• Transactions of Materials Processing
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• v.28 no.2
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• pp.63-70
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• 2019

This study investigates the effects of multi-axial diagonal forging (MADF) processing number on the microstructures of AA1100 fabricated using MADF processes. The cast AA1100 was annealed at $400^{\circ}C$ for 3hrs in $N_2$ atmosphere and cut into $25mm^3$ cubes for the MADF processes. The MADF process consist of plane forging with a thickness reduction of 30% and a diagonal forging with a diagonal forging angle of 135 degrees. In order to analyze the microstructural variations based on the number of repetitions, 1, 2, 3 and 4 cycles of the MADF process were performed. AA1100 specimens were successfully deformed without cracking of the surface for up to 4 cycles of MADF. The grain size, average misorientation and average grain orientation spread (GOS) of MADF processed materials were analyzed using EBSD technique. The results showed that MADF process effectively refined the microstructure of AA1100 with an initial average grain size of $337.4{\mu}m$. The average grain sizes of specimens which were MADF processed for 2, 3, 4 cycles were refined to be $1.9{\mu}m$, $1.6{\mu}m$, $1.4{\mu}m$, respectively. The grain refinement appeared saturated when AA1100 got MADF processed over 2 cycles. When the specimen was subjected to two or more cycles of MADF, the degree of decrease in the average grain size drastically decreased with an increase in the number of cycle due to the softening phenomena such as dynamic recovery or dynamic recrystallization during processing.

• Journal of IKEEE
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• v.26 no.3
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• pp.456-461
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• 2022

In this paper, a two-stage single-ended power amplifier (PA) with broadband gain characteristics was presented by utilizing a radio frequency (RF) transformer (TF), which is essential for a differential amplifier. The bandwidth of a PA can be improved by designing TF to have broadband characteristics and then applying it to the inter-stage matching network (IMN) of a PA. For broadband gain characteristics while maintaining the performance and area of the existing PA, an IMN was implemented on an monolithic microwave integrated circuit (MMIC) and a multi-layer printed circuit board (PCB), and the simulation results were compared. As a result of simulating the PA module designed using InGaP/GaAs HBT model, it has been confirmed that the PA employing the proposed design method has an improved fractional bandwidth of 19.8% at a center frequency of 3.3GHz, while the conventional PA showed that of 11.2%.

• Current Optics and Photonics
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• v.6 no.2
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• pp.202-211
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• 2022

In the pasteurization of escalator handrails using ultraviolet (UV) sterilizers, a combination of light distribution and escalator speed has priority over other important factors. Furthermore, since part of the escalator handrail has a curved structure, proper design is needed to improve the sterilization rate on the surfaces touched by users. In this paper, two types of sterilizers satisfying these conditions are manufactured with 275-nm UV-C LEDs, after modeling the three-dimensional (3D) structure of an escalator handrail and simulating optical distributions of UV-C irradiation on the handrail's surface according to light-emitting diode (LED) positions and reflector variations in the sterilizers. Pasteurization experiments with the UV-C LED sterilizers are conducted on six types of gram-positive and gram-negative bacteria, with exposure times of 0.2, 5, and 15 s at an actual installation distance of 20 mm. The sterilization rates for the gram-positive bacteria are 10.63% to 27.94% at 0.2 s, 89.44% to 96.30% at 5 s, and 99.64% to 99.88% at 15 s. Those for the gram-negative bacteria are 57.70% to 77.63% at 0.2 s, 98.90% to 99.49% at 5 s, and 99.88% to 99.99% at 15 s. The power consumption of the UV-C LED sterilizer is about 8 W, which can be supplied by a self-generation module instead of an external power supply.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.42-48
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• 2023

Recently, there has been an increasing demand for performance improvement and miniaturization in response to the growing variety of signals and power demands in many industries such as mobile, IoT, and automotive. As a result, there is a high demand for high-performance chips and advanced packaging technologies that can package such chips. In this context, the FOWLP process technology is a suitable technology, and this paper discusses the plasma application technologies that are being used and studied to improve the shortcomings of this process. The paper is divided into four parts, with an introduction and case studies for each of the plasma application technologies used in each part.

• Journal of Advanced Navigation Technology
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• v.27 no.6
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• pp.815-820
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• 2023

In this paper, the design method of a miniaturized chipless RFID tag using a modified bent H-shaped slot was proposed. The proposed modified bent H-shaped slot was appended on the rectangular conductor plate printed on one side of a 20 mm × 50 mm FR4 substrate with a thickness of 0.8 mm. The resonant dip frequency of the bistatic RCS for the proposed modified bent H-shaped slot was compared with the cases when the H-shaped, U-shaped slot, and bent H-shaped slots were added, respectively, on the conductor plate. The simulated resonant dip frequencies for H-shaped, U-shaped, and bent H-shaped slots were 5.907 GHz, 4.918 GHz, and 4.364 GHz, respectively. When the proposed modified bent H-shaped slot was added, the resonant dip frequency was decreased to 3.741 GHz, and, therefore, the slot length was reduced by 36.7% compared to the H-shaped slot case. Experiment results show that the resonant dip frequency of the fabricated modified bent H-shaped slot was 3.9 GHz.

• Applied Chemistry for Engineering
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• v.35 no.1
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• pp.61-65
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• 2024

The effectiveness of CuSCN as a hole injection layer in large-area organic light-emitting diodes, organic solar cells, and thin-film transistors has been well demonstrated. Therefore, in this study, the surface, optical, and electrical analyses of CuSCN were carried out according to the solution process conditions in order to propose optimized film conditions. Various CuSCN solution concentrations were prepared to determine the film surface characteristics and to determine whether the film surface affects the electrical performance of the device. When the CuSCN solution concentration was low, the CuSCN film was not formed and coated in the form of islands, and when the solution concentration was increased, the CuSCN film was formed uniformly, which contributed to improving the conductivity of the device. In addition, a hole-only device was fabricated to demonstrate the role of CuSCN as a hole transport layer.

• Journal of Advanced Navigation Technology
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• v.28 no.4
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• pp.538-543
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• 2024

In this paper, the miniaturization of a chipless RFID tag using an interdigital-capacitor-shaped slot was studied. The proposed interdigital-capacitor-shaped slot was appended on the rectangular conductor plate printed on one side of a 20 mm × 50 mm FR4 substrate with a thickness of 0.8 mm. The resonant dip frequency of the bistatic RCS for the proposed interdigital-capacitor-shaped slot was compared with the cases when the H-shaped and modified bent H-shaped slots were added, respectively, on the conductor plate. The simulated resonant dip frequencies for H-shaped and modified bent H-shaped slots were 5.907 GHz and 3.741 GHz, respectively. When the proposed interdigital-capacitor-shaped slot was added, the resonant dip frequency was decreased to 2.889 GHz, and, therefore, the slot length was reduced by 51.1% compared to the H-shaped slot case. Experiment results show that the resonant dip frequency of the fabricated nterdigital-capacitor-shaped slot was 3.07 GHz.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.26-34
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• 1998

This paper presents a characterization method for faults of circuit patterns on MCM(Multichip Module) or PCB(Printed Circuit Board) substrates with electron beams of a SEM(Scanning Electron Microscope) by inducing voltage contrast on the signal line. The experimentation employes dual potential electron beams for the fault characterization of circuit patterns with a commercial SEM without modifying its structure. The testing procedure utilizes only one electron gun for the generation of dual potential electron beams by two different accelerating voltages, one for charging electron beam which introduces the yield of secondary electron $\delta$ < 1 and the other for reading beam which introduces $\delta$ > 1. Reading beam can read open's/short's of a specific net among many test nets, simultaneously discharging during the reading process for the next step, by removing its voltage contrast. The experimental results of testing the copper signal lines on glass-epoxy substrates showed that the state of open's/short's had generated the brightness contrast due to the voltage contrast on the surface of copper conductor line, when the net had charged with charging electron beams of 7KV accelerating voltages and then read with scanning reading electron beams of 2KV accelerating voltages in 10 seconds. The experimental results with Au pads of a IC die and Au plated Cu pads of BGA substrates provided the simple test method of circuit lines with 7KV charging electron beam and 2KV reading beam. Thus the characterization method showed that we can test open and short circuits of the net nondestructively by using dual potential electron beams with one SEM gun.

• Archives of design research
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• v.15 no.4
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• pp.1-14
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• 2002

In the past, companies concentrated their efforts on developing new technologies and producing new products. But new technologies in this information age do not make difference any more comparing to other companies. In this marketing environment, a company must appeal strongly their own image to the customers' brains to make better difference than other companies do. One of the best way to make their own image in the customer's brains might be outgrowing themselves of the one-way communication such as the printed-media or broadcast-media and preparing some space such as advertisement halls or pavilions where customers and companies meet each other and make mutual communications between both of them. Therefore, we need to study systematically on the design elements in the advertisement halls or pavilions. To begin with, we should lully understand the basic idea by looking up the reference literature. We case-studied on the basic of constructive elements of advertise halls of both SAMSUNG and LG Electronics Co. The purpose of this study is to realize that we can transfer effectively the company's image to the customers only if we fully understand company's business philosophy and vision in advance to start design the advertisement hails. We should also realize that it is also important to manage systematically the company's design strategic elements' to achieve its changing goals in more logical and scientifically way.

• Korean Journal of Optics and Photonics
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• v.20 no.3
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• pp.175-181
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• 2009

Holographic lithography is one of the potential technologies for next generation lithography which can print large areas (6") as well as very fine patterns ($0.35{\mu}m$). Usually, photolithography has been developed with two target purposes. One was for LCD applications which require large areas (over 6") and micro pattern (over $1.5{\mu}m$) exposure. The other was for semiconductor applications which require small areas (1.5") and nano pattern (under $0.2{\mu}m$) exposure. However, holographic lithography can print fine patterns from $0.35{\mu}m$ to $1.5{\mu}m$ keeping the exposure area inside 6". This is one of the great advantages in order to realize high speed fine pattern photolithography. How? It is because holographic lithography is taking holographic optics instead of projection optics. A hologram mask is the key component of holographic optics, which can perform the same function as projection optics. In this paper, Surface-Relief TIR Hologram Mask technology is introduced, and enables more robust hologram masks than those previously reported that were formed in photopolymer recording materials. We describe the important parameters in the fabrication process and their optimization, and we evaluate the patterns printed from the surface-relief TIR hologram masks.