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http://dx.doi.org/10.4313/JKEM.2008.21.11.963

A Study on Pad Profile Variation using Kinematical Analysis on Swing Arm Conditioner  

Oh, Ji-Heon (부산대학교 기계공학과 정밀기계공학 CMP LAB.)
Lee, Sang-Jik (부산대학교 기계공학과 정밀기계공학 CMP LAB.)
Lee, Ho-Jun (부산대학교 기계공학과 정밀기계공학 CMP LAB.)
Cho, Han-Chul (부산대학교 기계공학과 정밀기계공학 CMP LAB.)
Lee, Hyun-Seop (부산대학교 기계공학과 정밀기계공학 CMP LAB.)
Kim, Hyoung-Jae (한국생산기술연구원 초정밀복합가공팀)
Jeong, Hae-Do (부산대학교 기계공학과 정밀기계공학 CMP LAB.)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.21, no.11, 2008 , pp. 963-967 More about this Journal
Abstract
There are many factors to affect polishing performance normally in chemical mechanical polishing (CMP) process. One of the factors is a pad profile. A pad profile has not been considered as a significant factor. However, a pad profile is easily changed by conditioning process in CMP, and then changed pad profile affects polishing performance. Therefore, understanding how the pad profile is changed by conditioning process is very important. In this paper, through the simulation based on kinematic analysis, the variation of the pad profile was described in accordance with difference condition of conditioning process. A swing-arm type conditioner was applied in this simulation. A swing-arm type conditioner plays a role of generating asperities on pad surface. The conditions of conditioing process to get uniform removal were also investigated by comparing the simulation with the experiment.
Keywords
Swing arm conditioner; Simulation; Pad profile; Kinematic analysis;
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