• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.19.1-19.1
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• 2010

The process of manufacturing printed electronics using printing technology is attracting attention because its process cost is lower than that of the conventional semiconductor process. This technology, which offers both a lower cost and higher productivity, can be applied in the production of organic TFT (thin film transistor), solar cell, RFID(radio frequency identification) tag, printed battery, E-paper, touch screen panel, black matrix for LCD(liquid crystal display), flexible display, and so forth. In general, in order to implement printed electronics, narrow width and gap printing, registration of multi-layer printing by several printing units, and printing accuracy of under $20\;{\mu}m$ are all required. These electronic products require high precision to the degree of tens of microns - in a large area with flexible material, and mass productivity at low cost. As such, the roll-to-roll printing process is attracting attention as a mass production system for these printed electronic devices. For the commercialization of this process, two basic electronic ink technologies, such as conductive ink and polymers, and printing equipment have to be developed. Therefore, this paper addressed basis design and test to develop fine patterning equipment employing the roll-to-roll printing equipment and electronic ink.

• 한국CDE학회논문집
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• 제9권4호
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• 한국인쇄학회지
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• 제29권1호
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• pp.35-44
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• 2011

For printed electronic paper making which is high leveled dimensional stability. The furnish which is hard wood pulp and soft wood pulp, mixed with hard and soft wood pulp is added sea algae pulp. If sea algae pulp was added 15% contents, paper which is made with hard wood pulp is increased about 28% dimensional stability and soft wood pulp is increased about 32%, dimensional stability and hard wood 30% and soft wood 70% mixed pulp is increased about 40% dimensional stability.

• Journal of electromagnetic engineering and science
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• 제4권1호
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• pp.8-12
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• 2004

In this paper, a triple-band printed dipole antenna using parasitic elements is proposed for the multiple wireless services. The proposed antenna is designed and experimentally analyzed at the bands of PCS, IMT-2000, and ISM services. To achieve triple frequency operation, the proposed antenna contains two parasitic elements, which act as additional resonators by coupling from the driving dipole antenna. From the measured results, the resonant frequencies of this antenna are 1.79 ㎓, 2.03 ㎓, and 2.41 ㎓ and the measured impedance bandwidths are 90 MHz(1760∼1850 MHz), 210 MHz(1,930∼2,130 MHz), and 30 MHz(2,400∼2,430 MHz) for VSWR<2. The measured antenna gains are 2.14 ㏈i, 0.9 ㏈i, and 0.5 ㏈i, respectively. Antenna parameters for trifle-band operation are investigated and several antenna characteristics are discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.223-224
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• 2008

Important element are low cost, high-efficiency crystalline silicon solar cells. in this paper, Will be able to contribute in low cost, high-efficiency silicon solar cells, Applies oxide/nitride passivation, produced screen-printed solar cells. and the Measures efficiency, and evaluated a justice quality oxide/nitride passivation screen-printed solar cells.

• Transactions on Electrical and Electronic Materials
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• 제13권3호
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2001년도 Proceedings ICPE 01 2001 International Conference on Power Electronics
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• pp.11-16
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• 2001

Recent publications showed that a pair of neighboring printed circuit board (PCB) windings can be used as a contactless energy transfer device. As a continued study on this area, the current paper presents the modeling, analysis, and application of the neighboring PCB windings with an emphasis on their circuit properties and device characteristics as a contactless energy transfer device. Theoretical results of the paper are confirmed with experiments on a prototype contactless energy transfer circuit that delivers 24W output power at $68\%$ efficiency through two 35mm-diameter PCB windings separated each other by 2.4mm.

• 한국전자통신학회논문지
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• 제17권6호
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• pp.1033-1038
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• 2022

본 논문에서는 3.5GHz 대역에 대해 측면 결합 선로(BCS:Broadside Coupled Striplines)에 의해 공급되는 프린트 다이폴 안테나의 설계 제작에 대해 연구하였다. 프린트 다이폴 안테나의 두 Arm(암)은 각각 기판의 양면에 있습니다. 1×2배열 안테나에 적용된 공급 균형 라인은 BCS입니다. 프린트 다이폴 안테나의 여러 파라미터 연구를 하였고, 시뮬레이션 결과는 최종 실험 데이터와 일치하였다. 실험 결과 원하는 주파수 대역에서 가장 넓은 대역폭을 나타내며 VSWR < 2.0:1 대해 28%의 대역폭을 보였다. 기존 프린트 다이폴 안테나의 단점인 협대역과 배열 시 급전선 특성을 개선할 수 있음을 알 수 있었다. 수평면 방사패턴은 전방향 특성을 보였고 최대 이득은 4.4dBi를 보였다.

• 한국표면공학회지
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• 제32권3호
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• pp.289-296
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• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• Journal of Welding and Joining
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• 제13권2호
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.