• Korean Journal of Food Science and Technology
• /
• v.23 no.2
• /
• pp.133-140
• /
• 1991

Weight-loss, general-appearante, yellowing, and compositions such as chlorophyll, carotenoid, vitamin C and nitrate, were studied to investigate the influence of pre-(cultivar and growing season) and post-(low-temperature and high-density polyethylene film packaging) harvest factors on the shelf-life and quality of leaf lettuce(Lactuca sativa L). Weight-loss was reduced by the treatment of high-density polyethylene film packaging, and more at $0{\sim}1^{\circ}C$ than $4{\sim}5^{\circ}C$. Leaf-lettuce grown in Winter lost less fresh weight than that grown in Autumn. In experiment on difference between cultivars, the reduction of weight-loss in 'Cheongchima' lettuce was somewhat significant than that in 'Jeokchukmyeon' lettuce. The tendency of changes in general appearance was similar to that of weight-loss. The yellowing of leaf lettuce during the storage was caused by chlorophyll degradation. Vitamin C content before the storage was 128.0 mg/100 g FW. in lettuce grown in Winter, 123.8 mg/100g FW. in that grown in Autumn, and more 'Cheongchima' lettuce than 'Jeokchukmyeon' lettuce. In all treatment, vitamin C content decreased rapidly, and this tendency was more obvious at $4{\sim}5^{\circ}C$ than $0{\sim}1^{\circ}C$. The nitrate content of 'Jeokchukmyeon' was 3812.6 ppm and that of 'Cheongchima' was 2855.6 ppm before the storage. Nitrate content decreased more at $4{\sim}5^{\circ}C$ than $0{\sim}1^{\circ}C$ during the storage.

• Proceedings of the CALSEC Conference
• /
• 2001.08a
• /
• pp.597-614
• /
• 2001

Level 0: The Marekting Buzzword : □Confusion between DMU and Visualization □Having a Mobile Data Viewer/Analyser is Anyway a Prerequisite Level 1: Digital Pre-Assembly (DPA): □Building Digital Prototype before Physical Build □Usually a job for Packaging or Prototype Teams □Usually no time Left to take Feed-back into account before Actual Build Level 2: Design in Context: □All Designers within Car Maker do Local DMU before DPA Level 3: Design in Extended Context □Design in Context Expanded to Suppliers(omitted)

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.27 no.3
• /
• pp.181-186
• /
• 2021

The research was aimed to improve pre-harvest methods to maintain marketability in postharvest coniferous lettuce. Non-woven pots or plug plates were used to generate seedlings. No difference was found in growth characteristics of lettuce grown in non-woven pots vs plug plates. Since, seedling method with non-woven pots was convenient, lettuce harvested from non-woven pots used for water dipping treatment. The quality parameters, such as fresh weight loss, SPAD value, and appearance of lettuce were investigated after harvest. The lettuce with dipping treatment inside the plastic box container showed lower weight loss, higher SPAD value and better appearance compared to those exposed to the control (non-packaging) during the storage at 2℃. The treated plant showed higher SPAD and hue angle values 21.9 and 113.8°, respectively, compared to that of 18.8 and 108.3°, in non-treated plants. Therefore, it seems that the water dipping treatment is effective for storage method to maintain freshness of the lettuce. We showed the non-woven pot growing as a convenient seedling method for packaging treatment. Further studies will be continued to improve freshness postharvest of other horticultural crops.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.28 no.3
• /
• pp.231-236
• /
• 2022

The research was aimed to improve pre-harvest methods to maintain marketability in postharvest leaf lettuce. In this study, the effect of hydroponics on the growth and post-harvest storage characteristics of 'Chongchima' lettuce grown in peat mass medium hydroponic system using a non-powered culture device or deep water culture (DWC) was evaluated. There was no difference in fresh weight, leaf number, SPAD, moisture content, and C/N ratio between peat moss growing medium hydroponic and DWC methods except plant height. It was found that lettuce cultivation by a nonpowered hydroponics method is easier than the existing DWC. The quality parameters, such as fresh weight loss, SPAD value, and general appearance of lettuce were investigated after harvest. There was no significant difference in fresh weight loss and general appearance during storage of lettuce by the hydroponics methods. However, with the increased storage time of SPAD, which is related to chlorophyll content, was slightly higher in peat moss medium hydroponic was than DWC. When crops such as lettuce are grown under favorable conditions without any agronomic abnormalities, it is suggested that post-harvest storage is not significantly affected by peat moss growing medium hydroponic and DWC.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.4
• /
• pp.69-78
• /
• 2023

With the rapid growth of artificial intelligence, the demand for semiconductors is enormously increasing everywhere. To ensure the manufacturing quality and quantity simultaneously, the importance of automatic defect detection during the packaging process has been re-visited by adapting various deep learning-based methodologies into automatic packaging defect inspection. Deep learning (DL) models require a large amount of data for training, but due to the nature of the semiconductor industry where security is important, sharing and labeling of relevant data is challenging, making it difficult for model training. In this study, we propose a new framework for securing sufficient data for DL models with fewer computing resources through a divide-and-conquer approach. The proposed method divides high-resolution images into pre-defined sub-regions and assigns conditional labels to each region, then trains individual sub-regions and boundaries with boundary loss inducing the globally coherent and seamless images. Afterwards, full-size image is reconstructed by combining divided sub-regions. The experimental results show that the images obtained through this research have high efficiency, consistency, quality, and generality.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.4
• /
• pp.61-66
• /
• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.07a
• /
• pp.127-133
• /
• 2001

Package reliability test was conducted to investigate the effect of solder composition on ball fatigue strength. The specimens are first assembled using eutectic Composition S $n_{62}$P $b_{36}$A $g_2$, S $n_{63}$P $b_{34.5}$A $g_2$S $b_{0.5}$ solder and Pre-conditioned at MRT Lv 2a and then conducted under Temperature Cycle test(TC). For each case, the ball shear strength is obtained and micro structure photos are taken. SEM and EDX are used to analyze failure mechanism. The degradation of shear strength of solder balls after reliability test is discussed.d.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.1
• /
• pp.59-64
• /
• 1999

This paper investigated optimum drying time of PCB and the relationship between humidity in PCB and solderability. As experimental results, soldering was improved with increasing drying time. The wetting time of a dry specimen was shorter about 0.2 seconds than that of a wet specimen. The wetting force was Increased by 2~4mN after drying the wet specimen. When PCB was dried over 30 minute, solder defects and tensile strength of soldered joints was optimized. Effects of drying tome of PCB on the soldering, wetting curve, soldered shape, solder ball, and tensile strength, were investigated.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.28 no.9
• /
• pp.1297-1305
• /
• 2004

Reliability of MEMS devices is receiving more attention as they are heading towards commercial production. In particular are the reliability and long-term stability of wafer level vacuum packaged MEMS gyroscope sensors subjected to cyclic mechanical stresses at high frequencies. In this study, we carried out several reliability tests such as environmental storage, fatigue, shock, and vibration, and we investigated the failure mechanisms of the anodically bonded vacuum gyroscope sensors. It was found that successful vacuum packaging could be achieved through reducing outgassing inside the cavity by deposition of titanium as well as by pre-taking process. The current gyroscope structure is found to be safe from fatigue failure for 1000 hours of operation test. The gyroscope sensor survives the drop and vibration tests without any damage, indicating robustness of the sensor. The reliability test results presented in this study demonstrate that MEMS gyroscope sensor is very close to commercialization.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.2 s.31
• /
• pp.11-16
• /
• 2004

Electronic devices are getting smaller due to integration of electronic chip, and heat generated in electronic devices can cause loss of performance and/or reliability of the devices. In this research, metals such as gold, nickel and copper are plated onto a porous membrane by electroless plating method to make an efficient micro-heatsinks. Electroless plating includes sensitization and activation steps in pre-treatment steps. A polycarbonate(PC) membrane was sensitizied, activated and deposited in each metal solution for plating. Among manufactured microfibrils, heat transfer and radiation properties of Ni-microfibril with high surface area were more effective than those of $Au^-$ and Cu-microfibril.