained. After defining $500{\mu}{\textrm}{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was then aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line were maintained during the sealing process. The height of the seal-line was controlled within $\pm0.6${\mu}{\textrm}{m}$ and the strength was measured to about 20MPa by pull test. The leak rate of the epoxy was about $10^7$ cc/sec from the leak test.