• Journal of Korean Society of Industrial and Systems Engineering
• /
• 제32권4호
• /
• pp.17-24
• /
• 2009

The purpose of this research is to find the reasons of overcrowding in the emergency department of an hospital, then to shorten the total stay time of patients. The fact that main causes of the overcrowding exist in the process of the emergency department was discovered by analysis of the data. In order to improve these process, simulation model was developed by ARENA 7.0. Staff's service time, staff's organization, process ratio, and patient's waiting time were estimated in the simulation model in consideration of the decision of the patient's course of action. Several scenarios such as the simplification of the process, the setup of dedicated pathology lab, and mixed method were suggested and evaluated. Total stay time of the patients would be reduced up to 28.45%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• 제21권11호
• /
• pp.963-967
• /
• 2008

There are many factors to affect polishing performance normally in chemical mechanical polishing (CMP) process. One of the factors is a pad profile. A pad profile has not been considered as a significant factor. However, a pad profile is easily changed by conditioning process in CMP, and then changed pad profile affects polishing performance. Therefore, understanding how the pad profile is changed by conditioning process is very important. In this paper, through the simulation based on kinematic analysis, the variation of the pad profile was described in accordance with difference condition of conditioning process. A swing-arm type conditioner was applied in this simulation. A swing-arm type conditioner plays a role of generating asperities on pad surface. The conditions of conditioing process to get uniform removal were also investigated by comparing the simulation with the experiment.

• Journal of the Korean Society for Precision Engineering
• /
• 제29권4호
• /
• pp.479-486
• /
• 2012

Two of fundamental approaches that can be used to understand ion-solid interaction are Monte Carlo (MC) and Molecular Dynamic (MD) simulations. For the simplicity of simulation Monte Carlo simulation method is widely preferred. In this paper, basic consideration and algorithm of Monte Carlo simulation will be presented as well as simulation results. Sputtering caused by incident ion beam will be discussed with distribution of sputtered particles and their energy distributions. Redeposition of sputtered particles that are experienced refraction at the substrate-vacuum interface additionally presented. In addition, reflection of incident ions with reflection coefficient will be presented together with spatial and energy distributions. This Monte Carlo simulation will be useful in simulating and describing ion beam related processes such as Ion beam induced deposition/etching process, local nano-scale distribution of focused ion beam implanted ions, and ion microscope imaging process etc.

• Journal of the Korea Society for Simulation
• /
• 제3권2호
• /
• pp.57-67
• /
• 1994

For many practical and industrial optimization problems where some or all of the system components are stochastic, the objective functions cannot be represented analytically. Therefore, modeling by computer simulation is one of the most effective means of studying such complex systems. In this paper, with discussion of simulation optimization techniques, a case study in machining process for application of simulation optimization is presented. Most of optimization techniques can be classified as single-or multiple-response techniques. The optimization of single-response category, these strategies are gradient based search methods, stochastic approximate method, response surface method, and heuristic search methods. In the multiple-response category, there are basically five distinct strategies for treating the responses and finding the optimum solution. These strategies are graphical method, direct search method, constrained optimization, unconstrained optimization, and goal programming methods. The choice of the procedure to employ in simulation optimization depends on the analyst and the problem to be solved.

• Journal of the Semiconductor & Display Technology
• /
• 제6권3호
• /
• pp.25-33
• /
• 2007

A computationally efficient and accurate Monte Carlo (MC) simulator of electron beam lithography process, which is named SCNU-EBL, has been developed for semiconductor nanometer pattern design and fabrication. The simulator is composed of a MC simulation model of electron trajectory into solid targets, an Gaussian-beam exposure simulation model, and a development simulation model of photoresist using a string model. Especially for the trajectories of incident electrons into the solid targets, the inner-shell electron scattering of an target atom and its discrete energy loss with an incident electron is efficiently modeled for multi-layer resists and heterogeneous multi-layer targets. The simulator was newly applied to the development profile simulation of ZEP520 positive photoresist for NGL(Next-Generation Lithography). The simulation of ZEP520 for electron-beam nanolithography gave a reasonable agreement with the SEM experiments of ZEP520 photoresist.

• Journal of the Korea Society for Simulation
• /
• 제11권3호
• /
• pp.67-77
• /
• 2002

In this paper, a production process system simulation of the automobile relay switch manufacturing factory is studied. The status of the present production system is inspected first, and the modified model is simulated next. To inspect the effect of the process parameter change, a simulation program is developed using PROMODEL simulation software plus the EXCEL VBA and Active X Automation function. Using the developed simulation program, user can find the best production condition and alternatives on the production capacity, number of workers, and inspection status considering the defective ratio of the product. The feasibility of the new alternatives is compared with the present system using statistical method.

• Journal of the Korean Institute of Telematics and Electronics D
• /
• 제35D권3호
• /
• pp.28-38
• /
• 1998

In our paper is reported a new 3D(dimensional) trajectory split approach with greatly improved efficiency for the Monte Carlo simulation of the 3D profiles of implanted ionand point defect concentrations in single-crystal silicon. This approach has been successfully implemented in our TRICSI Monte Carlo code. Combined with the previously developed model for damage accumalation in our TRICSI code, this model allows phasically based dynamic simulation of 3D profiles over an subsequent process simulation such as diffusion modeling and simulation. A typical time saving of over 10 timeshas been achieved for 3D simulation. Our method ensures much better region aground the implanted area. For 1-D simulation, the optimized condition for trajectory split has set to 3,000 pseudoparticles with 2 split branches.

• Journal of the Korea Society for Simulation
• /
• 제7권1호
• /
• pp.15-26
• /
• 1998

In building a shell-based FMS, which is known as one of the top-down approaches in the field of factory automation, we may take a hybrid simulation into consideration. The modeling of a hybrid simulation consists of real physical entities, virtual simulation, and central clock algorithm, etc. to carry out the whole system operation. In this paper, we sow a way to construct a hybrid simulation software system in manufacturing environments. We bring in the object-oriented methodology in system design and it can contribute in dealing with a wide variety of production types and configurations. Some classes such as project, product, process, order, schedule, stage are defined. These are used and tested by implementing a specific LSI circuit assembly line process.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 한국소성가공학회 2003년도 춘계학술대회논문집
• /
• pp.262-265
• /
• 2003

In the present study, subframe was developed using hydroforming technology. The manufacturing process for subframe consists of tube bending, pre-forming and hydroforming. The effects of bending process for manufacturing hydroformed subframe were researched. And the variables of bending process were studied by FEM simulation. The bending method is rotary draw bending that is the most popular, cost-effective bending method for thin walled tubes.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 한국정밀공학회 2004년도 추계학술대회 논문집
• /
• pp.1444-1447
• /
• 2004

For the OLED evaporation process, thin film thickness uniformity is of great practical importance. In order to achieve the better thickness uniformity, geometric simulation of film thickness distribution profile is required. In this paper, a geometric modeling algorithm is introduced for process simulation of full-color OLED evaporating system. The physical fact of the evaporation process is modeled mathematically. Based on the developed method, the uniformity of the organic layer thickness can be successfully controlled.