• Advances in nano research
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• v.12 no.2
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• pp.151-165
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• 2022

Micro-scale serpentine structure fibers are widely used as flexible sensor in the manufacturing of micro-nano flexible electronic devices because of their outstanding non-linear mechanical properties and organizational flexibility. The use of melt electrowriting (MEW) technology, combined with the axial bending effect of the Taylor cone jet in the process, can achieve the micro-scale serpentine structure fibers. Due to the interference of the process parameters, it is still challenging to achieve the precise deposition of micro-scale and high-consistency serpentine structure fibers. In this paper, the micro-scale serpentine structure fiber is produced by MEW combined with axial bending effect. Based on the controlled deposition of MEW, applied voltage, collector speed, nozzle height and nozzle diameter are adjusted to achieve the precise deposition of micro-scale serpentine structure fibers with different morphologies in a single motion dimension. Finally, the influence mechanism of the above four parameters on the precise deposition of micro-scale serpentine fibers is explored.

• Journal of Sensor Science and Technology
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• v.25 no.5
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• pp.310-319
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• 2016

Three types of gap sensors, a capacitive gap sensor, an eddy current gap sensor, and a Hall effect gap sensor are described and evaluated through experiments for the purpose of precise gap sensing for micrometer scale movement, and a novel type of differential hall effect gap sensor is proposed. Each gap sensor is analyzed in terms of resolution and environment dependency including temperature dependency. Furthermore, a transport system for AMOLED deposition is introduced as a typical application of gap sensors, which are recently receiving considerable attention. Based on the analyses, the proposed differential Hall effect gap sensor is found to be the most suitable gap sensor for precise gap sensing, especially for application to a transport system for AMOLED deposition. The sensor shows resolution of $0.63mV/{\mu}m$ for the overall range of the gap from 0 mm to 2.5 mm, temperature dependency of $3{\mu}m/^{\circ}C$ from $20^{\circ}C$ to $30^{\circ}C$, and a monotonic characteristic for the gap between the sensor and the target.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.336-339
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• 2007

The enhanced control of OLED deposition processes by Organic Vapor Phase Deposition $(OVPD^{(R)})$ is discussed. $OVPD^{(R)}$ opens a wide space of process control parameters. It allows the accurate and individual control of deposition layer properties like morphology and precise mixing of multi component layers (co-deposition) in comparison to conventional deposition manufacturing processes like e. g. VTE (vacuum thermal evaporation).

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.312.1-312.1
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• 2016

We have deposited ZnO thin films by ultraviolet (UV) enhanced atomic layer deposition using diethylznic (DEZ) and water (H2O) as precursors with UV light. The atomic layer deposition relies on alternating dose of the precursor on the surface and subsequent chemisorption of the precursors with self-limiting growth mechanism. Though ALD is useful to deposition conformal and precise thin film, the surface reactions of the atomic layer deposition are not completed at low temperature in many cases. In this experiment, we focused on the effects of UV radiation during the ALD process on the properties of the inorganic thin films. The surface reactions were found to be complementary enough to yield uniform inorganic thin films and fully react between DEZ and H2O at the low temperature by using UV irradiation. The UV light was effective to obtain conductive ZnO film. And the stability of TFT with UV-enhanced ZnO was improved than ZnO by thermal ALD method. High conductive UV-enhanced ZnO film have the potential to applicability of the transparent electrode.

• Journal of the Korean Ceramic Society
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• v.53 no.3
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• pp.317-324
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• 2016

Continued miniaturization and increasingly exact requirements for thin film deposition in the semiconductor industry is driving the search for new effective, efficient, selective precursors and processes. The requirements of defect-free, conformal films, and precise thickness control have focused attention on atomic layer deposition (ALD). ALD precursors so far have been developed through a trial-and-error experimental approach, leveraging the expertise and tribal knowledge of individual research groups. Precursors can show significant variation in performance, depending on specific choice of co-reactant, deposition stage, and processing conditions. The chemical design space for reactive thin film precursors is enormous and there is urgent need for the development of computational approaches to help identify new ligand-metal architectures and functional co-reactants that deliver the required surface activity for next-generation thin-film deposition processes. In this paper we discuss quantum mechanical simulation (e.g. density functional theory, DFT) applied to ALD precursor reactivity and state-of-the-art automated screening approaches to assist experimental efforts leading toward optimized precursors for next-generation ALD processes.

• Journal of Powder Materials
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• v.25 no.1
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• pp.60-68
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• 2018

The design and fabrication of photoelectrochemical (PEC) electrodes for efficient water splitting is important for developing a sustainable hydrogen evolution system. Among various development approaches for PEC electrodes, the chemical vapor deposition method of atomic layer deposition (ALD), based on self-limiting surface reactions, has attracted attention because it allows precise thickness and composition control as well as conformal coating on various substrates. In this study, recent research progress in improving PEC performance using ALD coating methods is discussed, including 3D and heterojunction-structured PEC electrodes, ALD coatings of noble metals, and the use of sulfide materials as co-catalysts. The enhanced long-term stability of PEC cells by ALD-deposited protecting layers is also reviewed. ALD provides multiple routes to develop improved hydrogen evolution PEC cells.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.23.2-23.2
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• 2009

Atomic layer deposition (ALD)have been proven to be a very attractive technique for the fabrication of advanced gate dielectrics and DRAM insulators due to excellent conformality and precise control of film thickness and composition, However, one major disadvantages of ALD is its relatively low deposition rate (throughput) because the deposition rate is typically limited by the time required for purging process between the introduction of precursors. In order to improve its throughput, many efforts have been made by commercial companies, for example,the modification reactor and development of precursors. However, any promising solution has not reported to date. We developed a new concept ALD system(Lucida TM S200) with high-throughput. In this process, a continuous flow of ALD precursor and purging gas are simultaneously introduced from different locations in the ALD reactor. A cyclic ALD process is carried out by moving the wafer holder up and down. Therefore, the time required for ALD reaction cycle is determined by speed of the wafer holder and vapor pressure of precursors. We will present the operating principle of our system and results of deposition.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.591-596
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• 2002

Fused deposition(FD) modeling by Stratasys Inc., is one of the material deposition subfamilies of solid freefrom fabrication(SFF) technologies. In this process, build material in the form of a flexible filament, is heated to a semi-liquid state and extruded from a controlled deposition head onto a fixtureless table in a temperature controlled environment. The position of nozzle is computer controlled relative to the base, which allows geometric complex models to be made to precise dimensions. FDM provide what the part was directly tested by the worker. It provide believable data. This Study is identify to surface roughness by build orientation adjustment. So, the paper is the study on surface roughness by build orientation at FDM.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.387-392
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• 2001

Fused deposition(FD) modeling by Stratasys Inc., is one of the material deposition subfamilies of solid freeform fabrication(SFF) technologies. In this process, build material in the form of a flexible filament, is heated to a semi-liquid state and extruded from a robotically controlled deposition head onto a fixtureless table in a temperature controlled environment. The position of nozzle is computer controlled relative to the base, which allows geometric complex models to be made to precise dimensions. FDM provide what the part was directly tested by the worker. It provide believable data. This study is experiment on surface roughness of part at FDM

• Journal of Powder Materials
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• v.27 no.1
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• pp.63-71
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• 2020

It is necessary to fabricate uniformly dispersed nanoscale catalyst materials with high activity and long-term stability for polymer electrolyte membrane fuel cells with excellent electrochemical characteristics of the oxygen reduction reaction and hydrogen oxidation reaction. Platinum is known as the best noble metal catalyst for polymer electrolyte membrane fuel cells because of its excellent catalytic activity. However, given that Pt is expensive, considerable efforts have been made to reduce the amount of Pt loading for both anode and cathode catalysts. Meanwhile, the atomic layer deposition (ALD) method shows excellent uniformity and precise particle size controllability over the three-dimensional structure. The research progress on noble metal ALD, such as Pt, Ru, Pd, and various metal alloys, is presented in this review. ALD technology enables the development of polymer electrolyte membrane fuel cells with excellent reactivity and durability.