• Elastomers and Composites
• /
• v.44 no.4
• /
• pp.429-435
• /
• 2009

The pressure sensitive adhesives (PSA) were synthesized by soap-free emulsion polymerization of acrylic monomers such as butyl acrylate, 2-ethyl hexyl acrylate, and acrylic acid in the presence of starch as a protective colloid and copolymer. The peel strength and holding power of PSA were increased with starch contents due to the enhancement of gel content, But the initial tackiness of PSA was decreased with starch contents. The contact angle analysis of PSA indicated that the wettability was increased with starch contents owing to the increase of polarity by hydroxy group in starch. In the pH measurement of emulsion with time for biodegradability, the starch in the PSA accelerated the lowering of pH due to the formation of organic acids followed by decomposition of starch.

• Journal of the Korean Institute of Gas
• /
• v.2 no.3
• /
• pp.1-11
• /
• 1998

To increase peel strength, low temperature properties and flowability of pressure sensitive adhesives(PSA) used in a heat shrinkable sheet, these properties were evaluated by changing each components in type and content. In this study, Isobutylene-co-Isoprene Rubber (IIR) which has good wetherability was selected as a base polymer. Instead of rosin ester, petroleum resin was selected as a tackifier because of superior peel strength. By decreasing petroleum resin contents, flowability of PSA was decreased. High molecular weight of polybutene was better than low molecular weight for the peel strength of PSA. Large particle size of carbon black showed better properties than small one in peel strength and brittleness temperature. By adding calcium carbonate, the cost of compound was able to be reduced. But it must be used with carbon black.

• Journal of Adhesion and Interface
• /
• v.1 no.1
• /
• pp.15-22
• /
• 2000

To prepare acrylic type pressure-sensitive adhesive, quarter polymers were synthesized from butylacrylate (BA), 2-ethylhexylacrylate (2-EHA), methyl methacrylate (MMA), 2-hydroxyethylmethacrylate (2-HEMA). The quarter polymer was identified by FT-IR. Molecular weight was measured by Gel Pearmeation Chromatograhy. Also, viscosity, solid content and peel strength were investigated. The peel strength was $160g_f/25mm$ when the volume ratio of feed monomer to solvent was 1.3:1 and the ratio was relevant to commercial usage. The pot life of adhesive was 30 s at the 50 m/min of heat treatment rate, and it indicated that the minimum drying time was 30 s. Not only weathering resistance keep up peel strength $160{\sim}180g_f/25mm$ after 1000 h, but also no residual remains.

• Applied Chemistry for Engineering
• /
• v.34 no.5
• /
• pp.522-528
• /
• 2023

In this work, adhesive tapes were prepared for the dicing process in semiconductor manufacturing. Compounds with different numbers of photoreactive groups (f = 1 to 3) were synthesized and incorporated into acrylic copolymers to formulate UV-curable acrylic adhesives. Structural confirmation of the synthesized photoreactive compounds (f = 2 or 3) was performed using nuclear magnetic resonance (NMR) spectroscopy. The introduction of the photoreactive compounds into the acrylic adhesive was accomplished by urethane reactions, and the successful synthesis of the UV-curable acrylic adhesive was verified by Fourier transform infrared (FT-IR) measurements. To evaluate the performance of the adhesive, the peel strength was evaluated before and after UV irradiation using a silicon wafer as a substrate. The adhesive exhibited high peel strength (~2000 gf/25 mm) before UV exposure, which was significantly reduced (~5 gf/25 mm) after UV exposure. Interestingly, the adhesive containing multifunctional photoreactive compounds showed the most significant reduction in peel strength. In addition, surface residue measurements by field emission scanning electron microscopy (FE-SEM) showed minimal surface residue (~0.2%) after UV exposure. Overall, these results contribute to the understanding of the behavior of UV-curable acrylic adhesives and pave the way for potential applications in semiconductor manufacturing processes.

• Journal of Sensor Science and Technology
• /
• v.33 no.3
• /
• pp.173-178
• /
• 2024

Development of pressure sensors for harsh environments with high pressure, humidity, and temperature is essential for many applications in the aerospace, marine, and automobile industries. However, existing materials such as polymers, adhesives, and semiconductors are not suitable for these conditions and require materials that are less sensitive to the external environment. This study proposed a pressure sensor that could withstand harsh environments and had high durability and precision. The sensor comprised a piezoresistor pattern and an insulating film directly formed on a stainless-steel membrane. To achieve the highest sensitivity, a pattern design method was proposed that considered the stress distribution in a circular membrane using finite element analysis. The manufacturing process involved depositing and etching a dielectric insulating film and metal piezoresistive material, resulting in a device with high linearity and slight hysteresis in the range of a maximum of 40 atm. The simplicity and effectiveness of this sensor render it a promising candidate for various applications in extreme environments.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.28 no.12
• /
• pp.813-820
• /
• 2015

We have studied commercialization and process optimization of protective film on transparent conductive coated substrate, nano silver on flexible PET (poly ethylene terephthalate), by means of roll-to-roll micro-gravure coater. Nanosilver on flexible PET substrate is potential materials to replace ITO (indium tin oxide). Protective film is most important to maintain unique silver pattern on top of transparent PET. PSA pressure sensitive adhesives) was developed solely for nano silver on PET and protective film was successfully laminated. We have optimized all process conditions such as coating thickness, line speed and aging time & temperature via experimental design. Transparent conductive film and its protective film developed in this research are commercially available at this moment.

• Journal of Adhesion and Interface
• /
• v.2 no.2
• /
• pp.28-34
• /
• 2001

의료용 감압 접착제(PSAs)는 접착되어지는 피부가 매우 다양한 타입이 있고 그 응용범위가 다양하므로 요구되어지는 것들이 매우 까다롭다. 본 총설은 의료용 PSAs의 특이한 성질의 합성을 포함하여 1985년 이후의 주된 화학적 개발동향에 그 초점을 두고 있다. 응집력 향상으로 Hot melt형 접착제를 주로 검토할 것이다.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2005.11a
• /
• pp.377-380
• /
• 2005

Damping materials encompass a broad range of materials, including, but not limits to, pressure sensitive adhesives, epoxies, rubbers, foams, thermoplastics, enamels and mastics. Their common characteristic is that their modulus is represented by a complex quantity, possessing both a stored and dissipative energy component. Loss factor of damping material analyzed more than 2 times than rubber to 1.5 $\sim$ 2.3, could know that Damping layer has excellent attenuation performance in side of vibration reduction. Measurements of vibration using accelerometers by adhesion of Damping layer, square Plate by Separation of Damping layer is less binding of Damping layer, analyzed low loss factor and Natural Frequency by free Vibration of Square Plate.

• Korean Journal of Materials Research
• /
• v.5 no.2
• /
• pp.191-196
• /
• 1995

Self-bonding strength developed at the interface of amorphous PEEK films is highly sensitive to the processing variables(time, temperature, and pressure) during the bonding process. In order to examine the effects of these processing variables, amorphous PEEK films were bonded at various bonding conditions and the resultant interfacial bond strengths were measured using a modified single lap-shear test. Experimental results showed that the developed self-bonding strength increases with increase in bonding temperature and is directly proportional to the bonding time raised to the 1/4 power. The applied pressure seems only to produce better wetting at the beginning stage of the bonding process. Conclusively, the self-bonding of amorphous PEEK films provides a great potential for developing excellent bond strength approaching the strength of the parent material without any adhesives in structural applications.

• Applied Chemistry for Engineering
• /
• v.24 no.2
• /
• pp.148-154
• /
• 2013

UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.