• 전자공학회논문지A
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• 제31A권3호
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• pp.28-39
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• 1994

We experimented on memory multichip modules to increase the packing density of memory devices and to improve their electrical characteristics. A 128K$\times$8bit SRAM module was made of four 32K$\times$8bit SRAM memory chips. The memory multichip module was constructed on a low-cost double sided PCB(printed circuit boared) substrate. In the process of fabricating a multichip module. we focused on the improvement of its electrical characteristics. volume, and weight by employing bare memory chips. The characteristics of the bare chip module was compared with that of the module with four packaged chips. We conducted circuit routing with a PCAD program, and found the followings: the routed area for the module with bare memory chips reduced to a quarter of that area for module with packaged memory chips. 1/8 in volume, 1/5 in weight. Signal transmission delay times calculated by using transmission line model was reduced from 0.8 nsec to 0.4 nsec only on the module board, but the coupling coefficinet was not changed. Thus, we realized that the electrical characteristics of multichip packages on PCB board be improved greatly when using bare memory chips.

• 한국재료학회지
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• 제19권11호
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• 한국재료학회지
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• 제26권4호
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

• 한국자원리싸이클링학회:학술대회논문집
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• 한국자원리싸이클링학회 2005년도 추계정기총회 및 제26회 학술발표대회 고분자리싸이클링기술 특별심포지엄
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• pp.304-307
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• 2005

Printed circuit boards (PCBs) of the printer are composed of various organic and inorganic compounds as well as metals and alloys. This study was conducted to recover valuable metals from used PCBS by physical separation and leaching. The PCBs was crushed, sieved, classified by zig zag classifier and magnetic constituents were removed by the magnetic separation. The non-magnetic constituents of sizes between 1.2 and 0.6 mm especially containing high quantity of Cu (e.g. 83% on metal base and 31% on total base) were used for the leaching experiment. The effect of the nature and concentration of acids and reaction temperature were investigated. The Cu leaching rate to 98.5% in 2M nitric acid, pulp density 100g/L, $90^{\circ}C$, 300rpm, 1hr leaching.

• 펄프종이기술
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• 제44권2호
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• pp.42-48
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• 2012

In the 21st century, the printing industry as well as the IT industry has made rapid development. However, despite these technological advancement in the printing industry, it is still harmful for the environment, the state regulation is insufficient. Therefore, we studied the printability for the existing heat-set web inks and the newly created phenol-free eco-inks. This ink was made by reacting rosin and unsaturated dibasic acid and ester reactant, ester reactant was used instead of phenol. Printability test were used in the IGT printability tester. Experimental conditions, the temperature $22.7^{\circ}C$, humidity 57% under conditions of 0.6cc of ink supply, the print speed 1m/sec, pressures were set at 250N. As results of this study, we were able to get the following conclusions. The properties of phenol-free ink is the same as the existing inks. So we are thought to improve some characteristics such as dispersion, able to replace the existing ink.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1214-1218
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• 2006

We introduced simple fabrication process for field emission devices based on carbon nanotubes (CNTs) emitters. Instead of using the ITO material as a transparent electrode, a metal (Au) with thickness of 5-20nm was used. Moreover, the ITO patterning process was eliminated by depositing metal layer, before the CNT printing process. In addition, the thin metal layer on photo resist (PR) layer was used as UV block. We fabricated the CNT field emission arrays of triode structure with simple process. And I-V characteristics of field emission arrays were measured. The maximum current density of $254{\mu}A/cm2$ was achieved when the gate and the anode voltage was kept 150V and 3000V, respectively. The distance between anode and cathode was kept constant.

• Macromolecular Research
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• 제14권4호
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• pp.430-437
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• 2006

The ultra-drawing process of an ultra high molecular weight polyethylene (UHMWPE) gel film was examined by incorporating linear low-density polyethylene (LLDPE) and $BaTiO_3$ nanoparticles. The effects of LLDPE and the draw ratios on the morphological development and mechanical properties of the nanocomposite membrane systems were investigated. By incorporating $BaTiO_3$ nanoparticles in the UHMWPE/LLDPE blend systems, the ultra-drawing process provided a highly extended, fibril structure of UHMWPE chains to form highly porous, composite membranes with well-dispersed nanoparticles. The ultra-drawing process of UHMWPE/LLDPE dry-gel films desirably dispersed the highly loaded $BaTiO_3$ nanoparticles in the porous membrane, which could be used to form multi-layered structures for electronic applications in various embedded, printed circuit board (PCB) systems.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.909-911
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• 대한의용생체공학회:의공학회지
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• 제41권5호
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• pp.179-184
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• 2020

Purpose: The purpose of this study was to evaluate the effect according to the NEX, VENC, targeted cardiac phases on the velocity measurement of 4D phase-contrast MRI. Materials and Methods: The abdominal aortic phantom was made to experiment. The working fluid was mixed with water and glycerin to mimic the density and viscosity of human blood. The inlet velocity was Reynolds number 2000. The experimental conditions were NEX 1 and 4, VENC 102 cm/s and 200 cm/s, and 10 and 15 targeted cardiac phases, respectively. The average flow rate, average velocity, maximum velocity, and cross-section area were measured. Results: As a result of the case-by-case comparison, the error rate was less than 5%. There was no significant difference (p > 0.05). Conclusion: It is expected that this result will be useful for acquiring blood flow information in clinical practice.

• 한국정밀공학회지
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• 제27권10호
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• pp.14-22
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• 2010

The most costly and time-consuming process in the fabrication of today's multi-layer circuit board is drilling interconnection holes between adjacent layers and via holes within a layer. Decreasing size of via holes being demanded and growing number of via holes per panel increase drilling costs. Component density and electronic functionality of today's multi-layer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind micro via holes, and interconnection holes. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system. In order to get optimized condition for drilling to FPCB (Flexible Printed Circuit Board), we use various drill pattern as drill step. For productivity, we investigate drill path optimization method. And for the precise drilling the thermal drift of scanner and temperature change of scan system are tested.